Composite material and heat dissipation member
US-2023126268-A1 · Apr 27, 2023 · US
US12351753B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12351753-B2 |
| Application number | US-201916970427-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2019 |
| Priority date | Feb 21, 2018 |
| Publication date | Jul 8, 2025 |
| Grant date | Jul 8, 2025 |
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A composite material includes: coated particles, each of which includes a carbon-based particle made of a carbon-based substance and a carbide layer that covers at least a part of the surface of the carbon-based particle; and a copper phase that binds the coated particles to each other, wherein the carbide layer is made of a carbide containing at least one element selected from the group consisting of Si, Ti, Zr and Hf, and the average particle size of the carbon-based particles is 1 μm or more and 100 μm or less.
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The invention claimed is: 1. A composite material manufacturing method comprising: a step of forming a laminated body by laminating a first layer and a second layer; and a step of heating the laminated body, wherein the first layer including: a first powder made of a carbon-based substance; and a second powder made of at least one of a compound containing at least one element selected from the group consisting of Si, Ti, Zr, and Hf, and an element itself selected from the group consisting of Si and Hf, wherein the first layer is formed by mixing the first powder and the second powder, and wherein when second powder is made of the compound containing the at least one element selected from the group consisting of Ti and Zr, the compound containing the at least one element selected from the group consisting of Ti and Zr is a sulfide, a nitride, a hydride, or a boride, the second layer including: a copper material consisting of Cu and inevitable impurities; and the second powder, in the heating step, the copper material being heated to a molten state under a vacuum atmosphere of 1 Pa or less, a reducing atmosphere or an inert atmosphere without pressurization, and compounded with the first powder, wherein first layer containing the first powder and the second powder, and the second layer containing the copper material and the second powder are sequentially filled in a molding die. 2. The composite material manufacturing method according to claim 1 , wherein in the step of forming the laminated body, the amount of the second powder added to the first powder is set to such a range that the mass ratio of the element relative to the total amount of C and the element is 0.1% by mass or more and 15% by mass or less, and the amount of the second powder added to the copper material is set to such a range that the mass ratio of the element relative to the total amount of Cu and the element is 0.1% by mass or more and 1% by mass or less. 3. The composite material manufacturing method according to claim 1 , wherein the copper material includes a small piece made of oxygen-free copper having an oxygen concentration of 10 ppm or less by mass. 4. The composite material manufacturing method according to claim 1 , wherein the second powder is added to the first powder. 5. The composite material manufacturing method according to claim 1 , wherein the second powder is made of the compound containing the at least one element selected from the group consisting of Si, Ti, Zr, and Hf. 6. The composite material manufacturing method according to claim 5 , wherein wherein when second powder is made of the compound containing the at least one element selected from the group consisting of Si, Ti, Zr, and Hf, the compound containing the at least one element selected from the group consisting of Si, Ti, Zr, and Hf is a sulfide, a nitride, a hydride, or a boride.
characterised by their materials · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
Solid materials, e.g. powdery or granular · CPC title
Non-metallic particles coated with metal · CPC title
Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title
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