Plasma etching apparatus, plasma etching method using the same, and semiconductor fabrication method using the same

Patent metadata

Field	Value
Publication number	US-12347657-B2
Application number	US-202217893783-A
Country	US
Kind code	B2
Filing date	Aug 23, 2022
Priority date	Dec 13, 2021
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A plasma etching apparatus includes a chuck configured to support a wafer, and a voltage application unit. The voltage application unit includes a first voltage application part configured to apply a first voltage to the wafer on the chuck, and a second voltage application part configured to apply a second voltage to the wafer on the chuck, the second voltage being different from the first voltage.

First claim

What is claimed is:

1. A plasma etching apparatus comprising:
a chuck configured to support a wafer having a first upper surface at a first level and a second upper surface at a second level higher than the first level; and
a voltage application unit comprising:
a first voltage application part configured to contact the first upper surface of the wafer and apply a first voltage to the wafer on the chuck; and
a second voltage application part configured to contact the second upper surface of the wafer and apply a second voltage to the wafer on the chuck, the second voltage being different from the first voltage.

2. The plasma etching apparatus of claim 1 , wherein the first voltage application part comprises a first voltage delivery member configured to transmit the first voltage to the first upper surface of the wafer on the chuck, and
wherein the second voltage application part comprises a second voltage delivery member configured to transmit the second voltage to the second upper surface of the wafer on the chuck.

3. The plasma etching apparatus of claim 2 , wherein the first voltage delivery member comprises a plurality of first voltage delivery members, and
wherein the plurality of first voltage delivery members are spaced apart from each other in a circumferential direction.

4. The plasma etching apparatus of claim 3 , wherein the voltage application unit further comprises an edge ring that supports the plurality of first voltage delivery members.

5. The plasma etching apparatus of claim 2 , wherein the second voltage delivery member is provided above the chuck.

6. The plasma etching apparatus of claim 2 , wherein a bottom end of the second voltage delivery member is provided above a bottom end of the first voltage delivery member.

7. The plasma etching apparatus of claim 2 , wherein a first horizontal distance between the first voltage delivery member and an axis of the chuck is greater than a second horizontal distance between the second voltage delivery member and the axis of the chuck.

8. The plasma etching apparatus of claim 7 , wherein the first horizontal distance is about 0.5 mm to about 5 mm greater than the second horizontal distance.

9. A plasma etching apparatus, comprising:
a chuck configured to support a wafer having a first upper surface at a first level and a second upper surface at a second level higher than the first level; and
a voltage application unit comprising:
a first voltage delivery member configured to contact the first upper surface of the wafer and transmit a first direct current (DC) voltage to the wafer;
a second voltage delivery member configured to contact the second upper surface of the wafer and transmit a second DC voltage to the wafer on the chuck, the second DC voltage being different from the first DC voltage; and
a first voltage source connected to the first voltage delivery member,

wherein the first voltage delivery member is provided above the chuck.

10. The plasma etching apparatus of claim 9 , wherein the voltage application unit further comprises an elevation drive part configured to drive the first voltage delivery member to move vertically relative to the chuck.

11. The plasma etching apparatus of claim 10 , wherein the elevation drive part comprises an outer lift pin that connects to the first voltage delivery member and that vertically extends.

12. The plasma etching apparatus of claim 11 , wherein the first voltage delivery member comprises a plurality of first voltage delivery members that are spaced apart from each other in a circumferential direction,
wherein the voltage application unit further comprises an edge ring that supports the plurality of first voltage delivery members, and
wherein the outer lift pin is configured to move the edge ring vertically.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Jongchul
• Lee Sanghyun

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P50/267

  using plasmas · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P50/71

  using masks for conductive or resistive materials · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title