Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-12334268-B2
Application number	US-202217978660-A
Country	US
Kind code	B2
Filing date	Nov 1, 2022
Priority date	Dec 20, 2021
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween; and
external electrodes disposed outside the body,
wherein the external electrodes include:
a first electrode layer connected to the internal electrodes and including a first conductive metal;
a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including a first intermetallic compound and a first resin;
a second resin electrode layer disposed on the first resin electrode layer and including a plurality of second metal particles and a second resin; and
a second interfacial layer disposed between the first resin electrode layer and the second resin electrode layer and including a third intermetallic compound.

2. The multilayer electronic component of claim 1 , wherein the second resin electrode layer is free of an intermetallic compound.

3. The multilayer electronic component of claim 1 , wherein the first intermetallic compound includes at least one of Cu 6 Sn 5 , Cu 3 Sn, or Ag 3 Sn.

4. The multilayer electronic component of claim 1 , wherein
the first resin electrode layer further includes a plurality of first metal particles, and
a content of the plurality of first metal particles in the first resin electrode layer is less than a content of the plurality of second metal particles in the second resin electrode layer.

5. The multilayer electronic component of claim 1 , wherein a first interfacial layer is disposed between the first electrode layer and the first resin electrode layer and includes a second intermetallic compound distinct from the first intermetallic compound.

6. The multilayer electronic component of claim 1 , wherein the third intermetallic compound included in the second interfacial layer includes at least one of Ag 3 Sn, Cu 3 Sn, or Cu 6 Sn 5 .

7. The multilayer electronic component of claim 1 , wherein
the second resin electrode layer further includes a second conductive connecting portion including a fourth intermetallic compound, and
a content of the first intermetallic compound in the first resin electrode layer is higher than a content of the fourth intermetallic compound in the second resin electrode layer.

8. The multilayer electronic component of claim 7 , wherein, based on a cross-section of the external electrodes taken in a direction perpendicular to a stacking direction of the plurality of internal electrodes, an area ratio of the first intermetallic compound of the first resin electrode layer is higher than an area ratio of the fourth intermetallic compound of the second resin electrode layer.

9. The multilayer electronic component of claim 1 , wherein the external electrodes further include a second electrode layer disposed on the second resin electrode layer and including a second conductive metal.

10. The multilayer electronic component of claim 9 , wherein the second electrode layer has a multilayer structure including a first layer including nickel (Ni) as the second conductive metal and a second layer including tin (Sn) as the second conductive metal.

11. The multilayer electronic component of claim 9 , wherein
the body further includes first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction,
the external electrodes include a first external electrode disposed on the first surface of the body and a second external electrode disposed on the second surface of the body,
wherein the first external electrode includes a first band portion extending to first portions of the third to sixth surfaces of the body, and
the second external electrode includes a second band portion extending to second portions of the third to sixth surfaces of the body.

12. The multilayer electronic component of claim 11 , wherein a ratio of a length of the second resin electrode layer of the first and second band portions in the first direction to a length of the first electrode layer of the first and second band portions in the first direction is 1.5 to 4.

13. The multilayer electronic component of claim 11 , wherein the first electrode layer of the first and second band portions is in contact with the second electrode layer of the first and second band portions.

14. The multilayer electronic component of claim 1 , wherein the first conductive connecting portion further includes a low-melting-point metal having a lower melting point than a curing temperature of the resin.

15. The multilayer electronic component of claim 5 , wherein the second intermetallic compound included in the first interfacial layer includes Cu 3 Sn.

16. A multilayer electronic component comprising:
a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween; and
external electrodes disposed outside the body,
wherein the external electrodes include:
a first electrode layer connected to the internal electrodes and including a first conductive metal;
a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including a first intermetallic compound and a first resin;
a second resin electrode layer disposed on the first resin electrode layer and including a plurality of second metal particles and a second resin; and
a second interfacial layer disposed between the first resin electrode layer and the second resin electrode layer and including a third intermetallic compound,

wherein an end of the first electrode layer extends beyond an end of the second resin electrode layer.

17. The multilayer electronic component of claim 16 , wherein the first electrode layer further includes glass.

18. The multilayer electronic component of claim 16 , wherein
the body further includes first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction,
the external electrodes include a first external electrode disposed on the first surface of the body and a second external electrode disposed on the second surface of the body,
wherein the first external electrode includes a first band portion extending to first portions of the third to sixth surfaces of the body, and
the second external electrode includes a second band portion extending to second portions of the third to sixth surfaces of the body.

19. The multilayer electronic component of claim 16 , wherein a length of the first electrode layer of the first and second band portions in the first direction is longer than a length of the second resin electrode layer of the first and second band portions in the first direction.

20. The multilayer electronic component of claim 16 , wherein
the second resin electrode layer further includes a second conductive connecting portion including a fourth intermetallic compound.

21. The multilayer electronic component of claim 20 , wherein, based on a cross-section of the external electrodes taken in a direction perpendicular to a stacking direction o

Assignees

• Samsung Electro Mech

Inventors

• Han Ji Hye
• Kim Jung Min
• Choi Hong Je
• Kang Byung Woo
• Park Hye Jin
• Lee Sang Wook
• Koo Bon Seok

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• Y02E60/13

  Energy storage using capacitors · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title

• H01G4/1209 Primary

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title