Optical module heatsink lifter and method

Patent metadata

Field	Value
Publication number	US-10401581-B2
Application number	US-201615072863-A
Country	US
Kind code	B2
Filing date	Mar 17, 2016
Priority date	Mar 17, 2016
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.

First claim

What is claimed is:

1. A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module, the module heatsink lifter comprising:
a fixed base;
a hinge connector of the fixed based coupled to the heatsink; and
an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position relative to the module and a lowered position relative to the module, wherein the heatsink is rotatably lowered onto the module making substantial contact with a Thermal Interface Material (TIM) between the module and the heatsink, based on push and pull movement via the actuator mechanism.

2. The module heatsink lifter of claim 1 , wherein the actuator mechanism comprises a knob through the front faceplate.

3. The module heatsink lifter of claim 1 , wherein the actuator mechanism comprises:
a knob coupled to lever arms on both sides of the heatsink;
linkage arms rotatably coupling the lever arms to the base; and
springs on the both sides providing tension between posts and the heatsink.

4. The module heatsink lifter of claim 1 , wherein the actuator mechanism holds the heatsink in the raised position without requiring a force on a knob through the front faceplate used for the push and pull movement.

5. The module heatsink lifter of claim 1 , wherein the module comprises a pluggable optical module.

6. The module heatsink lifter of claim 1 , wherein, when the heatsink is in the lowered position, the heatsink prevents insertion or removal of the module, and wherein the heatsink is moved to the raised position for the insertion or removal of the module.

7. The module heatsink lifter of claim 1 , wherein the heatsink comprises the Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position.

8. A heatsink lifter method for raising and lowering a heatsink enabling insertion and removal of a module, the heatsink lifter method comprising:
providing a fixed base;
providing a hinge connector of the fixed based coupled to the heatsink; and
providing an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position relative to the module and a lowered position relative to the module, wherein the heatsink is rotatably lowered onto the module making substantial contact with a Thermal Interface Material (TIM) between the module and the heatsink, based on push and pull movement via the actuator mechanism.

9. The heatsink lifter method of claim 8 , wherein the actuator mechanism comprises a knob through the front faceplate.

10. The heatsink lifter method of claim 8 , wherein the actuator mechanism comprises:
a knob coupled to lever arms on both sides of the heatsink;
linkage arms rotatably coupling the lever arms to the base; and
springs on the both sides providing tension between posts and the heatsink.

11. The heatsink lifter method of claim 8 , wherein the actuator mechanism holds the heatsink in the raised position without requiring a force on a knob through the front faceplate used for the push and pull movement.

12. The heatsink lifter method of claim 8 , wherein the module comprises a pluggable optical module.

13. The heatsink lifter method of claim 8 , wherein, when the heatsink is in the lowered position, the heatsink prevents insertion or removal of the module, and wherein the heatsink is moved to the raised position for the insertion or removal of the module.

14. The heatsink lifter method of claim 8 , wherein the heatsink comprises the Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position.

15. A network element supporting one or more pluggable modules, the network element comprising:
a physical housing comprising a front faceplate;
one or more ports on the front faceplate; and
a heatsink lifter for each of the one or more ports, wherein the heatsink lifter comprises
a fixed base,
a hinge connector of the fixed based coupled to the heatsink, and
an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from the front faceplate based on push and pull movement to raise and lower the heatsink into a raised position relative to the module and a lowered position relative to the module, wherein the heatsink is rotatably lowered onto the module making substantial contact with a Thermal Interface Material (TIM) between the module and the heatsink, based on push and pull movement via the actuator mechanism.

16. The network element of claim 15 , wherein the actuator mechanism comprises a knob through the front faceplate.

17. The network element of claim 15 , wherein the actuator mechanism comprises:
a knob coupled to lever arms on both sides of the heatsink;
linkage arms rotatably coupling the lever arms to the base; and
springs on the both sides providing tension between posts and the heatsink.

18. The network element of claim 15 , wherein the module comprises a pluggable optical module.

19. The network element of claim 15 , wherein, when the heatsink is in the lowered position, the heatsink prevents insertion or removal of the module, and wherein the heatsink is moved to the raised position for the insertion or removal of the module.

20. The network element of claim 15 , wherein the heatsink comprises the Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position.

Assignees

• Ciena Corp

Inventors

• Gaal Adrianus Van

Classifications

• H05K7/20563

  within sub-racks for removing heat from electronic boards · CPC title

• H05K7/20472

  Sheet interfaces · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• G02B6/4269 Primary

  with heat sinks or radiation fins · CPC title