EM source for enhanced plasma control

Patent metadata

Field	Value
Publication number	US-12325909-B2
Application number	US-202217861969-A
Country	US
Kind code	B2
Filing date	Jul 11, 2022
Priority date	Jul 16, 2019
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.

First claim

What is claimed is:

1. A plasma cathode assembly comprising:
a cathode housing having a top, sidewalls and a backing plate enclosing an interior volume with a center axis, the backing plate configured to support a target with an outer diameter during a sputtering process;
a first EM coil inside the interior volume of the cathode housing, the first EM coil having a first inner diameter and a first outer diameter defining a first coil width, and a first bottom surface and a first top surface defining a first coil thickness;
a second EM coil inside the interior volume of the cathode housing, the second EM coil having a second inner diameter and a second outer diameter defining a second coil width and a second bottom surface and a second top surface defining a second coil thickness, wherein the first EM coil is within the second inner diameter, the second inner diameter is smaller than the outer diameter of the target, and the second outer diameter is outside of the outer diameter of the target; and
a plurality of permanent magnets within the first inner diameter of the first EM coil, the plurality of permanent magnets rotating about the center axis of the cathode housing, the first EM coil and the second EM coil configured to enable a tangential magnetic field to be formed directly below the coils by the plurality of permanent magnets having a “D” shape.

2. The plasma cathode assembly of claim 1 , wherein the first EM coil and the second EM coil are positioned concentrically.

3. The plasma cathode assembly of claim 1 , wherein at least one of the first EM coil or the second EM coil are positioned such that a center of the first EM coil or the second EM coil is in alignment with the center axis of the cathode housing.

4. The plasma cathode assembly of claim 1 , wherein at least one of the first EM coil and the second EM coil is moveable relative to the cathode housing.

5. The plasma cathode assembly of claim 4 , wherein the moveable EM coil translates.

6. The plasma cathode assembly of claim 1 , further comprising at least one additional EM coil within the interior volume of the cathode housing, each additional EM coil having an inner diameter and an outer diameter defining a coil width and a bottom surface and a top surface defining a coil thickness, wherein each additional EM coil is positioned so at least one of the first EM coil or second EM coil is within the inner diameter of the additional EM coil.

7. The plasma cathode assembly of claim 1 , wherein at least one permanent magnet is a north pole permanent magnet and at least one permanent magnet is a south pole permanent magnet.

8. A plasma processing chamber comprising:
a chamber body comprising a bottom, sidewalls and a ceiling enclosing a process volume;
a substrate support positioned within the process volume; and
a plasma cathode assembly positioned above the substrate support, the plasma cathode assembly comprising:
a cathode housing having a top, sidewalls and a backing plate enclosing an interior volume with a center axis, the backing plate configured to support a target with an outer diameter;
a first EM coil inside the interior volume of the cathode housing, the first EM coil having a first inner diameter and a first outer diameter defining a first coil width;
a second EM coil inside the interior volume of the cathode housing, the second EM coil having a second inner diameter and a second outer diameter defining a second coil width, wherein the first EM coil is within the second inner diameter, the second inner diameter is smaller than the outer diameter of the target, and the second outer diameter is outside of the outer diameter of the target;
a plurality of permanent magnets within the first inner diameter of the first EM coil, the plurality of permanent magnets rotating about the center axis of the cathode housing, the first EM coil and the second EM coil configured to enable a tangential magnetic field to be formed directly below the coils by the plurality of permanent magnets having a “D” shape.

9. The plasma processing chamber of claim 8 , wherein the first EM coil and the second EM coil are positioned concentrically and at least one of the first EM coil or the second EM coil are positioned such that a center of the first EM coil or the second EM coil is in alignment with the center axis of the cathode housing.

10. The plasma processing chamber of claim 8 , wherein at least one of the first EM coil and the second EM coil is moveable relative to the cathode housing.

11. The plasma processing chamber of claim 8 , wherein the plasma cathode assembly further comprises at least one additional EM coil within the interior volume of the cathode housing, each additional EM coil having an inner diameter and an outer diameter defining a coil width, wherein each additional EM coil is positioned so at least one of the first EM coil or second EM coil is within the inner diameter of the additional EM coil.

12. The plasma processing chamber of claim 8 , wherein at least one permanent magnet is a north pole permanent magnet and at least one permanent magnet is a south pole permanent magnet.

13. The plasma cathode assembly of claim 1 , further comprising a controller configured to control at least one of a spacing of the EM coils and a position of the EM coils within the plasma cathode assembly to control a profile of the plasma.

14. The plasma processing chamber of claim 8 , further comprising a controller configured to control at least one of a spacing of the EM coils and a position of the EM coils within the plasma cathode assembly to control a profile of the plasma.

Assignees

• Applied Materials Inc

Inventors

• Jansen Alexander
• Miller Keith A
• Kothnur Prashanth
• Riker Martin
• Gunther David
• Schooley Emily

Classifications

• H01J37/3455

  Movable magnets · CPC title

• H01J37/3458

  Electromagnets in particular for cathodic sputtering apparatus (electromagnets in general H01F7/06) · CPC title

• H01J37/3461

  Means for shaping the magnetic field, e.g. magnetic shunts · CPC title

• C23C14/3407 Primary

  Cathode assembly for sputtering apparatus, e.g. Target · CPC title

• C23C14/3471

  Introduction of auxiliary energy into the plasma · CPC title