Thermally conductive silicone composition, production method thereof, and semiconductor device
US-12104113-B2 · Oct 1, 2024 · US
US2016186031A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016186031-A1 |
| Application number | US-201414562942-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 8, 2014 |
| Priority date | Dec 8, 2014 |
| Publication date | Jun 30, 2016 |
| Grant date | — |
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A carbon composite comprises a binder and carbon microstructures having interstitial spaces among the carbon microstructures and voids within carbon microstructures; wherein the binder is disposed in the interstitial spaces among the carbon microstructures and the voids within the carbon microstructures. Alternatively, a carbon composite comprises carbon microstructures and a binder disposed in the interstitial spaces among the carbon microstructures, wherein the carbon microstructures comprise less than about 15 volume percent of voids within the carbon microstructures based on the total volume of the carbon microstructures.
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What is claimed is: 1 . A carbon composite comprising a binder and carbon microstructures having interstitial spaces among the carbon microstructures and voids within carbon microstructures; wherein the binder is disposed in the interstitial spaces among the carbon microstructures and the voids within the carbon microstructures. 2 . The carbon composite of claim 1 , wherein the binder comprises one or more of the following: a metal; or an alloy of the metal; and wherein the metal is one or more of the following: aluminum; copper; titanium; nickel; tungsten; chromium; iron; manganese; zirconium; hafnium; vanadium; niobium; molybdenum; tin; bismuth; antimony; lead; cadmium; or selenium. 3 . A carbon composite comprising carbon microstructures and a binder disposed in interstitial spaces among the carbon microstructures, wherein the carbon microstructures comprise less than about 15 volume percent of voids within the carbon microstructures based on the total volume of the carbon microstructures. 4 . The carbon composition of claim 3 , wherein the carbon microstructures comprises less than about 5 wt. % of the binder within the carbon microstructures. 5 . The carbon composite of claim 1 , wherein the carbon microstructures comprise microstructures of one or more of the following: expanded graphite; expandable graphite; natural graphite; or synthetic graphite. 6 . The carbon composite of claim 5 , wherein the carbon microstructures comprise microstructures of expanded graphite. 7 . The carbon composite of claim 1 , wherein the interstitial spaces among the carbon microstructures have a size of about 0.1 micron to about 100 microns. 8 . The carbon composite of claim 1 , wherein the voids within the carbon microstructures has a size of about 20 nanometers to about 1 micron. 9 . The carbon composite of claim 1 , wherein the binder occupies about 50% to about 90% of the interstitial spaces among the carbon microstructures, and wherein the binder fills about 10% to about 90% of the voids within the carbon microstructures. 10 . The carbon composite of claim 1 , wherein the carbon composite comprises at least two carbon microstructures and a binding phase disposed between the at least two carbon microstructures; and wherein the binding phase comprises the binder. 11 . The carbon composite of claim 10 , wherein the binding phase comprises a binder layer and an interface layer bonding one of the at least two carbon microstructures to the binder layer; and wherein the interface layer comprises one or more of the following: a C-metal bond; a C—O-metal bond; or a metal carbon solution. 12 . The carbon composite of claim 1 , wherein the composite is in the form of a bar, block, sheet, tubular, cylindrical billet, toroid, powder, or pellets. 13 . A sheet comprising the carbon composite of claim 1 , wherein the sheet has a thickness of about 10 μm to about 10 cm. 14 . An article comprising the composition of claim 1 . 15 . An article comprising the composition of claim 3 . 16 . The article of claim 14 , wherein the article is a heat release or exchange element. 17 . The article of claim 16 , wherein the article is a heat sink; a cooling system; a heating radiating component; or a heat exchanger. 18 . The article of claim 14 , wherein the article is a downhole element. 19 . A method of manufacturing a carbon composite, the method comprising: depositing a binder in interstitial spaces within carbon microstructures and voids among carbon microstructures to provide a filled composition; and compressing the filled composition at a temperature of about 350° C. to about 1400° C. and a pressure of about 500 psi to about 30,000 psi to form the carbon composite. 20 . The method of claim 19 , wherein the depositing comprises physical vapor deposition, chemical vapor deposition, atomic layer deposition, laser vapor deposition, or plasma-assisted vapor deposition. 21 . The method of claim 19 , wherein the binder has a size of about 0.05 to about 250 microns. 22 . The method of claim 19 , wherein the compressing is conducted in a mold to form a bar, block, sheet, tubular, cylindrical billet, or toroid comprising the carbon composite. 23 . The method of claim 19 , further comprising machining or shaping the carbon composite to form a bar, block, sheet, tubular, cylindrical billet, or toroid.
Graphite (C04B35/536 takes precedence) · CPC title
based on carbon, e.g. graphite · CPC title
Tungsten carbides · CPC title
Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite · CPC title
Solid materials, e.g. powdery or granular · CPC title
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