Optoelectronic component and method for producing an optoelectronic component

Patent metadata

Field	Value
Publication number	US-12348000-B2
Application number	US-201917312113-A
Country	US
Kind code	B2
Filing date	Nov 27, 2019
Priority date	Dec 10, 2018
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

Disclosed is an optoelectronic component comprising:an optoelectronic semiconductor chip which generates electromagnetic radiation during operation, anda metallic layer provided on the semiconductor chip, whereinan outer surface of the metallic layer has a patterning,the component can be identified by means of the patterning, andthe metallic layer is continuous.Also disclosed is a method for producing an optoelectronic component.

First claim

The invention claimed is:

1. An optoelectronic component comprising,
an optoelectronic semiconductor chip which generates electromagnetic radiation during operation, and
a metallic layer which is arranged on the semiconductor chip, wherein
the metallic layer is a metallic layer stack,
the layer stack comprises a first metallic layer and a second metallic layer,
the second metallic layer comprises roughened regions,
a perturbation layer is arranged between the roughened regions and the first metallic layer,
an outer surface of the metallic layer has a structuring,
the roughened regions form the structuring,
identification of the component is made possible by means of the structuring, and
the metallic layer is formed continuously.

2. The optoelectronic component according to claim 1 ,
in which no non-metallic elements are applied on the outer surface of the metallic layer.

3. The optoelectronic component according to claim 1 ,
in which the metallic layer is formed as a heat sink.

4. The optoelectronic component according to claim 1 ,
in which the metallic layer is formed as a contact layer for electrically contacting the semiconductor chip.

5. The optoelectronic component according to claim 1 ,
in which the metallic layer is a functional layer of the component and has several functions.

6. The optoelectronic component according to claim 1 , in which
the semiconductor chip comprises a ridge waveguide having a top surface and side surfaces adjacent thereto, and
a passivation layer covers the side surfaces of the ridge waveguide.

7. The optoelectronic component according claim 6 ,
in which the metallic layer is in direct contact with the top surface of the ridge waveguide.

8. The optoelectronic component according to claim 6 ,
in which the structuring extends without overlapping with the top surface of the ridge waveguide in top view.

9. The optoelectronic component according to claim 1 ,
in which the structuring comprises recesses.

10. The optoelectronic component according claim 9 ,
in which at least a part of the recesses completely penetrates the metallic layer.

11. The optoelectronic component according to claim 9 ,
in which at least a part of the recesses partially penetrates the metallic layer.

12. The optoelectronic component according to claim 1 ,
in which the structuring forms a bar code for identifying the component.

13. The optoelectronic component according to claim 1 ,
wherein the first metallic layer comprises a metallic adhesion promoter layer and a metallic barrier layer.

14. A method for producing an optoelectronic component according to claim 1 , comprising the steps,
providing the optoelectronic semiconductor chip,
applying the metallic layer on the optoelectronic semiconductor chip, and
producing the structuring on an outer surface of the metallic layer.

15. The method according to claim 14 , wherein
the metallic layer is a metallic layer stack, and
a first metallic layer and a second metallic layer are subsequently applied on top of one another on the semiconductor chip.

16. The method according to claim 14 , wherein
at least a part of recesses penetrates the second metallic layer up to the first metallic layer,
a perturbation layer is applied on the exposed first metallic layer, and
a further second metallic layer is applied on the perturbation layer.

17. The method according to claim 14 , wherein
a stop layer is applied on the metallic layer in regions, and
a further metallic layer is galvanically applied on the region not covered by the stop layer.

18. An optoelectronic component comprising,
an optoelectronic semiconductor chip which generates electromagnetic radiation during operation, and
a first metallic layer which is arranged on the semiconductor chip, and
a structuring comprising recesses on an outer surface of the metallic layer, and wherein
a perturbation layer is applied on the exposed first metallic layer,
a further second metallic layer is applied on the perturbation layer,
at least a part of the recesses penetrates the second metallic layer up to the first metallic layer,
identification of the component is made possible by means of the structuring, and
the metallic layer is formed continuously.

19. An optoelectronic component comprising,
an optoelectronic semiconductor chip which generates electromagnetic radiation during operation, and
a metallic layer which is arranged on the semiconductor chip, wherein
an outer surface of the metallic layer comprises a structuring,
identification of the component is made possible by means of the structuring,
the metallic layer is formed continuously,
a stop layer is applied on the metallic layer in regions, and
a further metallic layer is galvanically applied on the region not covered by the stop layer.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Gerhard Sven
• Somers André
• König Harald
• Ali Muhammad

Classifications

• H01S5/02375

  Positioning of the laser chips · CPC title

• H01S5/0262

  Photo-diodes, e.g. transceiver devices, bidirectional devices (H01S5/0265 takes precedence) · CPC title

• H01S5/02476

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• H10H20/0365

  of means for heat extraction or cooling · CPC title

• H10H20/0364

  of interconnections · CPC title