Integrated circuit package comprising an enhanced electromagnetic shield
US-10438901-B1 · Oct 8, 2019 · US
Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor device
US12327799B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12327799-B2 |
| Application number | US-202117317082-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 11, 2021 |
| Priority date | May 11, 2021 |
| Publication date | Jun 10, 2025 |
| Grant date | Jun 10, 2025 |
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Abstract
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A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. A multi-layer shielding structure is formed over the encapsulant. The multi-layer shielding structure has a first layer of ferromagnetic material and second layer of a protective layer or conductive layer. The ferromagnetic material can be iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, or nanocrystalline alloy. The first layer can be a single, homogeneous material. The protective layer can be stainless steel, tantalum, molybdenum, titanium, nickel, or chromium. The conductive layer can be copper, silver, gold, or aluminum. The multi-layer shielding structure protects the electrical components from low frequency and high frequency interference.
First claim
Opening claim text (preview).
What is claimed: 1. A semiconductor device, comprising: a substrate; an electrical component disposed over the substrate; an encapsulant disposed over the substrate and electrical component; and a multi-layer shielding structure formed over the encapsulant, wherein the multi-layer shielding structure includes: (a) a first protection material extending over a top surface and a side surface of the encapsulant where the first protection material is selected from the group consisting of stainless steel, tantalum, molybdenum, titanium, nickel, and chromium, (b) a first conductive material in contact with the first protection material where the first conductive material is selected from the group consisting of copper, silver, gold, and aluminum, (c) a ferromagnetic material in contact with the first conductive material where the ferromagnetic material is selected from the group consisting of iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, and nanocrystalline alloy, (d) a second conductive material in contact with the ferromagnetic material where the second conductive material is selected from the group consisting of copper, silver, gold, and aluminum, and (e) a second protection material in contact with the second conductive material where the second protection material is selected from the group consisting of stainless steel, tantalum, molybdenum, titanium, nickel, and chromium. 2. A semiconductor device, comprising: an electrical component assembly; and a multi-layer shielding structure formed over the electrical component assembly, wherein the multi-layer shielding structure includes: (a) a first protection material extending over a top surface and a side surface of the encapsulant where the first protection material is selected from the group consisting of stainless steel, tantalum, molybdenum, titanium, nickel, and chromium, (b) a first conductive material in contact with the first protection material where the first conductive material is selected from the group consisting of copper, silver, gold, and aluminum, (c) a ferromagnetic material in contact with the first conductive material where the ferromagnetic material is selected from the group consisting of iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, and nanocrystalline alloy, and (d) a second protection material formed over the ferromagnetic material where the second protection material is selected from the group consisting of stainless steel, tantalum, molybdenum, titanium, nickel, and chromium, and (e) a second conductive material in contact with the ferromagnetic material where the second conductive material is selected from the group consisting of copper, silver, gold, and aluminum.
Assignees
Inventors
Classifications
- H10W74/01Primary
Manufacture or treatment · CPC title
the principal metal being a noble metal, e.g. gold · CPC title
the principal metal being copper · CPC title
the principal metal being aluminium · CPC title
the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title
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Frequently asked questions
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- What does patent US12327799B2 cover?
- A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. A multi-layer shielding structure is formed over the encapsulant. The multi-layer shielding structure has a first layer of ferromagnetic material and second layer of a protective layer or conductive layer. The ferromagnetic materi…
- Who is the assignee on this patent?
- Stats Chippac Pte Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/01. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 10 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).