Heat sink assembly for electronic equipment

Patent metadata

Field	Value
Publication number	US-12349318-B2
Application number	US-202318156688-A
Country	US
Kind code	B2
Filing date	Jan 19, 2023
Priority date	Aug 14, 2020
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

First claim

What is claimed is:

1. An apparatus comprising:
a cage defining a chamber, the cage including an open surface;
a heat sink to facilitate heat dissipation, the heat sink including a mating surface;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to be positioned against a perimeter of the chamber; and
an actuation assembly including a shape memory alloy (SMA) element coupled to the heat sink, wherein the SMA element is configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material is disposed within the open surface of the cage, and when the SMA element is moved to the second position, the second surface of the thermal interface material is moved a distance away from the perimeter of the chamber.

2. The apparatus of claim 1 , wherein the second surface of the thermal interface material is substantially parallel to a top of the perimeter of the chamber when the SMA element is in the second position.

3. The apparatus of claim 1 , wherein the SMA element is coupled to a power source and wherein the actuation assembly is configured to be actuated in response to electrical actuation from the power source.

4. The apparatus of claim 1 , further comprising a locking mechanism to prevent insertion or removal of a module into the chamber of the cage when the SMA element is in the first position.

5. The apparatus of claim 1 , wherein the SMA element is a one-way SMA and the actuation assembly further comprises:
one or more compression springs configured to move the SMA element to the second position.

6. The apparatus of claim 1 , wherein, when the SMA element is moved to the second position, the heat sink and the thermal interface material are lifted up from the perimeter of the chamber.

7. The apparatus of claim 6 , further comprising:
at least one indicator that provides an indication of a position of the thermal interface material.

8. A heat sink assembly for a cage for a field replaceable computing module, comprising:
a heat sink to facilitate heat dissipation, the heat sink including a mating surface;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to engage a heat transfer surface of the field replaceable computing module installed adjacent the heat sink; and
an actuation assembly including a shape memory alloy (SMA) element coupled to the heat sink, wherein the SMA element is configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material is disposed within an open surface of the cage and contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.

9. The heat sink assembly of claim 8 , wherein the second surface of the thermal interface material is substantially parallel to the heat transfer surface of the field replaceable computing module when the SMA element is in the second position.

10. The heat sink assembly of claim 8 , wherein the SMA element is coupled to a power source and wherein the actuation assembly is configured to be actuated in response to electrical actuation from the power source.

11. The heat sink assembly of claim 8 , further comprising a locking mechanism to prevent insertion or removal of the field replaceable computing module into the cage when the SMA element is in the first position.

12. The heat sink assembly of claim 8 , wherein the SMA element is a one-way SMA and the actuation assembly further comprises:
one or more compression springs configured to move the SMA element to the second position.

13. The heat sink assembly of claim 8 , wherein, when the SMA element is moved to the second position, the heat sink and the thermal interface material are lifted up from the heat transfer surface of the field replaceable computing module.

14. The heat sink assembly of claim 13 , further comprising:
at least one indicator that provides an indication of a position of the thermal interface material.

15. A system comprising:
a cage defining a chamber configured to receive a field replaceable computing module with a heat transfer surface, the cage including an open surface;
a heat sink to facilitate heat dissipation, the heat sink including a mating surface;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to selectively engage the heat transfer surface of the field replaceable computing module when the field replaceable computing module is installed in the chamber of the cage; and
an actuation assembly including a shape memory alloy (SMA) element coupled to the heat sink, wherein the field replaceable computing module is configured to be installed in the chamber of the cage and the SMA element is configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material is disposed within the open surface of the cage and contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.

16. The system of claim 15 , further comprising:
circuitry configured to activate a light to provide an illuminated indication when the SMA element is in at least one of the first position or the second position.

17. The system of claim 15 , wherein the second surface of the thermal interface material is substantially parallel to the heat transfer surface of the field replaceable computing module when the SMA element is in the second position.

18. The system of claim 15 , wherein the SMA element is coupled to a power source and wherein the actuation assembly is configured to be actuated in response to electrical actuation from the power source.

19. The system of claim 15 , wherein the SMA element is a one-way SMA and the actuation assembly further comprises:
one or more compression springs configured to move the SMA element to the second position.

20. The system of claim 15 , further comprising a locking mechanism to prevent insertion or removal of the field replaceable computing module into the chamber when the SMA element is in the first position.

Assignees

• Cisco Tech Inc

Inventors

• Gupta Rohit Dev
• Twiss Robert Gregory

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/20709 Primary

  for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title