Semiconductor package

Patent metadata

Field	Value
Publication number	US-9362235-B2
Application number	US-201414173119-A
Country	US
Kind code	B2
Filing date	Feb 5, 2014
Priority date	Jun 10, 2010
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI).

First claim

What is claimed is:

1. A semiconductor package, comprising:
a first substrate;
a second substrate stacked on the first substrate;
at least one lower semiconductor chip formed on the first substrate and at least one upper semiconductor chip formed on the second substrate;
a first encapsulation material covering the upper semiconductor chip;
a shielding can mounted on the first substrate, the shielding can surrounding the upper and lower semiconductor chips; and
a ground connection element electrically connecting the shielding can to a ground voltage,
wherein the shielding can surrounds side surfaces of the first substrate and the second substrate, and
wherein the shielding can contacts the side surfaces of the second substrate.

2. The semiconductor package of claim 1 , wherein the shielding can further comprises a metal layer.

3. The semiconductor package of claim 1 , wherein the ground connection element electrically connects the shielding can and a ground wire formed in at least one of the first and second substrates.

4. The semiconductor package of claim 1 , wherein the ground connection element electrically connects the shielding can and a ground terminal formed in at least one of the upper and lower semiconductor chips.

5. The semiconductor package of claim 1 , further comprising a substrate connection element electrically connecting the first substrate and the second substrate.

6. The semiconductor package of claim 5 , further comprising a second encapsulation material covering the lower semiconductor chip, wherein the substrate connection element comprises through vias (TVs) formed through the second encapsulation material.

7. The semiconductor package of claim 1 , wherein the shielding can surrounds and is spaced apart from the at least one upper semiconductor chip and wherein the shielding can is formed of a multi-layer comprising a metal layer, an insulating adhesive layer and a soft magnetic material layer between the metal layer and the insulating adhesive layer, wherein the insulating adhesive layer is between the at least one upper semiconductor chip and the soft magnetic material layer.

8. The semiconductor package of claim 7 , wherein the insulating adhesive layer contacts the side surfaces of the first substrate and the second substrate.

9. The semiconductor package of claim 1 , wherein the shielding can comprises a soft magnetic material.

10. The semiconductor package of claim 1 , further comprising a substrate connection element electrically connecting the first substrate and the second substrate,
wherein the substrate connection element is formed of bumps or TVs disposed between the first substrate and the second substrate.

11. The semiconductor package of claim 1 , wherein the shielding can contacts the side surfaces of the first substrate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Yong-Hoon
• Lee Hee-Seok
• Jeong Jin-Ha

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title