Method for adjusting chip mounting position, apparatus, medium, and electronic device

Patent metadata

Field	Value
Publication number	US-12327740-B2
Application number	US-202217668654-A
Country	US
Kind code	B2
Filing date	Feb 10, 2022
Priority date	May 13, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

A method for adjusting a chip mounting position, an apparatus, a medium, and an electronic device are provided. The adjustment method includes: obtaining offsets of actual mounting positions of individual chips in a first group of chips; obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips; and adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips.

First claim

The invention claimed is:

1. A method for adjusting a chip mounting position, comprising:
obtaining offsets of actual mounting positions of individual chips in a first group of chips;
obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips;
adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips; and
wherein said adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips comprises:
adjusting, according to a first proportion of the average offset for the actual mounting positions of the individual chips in the first group of chips, a mounting component for mounting the chip.

2. The method according to claim 1 , wherein said obtaining offsets of actual mounting positions of individual chips in a first group of chips comprises:
obtaining initial calibration positions of the individual chips in the first group of chips;
obtaining the actual mounting positions of the individual chips in the first group of chips; and
obtaining the offsets of the actual mounting positions of the individual chips in the first group of chips according to the initial calibration positions of the individual chips in the first group of chips and the actual mounting positions of the individual chips in the first group of chips.

3. The method according to claim 1 , wherein said adjusting, according to a first proportion of the average offset for the actual mounting positions of the individual chips in the first group of chips, a mounting component for mounting the chip comprises:
adjusting, according to a half of the average offset for the actual mounting positions of the individual chips in the first group of chips, the mounting component for mounting the chip.

4. The method according to claim 1 , wherein said adjusting, according to a first proportion of the average offset for the actual mounting positions of the individual chips in the first group of chips, a mounting component for mounting the chip comprises:
adjusting, according to the first proportion of the average offset for the actual mounting positions of the individual chips in the first group of chips, a suction nozzle or a mechanical arm for mounting the chip.

5. The method according to claim 1 , wherein the offsets of the actual mounting positions of the individual chips in the first group of chips comprise displacement offsets and angle offsets, and said adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips comprises:
adjusting the chip mounting position according to an average displacement offset and an average angle offset for the actual mounting positions of the individual chips in the first group of chips.

6. The method according to claim 5 , wherein said adjusting the chip mounting position according to an average displacement offset and an average angle offset for the actual mounting positions of the individual chips in the first group of chips comprises:
adjusting, according to a first proportion of each of the average displacement offset and the average angle offset for the actual mounting positions of the individual chips in the first group of chips, a mounting component for mounting the chip.

7. The method according to claim 6 , wherein said adjusting, according to a first proportion of each of the average displacement offset and the average angle offset for the actual mounting positions of the individual chips in the first group of chips, a mounting component for mounting the chip comprises:
respectively obtaining a corresponding adjustment amount of a displacement adjustment motor for the mounting component and a corresponding adjustment amount of an angle adjustment motor for the mounting component according to the average displacement offset and the average angle offset for the actual mounting positions of the individual chips in the first group of chips; and
adjusting the mounting component according to the corresponding adjustment amount of the displacement adjustment motor for the mounting component and the corresponding adjustment amount of the angle adjustment motor for the mounting component.

8. The method according to claim 7 , wherein said adjusting the mounting component according to the corresponding adjustment amount of the displacement adjustment motor for the mounting component and the corresponding adjustment amount of the angle adjustment motor for the mounting component comprises:
respectively obtaining a pulse number of the displacement adjustment motor for the mounting component and a pulse number of the angle adjustment motor for the mounting component according to the corresponding adjustment amount of the displacement adjustment motor for the mounting component and the corresponding adjustment amount of the angle adjustment motor for the mounting component; and
adjusting the mounting component according to the pulse number of the displacement adjustment motor for the mounting component and the pulse number of the angle adjustment motor for the mounting component.

9. The method according to claim 5 , wherein the displacement offset comprises a displacement offset in a first direction and a displacement offset in a second direction, and said adjusting the chip mounting position according to an average displacement offset and an average angle offset for the actual mounting positions of the individual chips in the first group of chips comprises:
adjusting the chip mounting position according to an average displacement offset in the first direction, an average displacement offset in the second direction, and the average angle offset for the actual mounting positions of the individual chips in the first group of chips.

10. The method according to claim 1 , further comprising:
giving an alarm when an offset of a chip in the first group of chips exceeds a control limit.

Assignees

• Changxin Memory Tech Inc

Inventors

• Wang Hailin

Classifications

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0606 Primary

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H01L21/67144

  Electricity · mapped topic

• H01L21/67259 Primary

  Electricity · mapped topic