Exhaust piping for a semiconductor processing tool

Patent metadata

Field	Value
Publication number	US-12334365-B2
Application number	US-202117446580-A
Country	US
Kind code	B2
Filing date	Aug 31, 2021
Priority date	Aug 31, 2021
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A semiconductor processing tool may include a processing tank. The semiconductor processing tool may include an arm arranged to hold a plurality of wafers over the processing tank such that wafers in the plurality of wafers are horizontally stacked over the processing tank. The semiconductor processing tool may include a fan arranged over the arm to permit an airflow to be provided across surfaces of the wafers in a vertical direction toward the processing tank. The semiconductor processing tool may include an exhaust system including at least one exhaust output and one or more exhaust pipe segments arranged substantially around the processing tank and connected to the at least one exhaust output. The one or more exhaust pipe segments may include a plurality of openings to receive exhaust air to be provided to the at least one exhaust output.

First claim

What is claimed is:

1. A semiconductor processing tool, comprising:
a processing tank;
an arm arranged to hold a plurality of wafers over the processing tank such that wafers in the plurality of wafers are horizontally stacked over the processing tank; and
a fan arranged over the arm to permit an airflow to be provided across surfaces of the wafers in a vertical direction toward the processing tank; and
an exhaust system including:
at least one exhaust output to direct exhaust air away from the semiconductor processing tool, and
one or more exhaust pipe segments arranged substantially around the processing tank and connected to the at least one exhaust output,
wherein the one or more exhaust pipe segments include a plurality of openings on a bottom end of the one or more exhaust pipe segments to receive the exhaust air to be provided to the at least one exhaust output.

2. The semiconductor processing tool of claim 1 , wherein the one or more exhaust pipe segments are arranged 360 degrees around the processing tank.

3. The semiconductor processing tool of claim 1 , wherein the plurality of openings are evenly distributed around a perimeter of the processing tank.

4. The semiconductor processing tool of claim 1 , wherein at least one opening of the plurality of openings is on a bottom surface of an exhaust pipe segment of the one or more exhaust pipe segments.

5. The semiconductor processing tool of claim 1 , wherein at least one opening of the plurality of openings is on a side surface of an exhaust pipe segment of the one or more exhaust pipe segments.

6. The semiconductor processing tool of claim 1 , wherein at least one opening of the plurality of openings is on a top surface of an exhaust pipe segment of the one or more exhaust pipe segments.

7. The semiconductor processing tool of claim 1 , wherein the one or more exhaust pipe segments include a plurality of exhaust pipe segments arranged such that a gap is present along a side of the processing tank between two of the plurality of exhaust pipe segments.

8. The semiconductor processing tool of claim 1 , wherein the one or more exhaust pipe segments include a plurality of exhaust pipe segments arranged such that a gap is present at a corner of the processing tank between two of the plurality of exhaust pipe segments.

9. The semiconductor processing tool of claim 1 , wherein the plurality of openings are symmetrically arranged with respect to a center axis on a plane corresponding to the processing tank.

10. The semiconductor processing tool of claim 1 , wherein the semiconductor processing tool is a wet bench.

11. The semiconductor processing tool of claim 1 , wherein the one or more exhaust pipe segments include a plurality of exhaust pipe segments and the at least one exhaust output includes a plurality of exhaust outputs, wherein an exhaust pipe segment of the plurality of exhaust pipe segments is to provide exhaust air to one of the plurality of exhaust outputs.

12. An exhaust system of a semiconductor processing tool, the exhaust system comprising:
at least one exhaust output; and
one or more exhaust pipe segments connected to the at least one exhaust output,
wherein the one or more exhaust pipe segments are substantially around a perimeter of a processing tank of the semiconductor processing tool, and
wherein the one or more exhaust pipe segments comprises a top surface, exposed to a fan of the semiconductor processing tool, and a bottom surface comprising one or more openings.

13. The exhaust system of claim 12 , wherein the one or more exhaust pipe segments are arranged around an entirety of the perimeter of the processing tank.

14. The exhaust system of claim 12 , wherein the one or more openings include plurality of openings distributed around an entirety of the perimeter of the processing tank.

15. The exhaust system of claim 12 , wherein the one or more exhaust pipe segments include a plurality of exhaust pipe segments, wherein a gap is present between two of the plurality of exhaust pipe segments along a side of the processing tank or at a corner of the processing tank.

16. The exhaust system of claim 12 , wherein the one or more openings include a plurality of openings, and wherein a pattern of the plurality of openings is substantially symmetrical with respect to a center axis on a plane corresponding to the processing tank.

17. The exhaust system of claim 12 , wherein the one or more openings include a plurality of openings evenly distributed around an entirety of the perimeter of the processing tank.

18. A semiconductor processing tool, comprising:
a processing tank;
a fan arranged over the processing tank to cause an airflow to be provided toward the processing tank; and
an exhaust system including one or more exhaust pipe segments arranged on at least two sides of the processing tank,
wherein the one or more exhaust pipe segments comprises a top surface, exposed to the fan, and a bottom surface comprising one or more openings to receive exhaust air to be provided to one or more exhaust outputs.

19. The semiconductor processing tool of claim 18 , wherein the one or more exhaust pipe segments consist of a single exhaust pipe segment that is around a perimeter of the processing tank.

20. The semiconductor processing tool of claim 18 , wherein the one or more exhaust pipe segments include a plurality of exhaust pipe segments arranged such that a first gap is present along a first side of the processing tank between a first two of the plurality of exhaust pipe segments and that a second gap is present along a second side of the processing tank between a second two of the plurality of exhaust pipe segments.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lien Kuo-Sheng
• Chen Yung-Ho

Classifications

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0422

  for wet etching · CPC title

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0411 Primary

  for wet cleaning or washing · CPC title