Semiconductor device including a trench structure having a trench dielectric structure with a gap

Patent metadata

Field	Value
Publication number	US-12349401-B2
Application number	US-202217695207-A
Country	US
Kind code	B2
Filing date	Mar 15, 2022
Priority date	Mar 23, 2021
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A semiconductor device is proposed. An example of the semiconductor device includes a semiconductor body having a first main surface. A trench structure extends into the semiconductor body from the first main surface. The trench structure includes a trench electrode structure and a trench dielectric structure. The trench dielectric structure includes a gate dielectric in an upper part of the trench dielectric structure and a gap in a lower part of the trench dielectric structure. The semiconductor device further includes a body region adjoining the gate dielectric at a sidewall of the trench structure in the upper part of the trench dielectric structure. The gate dielectric extends deeper into the semiconductor body along the sidewall than the body region.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a semiconductor body having a first main surface;
a trench structure extending into the semiconductor body from the first main surface, wherein the trench structure includes a trench electrode structure and a trench dielectric structure, and the trench dielectric structure includes a gate dielectric in an upper part of the trench dielectric structure and a gap laterally extending from a sidewall of the trench structure to the trench electrode structure in a lower part of the trench dielectric structure; and
a body region adjoining the gate dielectric at the sidewall of the trench structure in the upper part of the trench dielectric structure, wherein the gate dielectric extends deeper into the semiconductor body along the sidewall of the trench structure than the body region,
wherein an interface between the gap and the trench electrode structure has one or more steps and/or wherein an interface between the gap and the semiconductor body comprises a step.

2. The semiconductor device of claim 1 , wherein a width of the gap at least in part tapers from a bottom side of the trench structure towards the gate dielectric.

3. The semiconductor device of claim 1 , wherein the trench electrode structure includes a gate electrode adjoining the gate dielectric in the upper part of the trench dielectric structure, and further includes a field electrode adjoining the gap in the lower part of the trench dielectric structure, and wherein the trench dielectric structure further includes an intermediate dielectric between the gate electrode and the field electrode.

4. The semiconductor device of claim 3 , wherein a top part of the gap is laterally limited by the semiconductor body on one side and by the intermediate dielectric on the other side.

5. The semiconductor device of claim 4 , wherein a cross-sectional shape of the top part of the gap is triangular, rectangular, or curved.

6. The semiconductor device of claim 3 , wherein a thickness of the intermediate dielectric is at least two times larger than a thickness of the gate dielectric.

7. The semiconductor device of claim 6 , wherein a cross-sectional shape of the top part of the gap is triangular, rectangular, or curved.

8. The semiconductor device of claim 3 , further comprising a transition point between the gap and the intermediate dielectric at the sidewall of the trench structure, wherein a first distance between the transition point and the gate electrode is equal to or larger than a second distance between the transition point and the field electrode.

9. The semiconductor device of claim 8 , wherein a cross-sectional shape of the top part of the gap is triangular, rectangular, or curved.

10. The semiconductor device of claim 3 , further comprising a second field electrode and a second intermediate dielectric between the second field electrode and the field electrode.

11. The semiconductor device of claim 1 , wherein the width of the gap at a center of the bottom side of the trench structure ranges from (Vbd×nm)/(25×V) to (Vbd×nm)/(2×V), where Vdb is an absolute maximum rated value of a drain to source breakdown voltage.

12. The semiconductor device of claim 1 , wherein the gap is configured to fix an electric breakdown between a drain to a source as a tunneling breakdown.

13. The semiconductor device of claim 1 , wherein the gap is filled with a gas having a pressure of less than 1 atm, and wherein a maximum width of the gap ranges between 10 nm and 300 nm.

14. The semiconductor device of claim 1 , wherein the semiconductor device is a power semiconductor device having an absolute maximum rated value of an electric breakdown voltage between a first load terminal and a second load terminal in a range from 100V to 6500V.

15. A semiconductor device, comprising:
a semiconductor body having a first main surface;
a trench structure extending into the semiconductor body from the first main surface, wherein the trench structure includes a trench electrode structure and a trench dielectric structure, and the trench dielectric structure includes a gate dielectric in an upper part of the trench dielectric structure and a gap laterally extending from a sidewall of the trench structure to the trench electrode structure in a lower part of the trench dielectric structure; and
a body region adjoining the gate dielectric at the sidewall of the trench structure in the upper part of the trench dielectric structure, wherein the gate dielectric extends deeper into the semiconductor body along the sidewall of the trench structure than the body region,
wherein the trench electrode structure includes a gate electrode adjoining the gate dielectric in the upper part of the trench dielectric structure, and further includes a field electrode adjoining the gap in the lower part of the trench dielectric structure, and wherein the trench dielectric structure further includes an intermediate dielectric between the gate electrode and the field electrode, and
wherein a top part of the gap is laterally limited by the semiconductor body on one side and by the intermediate dielectric on the other side.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Weber Hans
• Kammerlander David
• Riegler Andreas

Classifications

• H10D64/2527

  for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies · CPC title

• H10D64/112

  comprising multiple field plate segments · CPC title

• H10D64/20

  Electrodes characterised by their shapes, relative sizes or dispositions · CPC title

• H10D64/514

  characterised by the insulating layers · CPC title

• H10D30/668 Primary

  having trench gate electrodes, e.g. UMOS transistors · CPC title