Conductive oxide overhang structures for OLED devices

Patent metadata

Field	Value
Publication number	US-12342702-B2
Application number	US-202418744244-A
Country	US
Kind code	B2
Filing date	Jun 14, 2024
Priority date	Apr 23, 2021
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
overhang structures disposed over the substrate;
a plurality of sub-pixels, each sub-pixel is defined by a first overhang structure and a second overhang structure adjacent to each other, the first overhang structure and the second overhang structure having:
a base portion disposed over the substrate, the base portion comprising a first composition; and
a top portion disposed over the base portion, the top portion including a first extension and a second extension having a bottom surface wider than a top surface of the base portion, all of the bottom surface of the top portion including the first extension and the second extension is planar to all of the top surface of the base portion, the top portion comprising a second composition different than the first composition, wherein:
the first extension of the top portion of the first overhang structure extends laterally past the base portion and is disposed entirely above sidewalls of the base portion; and

the second extension of the top portion of the second overhang structure extends laterally past the base portion and is disposed entirely above the sidewalls of the base portion;
an anode;
an organic light-emitting diode (OLED) material disposed over the anode; and
a cathode disposed over the OLED material, the cathode extending under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure, wherein a cathode material of the cathode is different from the second composition; and
an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure past the cathode along the sidewall of the base portion, and contacts the bottom surface of the top portion.

2. The device of claim 1 , wherein the second composition comprises a metal alloy material.

3. The device of claim 2 , wherein the metal alloy material comprises copper (Cu), titanium (Ti), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), or combinations thereof.

4. The device of claim 1 , wherein the first composition comprises at least one of:
a transition metal;
a transition metal oxide (TMO) material; or
a transparent conductive oxide (TCO) material.

5. The device of claim 4 , wherein:
the transition metal comprises ruthenium (Ru), vanadium (V), titanium (Ti), zinc (Zn), copper (Cu), molybdenum (Mo), or combinations thereof;
the TMO material comprises one or more oxides of the transition metal; and
the TCO material comprises one or more of indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin oxide (ITO), or combinations thereof.

6. The device of claim 1 , wherein the cathode directly contacts the base portion.

7. The device of claim 1 , wherein each sub-pixel further comprises a plug disposed over the encapsulation layer, the plug having a plug transmittance that is matched or substantially matched to an OLED transmittance of the OLED material.

8. The device of claim 1 , further comprising a global encapsulation layer disposed over the first overhang structure, the second overhang structure, and the encapsulation layer.

9. The device of claim 1 , wherein the device comprises a dot-type architecture or a line-type architecture.

10. The device of claim 1 , wherein the substrate is a pre-patterned indium tin oxide (ITO) glass substrate.

11. A device, comprising:
a substrate;
overhang structures disposed over the substrate;
a plurality of sub-pixels, each sub-pixel is defined by a first overhang structure and a second overhang structure adjacent to each other, the first overhang structure and the second overhang structure having:
a base portion disposed over the substrate, the base portion comprising a first composition; and
a top portion disposed over the base portion, the top portion including a first extension and a second extension having a bottom surface wider than a top surface of the base portion, all of the bottom surface of the top portion including the first extension and the second extension is planar to all of the top surface of the base portion, the top portion comprising a second composition different than the first composition, wherein:
the first extension of the top portion of the first overhang structure extends laterally past the base portion and is disposed entirely above sidewalls of the base portion; and
the second extension of the top portion of the second overhang structure extends laterally past the base portion and is disposed entirely above the sidewalls of the base portion;

an anode;
an organic light-emitting diode (OLED) material disposed over the anode; and
a cathode disposed over the OLED material, the cathode extending under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure, wherein a cathode material of the cathode is different from the second composition.

12. The device of claim 11 , further comprising an encapsulation layer disposed over the cathode, wherein the encapsulation layer extends under the first extension of the top portion of the first overhang structure and the second extension of the top portion of the second overhang structure past the cathode along the sidewall of the base portion, and contacts the bottom surface of the top portion.

13. The device of claim 11 , wherein the first composition comprises at least one of:
a transition metal;
a transition metal oxide (TMO) material; or
a transparent conductive oxide (TCO) material.

14. The device of claim 13 , wherein:
the transition metal comprises ruthenium (Ru), vanadium (V), titanium (Ti), zinc (Zn), copper (Cu), molybdenum (Mo), or combinations thereof;
the TMO material comprises one or more oxides of the transition metal; and
the TCO material comprises one or more of indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin oxide (ITO), or combinations thereof.

15. The device of claim 11 , wherein the cathode directly contacts the base portion.

16. The device of claim 11 , wherein the second composition comprises copper (Cu), titanium (Ti), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), or combinations thereof.

17. The device of claim 11 , further comprising a global encapsulation layer disposed over the first overhang structure, the second overhang structure, and the encapsulation layer.

18. The device of claim 11 , wherein the device comprises a dot-type architecture or a line-type architecture.

19. The device of claim 11 , wherein the substrate is a pre-patterned indium tin oxide (ITO) glass substrate.

20. A device, comprising:
a substrate;
overhang structures disposed over the substrate;
a plurality of sub-pixels, each sub-pixel is defined by a first overhang structure and a second overhang structure adjacent to each other, the first overhang structure and the second overhang structure having:
a base portion disposed over the substrate, the base portion comprising a first composition; and
a top portion disposed over the base portion, the top portion including a first extension and a second extension having a bottom surface wider than a top surface of the base portion, all of the bottom surface of the top portion including the first extension and the second extension is planar to all of the top surface of the

Assignees

• Applied Materials Inc

Inventors

• Choung Ji-Young
• Chen Chung-Chia
• Lin Yu Hsin
• Lee Jungmin
• Haas Dieter
• Kim Si Kyoung

Classifications

• H10K59/873 Primary

  Encapsulations · CPC title

• H10K59/80521

  characterised by their shape · CPC title

• H10K2102/00

  Constructional details relating to the organic devices covered by this subclass · CPC title

• H10K2102/103

  comprising indium oxides, e.g. ITO · CPC title

• H10K71/16

  using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering · CPC title