Radio frequency power component and radio frequency signal transceiving device

Patent metadata

Field	Value
Publication number	US-10347596-B2
Application number	US-201715467484-A
Country	US
Kind code	B2
Filing date	Mar 23, 2017
Priority date	Sep 23, 2014
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

The application provides an apparatus, including a first section, a second section, and a first bonding wire group, where the first bonding wire group includes at least three first bonding wire units. The first bonding wire unit includes at least one arc-shaped bonding wire, one end and the other end of the first bonding wire unit are electrically connected to electrodes of the first section and the second section, respectively, where arc heights of first bonding wire units located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position, and an arc height of a first bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a first bonding wire unit at another position.

First claim

What is claimed is:

1. An apparatus, comprising:
a first section;
a second section, wherein the first section and the second section are separately welded to a same side of a substrate body; and
a first bonding wire group;
wherein the first bonding wire group comprises at least three bonding wire units, and wherein there is a spacing between bonding wire units of the first bonding wire group;
wherein each bonding wire unit of the first bonding wire group comprises at least one arc-shaped bonding wire, wherein a vertex of an arc height of the at least one arc-shaped bonding wire is away from the substrate body, wherein one end of each bonding wire unit of the first bonding wire group is electrically connected to an electrode of the first section, and wherein another end of each bonding wire unit of the first bonding wire group is electrically connected to an electrode of the second section, to perform radio frequency signal transmission between the first section and the second section; and
wherein arc heights of bonding wire units of the first bonding wire group located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position in the first bonding wire group, and wherein an arc height of a third bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a fourth bonding wire unit at another position in the first bonding wire group, so that currents passing through the bonding wire units of the first bonding wire group are the same.

2. The apparatus according to claim 1 , wherein arc heights of bonding wire units of the first bonding wire group located between the two sides and the central area of the first bonding wire group are gradually reduced in a direction from the two sides of the first bonding wire group to the central area, wherein the first bonding wire group comprises more than three bonding wire units.

3. The apparatus according to claim 1 , wherein the central area of the first bonding wire group comprises one bonding wire unit.

4. The apparatus according to claim 1 , wherein the central area of the first bonding wire group comprises at least two bonding wire units with a same arc height.

5. The apparatus according to claim 1 , wherein distances between adjacent bonding wire units of the first bonding wire group are equal.

6. The apparatus according to claim 1 , wherein the first bonding wire unit comprises multiple bonding wires, wherein arc heights of the multiple bonding wires are the same, and wherein a vertex of an arc height of the first bonding wire unit is a vertex of an arc height of any of the bonding wires of the first bonding wire unit.

7. The apparatus according to claim 1 , wherein the first bonding wire group is of an axially symmetric structure that uses a middle position in the first bonding wire group as an axis of symmetry.

8. The apparatus according to claim 1 , further comprising a second bonding wire group, wherein the second bonding wire group is located at one side of the first bonding wire group, and wherein the second bonding wire group comprises at least three bonding wire units, wherein there is a spacing between bonding wire units of the second bonding wire group;
wherein each bonding wire unit of the second bonding wire group comprises at least one arc-shaped bonding wire, wherein a vertex of an arc height of the arc-shaped bonding wire is away from the substrate body, wherein one end of each bonding wire unit of the second bonding wire group is electrically connected to the electrode of the first section and another end of each bonding wire unit of the second bonding wire group is electrically connected to the electrode of the second section, to perform, with the first bonding wire unit, the radio frequency signal transmission between the first section and the second section; and
wherein arc heights of bonding wire units of the second bonding wire group located at sides of the second bonding wire group are higher than an arc height of a second bonding wire unit at another position in the second bonding wire group, and wherein an arc height of a fifth bonding wire unit in a central area of the second bonding wire group is lower than an arc height of a sixth bonding wire unit at another position in the second bonding wire group, so that currents passing through the bonding wire units of the second bonding wire group are the same.

9. The apparatus according to claim 8 , wherein arc heights of bonding wire units located between the two sides and the central area of the second bonding wire group are gradually reduced in a direction from the two sides of the second bonding wire group to the central area, wherein the second bonding wire group comprises more than three bonding wire units.

10. The apparatus according to claim 8 , wherein a distance between the first bonding wire group and the second bonding wire group is greater than a distance between adjacent bonding wire units of the first bonding wire group and greater than a distance between adjacent bonding wire units of the second bonding wire group.

11. The apparatus according to claim 8 , wherein the central area of the second bonding wire group comprises one second bonding wire unit.

12. The apparatus according to claim 8 , wherein the central area of the second bonding wire group comprises at least two second bonding wire units with a same arc height.

13. The apparatus according to claim 8 , wherein distances between adjacent bonding wire units of the second bonding wire group are equal.

14. The apparatus according to claim 8 , wherein the second bonding wire unit comprises multiple bonding wires, wherein arc heights of the multiple bonding wires are the same, and wherein a vertex of an arc height of the second bonding wire unit is a vertex of an arc height of any of the bonding wires of the second bonding wire unit.

15. The apparatus according to claim 8 , wherein the second bonding wire group is of an axially symmetric structure that uses a middle position in the second bonding wire group as an axis of symmetry.

16. The apparatus according to claim 1 , wherein the first section is an amplifier chip or a capacitor chip, and the second section is an amplifier chip or a capacitor chip.

17. A device, comprising:
an apparatus; and
an antenna;
wherein the apparatus is configured to process a radio frequency signal, and the antenna is configured to receive the radio frequency signal processed by the apparatus and transmit the radio frequency signal;
wherein the apparatus comprises a first section, a second section, and a first bonding wire group, wherein the first section and the second section are separately welded to a same side of a substrate body, and wherein the first bonding wire group comprises at least three first bonding wire units;
wherein there is a spacing between the bonding wire units of the first bonding wire group, wherein each of the first bonding wire units comprises at least one arc-shaped bonding wire, wherein a vertex of an arc height of the at least one arc-shaped bonding wire is away from the substrate body, wherein one end of each first bonding wire unit is electrically connected to an electrode of the first section, and wherein another end of each first bonding wire unit is electrically connected to an electrode of the second section, to perform radio frequency signal transmission between the first section and the second section; and
wherein arc heights of bonding wire units located at two sides of the first bonding wire group are higher than an arc hei

Assignees

• Huawei Tech Co Ltd

Inventors

• Huang An
• Lin Yanhai
• Liu Wei

Classifications

• H10W90/759

  between a chip and a laterally-adjacent discrete passive device · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/07553

  changes in shapes · CPC title