Packaging structure and power amplifier

Patent metadata

Field	Value
Publication number	US-12341480-B2
Application number	US-202217570575-A
Country	US
Kind code	B2
Filing date	Jan 7, 2022
Priority date	Jul 9, 2019
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.

First claim

What is claimed is:

1. A packaging structure, comprising:
a first component;
a second component;
a printed circuit board;
a third component and
a metal plate having an etched pattern;
wherein the printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot;
wherein the first component is disposed in the open slot, and the first component is disposed on the metal plate;
wherein the first component is connected to the printed circuit board; and
wherein the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board;
wherein the etched pattern comprises a first microstrip circuit, wherein the third component is disposed on, and connected to, the first microstrip circuit.

2. The packaging structure according to claim 1 , wherein a thickness of the metal plate is 0.07 mm to 0.5 mm.

3. The packaging structure according to claim 1 , wherein a thickness of the metal plate is 0.035 mm to 1 mm.

4. The packaging structure according to claim 1 , wherein the first component is connected to the printed circuit board by using a bond wire or a ribbon.

5. The packaging structure according to claim 4 , wherein the etched pattern is a pad; and
wherein the printed circuit board is connected to the pad of the metal plate.

6. The packaging structure according to claim 5 , wherein the printed circuit board comprises a second microstrip circuit;
wherein the first component is connected to the pad on the metal plate by the second microstrip circuit of the printed circuit board; and
wherein the first component is connected, by the second microstrip circuit of the printed circuit board, to the second component disposed on the printed circuit board.

7. The packaging structure according to claim 6 , wherein the third component is coupled, by the first microstrip circuit, to the second component connected to the second microstrip circuit.

8. The packaging structure according to claim 7 , wherein the packaging structure further comprises a lid or a mold;
wherein the lid or the mold is disposed on the printed circuit board; and
wherein the first component, the second component, and the bond wire or the ribbon are disposed between the printed circuit board and the lid or the mold.

9. The packaging structure according to claim 1 , wherein the first component is at least one of one or more semiconductor dies or one or more ceramic capacitors.

10. The packaging structure according to claim 1 , wherein the first component is a capacitor.

11. The packaging structure according to claim 1 , wherein the second component is one or more surface mount devices.

12. The packaging structure according to claim 1 , wherein the printed circuit board comprises one or more layers of laminated printed circuit boards.

13. The packaging structure according to claim 12 , wherein the printed circuit board is at least one of a silicon substrate, a glass substrate, or an organic substrate.

14. The packaging structure according to claim 1 , wherein the metal plate is a metal material with high thermal conductivity.

15. A power amplifier, comprising:
a packaging structure, comprising:
a first component;
a second component;
a printed circuit board;
a third component; and
a metal plate, having an etched pattern;

wherein the printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot;
wherein the first component is disposed in the open slot, and the first component is disposed on the metal plate;
wherein the first component is connected to the printed circuit board; and
wherein the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board;
wherein the etched pattern comprises a first microstrip circuit, wherein the third component is disposed on, and connected to, the first microstrip circuit.

16. The power amplifier according to claim 15 , wherein the power amplifier comprises a first inductor; and
wherein the first inductor is a bond wire or a ribbon.

17. The power amplifier according to claim 16 , wherein an inductance value of the first inductor is associated with at least one of a height difference between the bond wire and the printed circuit board, a span of the bond wire, a quantity of bond wires, a distance between the bond wires, a height difference between the ribbon and the printed circuit board, a span of the ribbon, a quantity of ribbons, or a distance between ribbons.

Assignees

• Huawei Tech Co Ltd

Inventors

• Zhang Xiaomin
• Huang Mingli
• Jiang Ran

Classifications

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/534

  being rectangular · CPC title