Rehealable and reworkable polymer for electronic packaging

Patent metadata

Field	Value
Publication number	US-12319781-B2
Application number	US-202217651301-A
Country	US
Kind code	B2
Filing date	Feb 16, 2022
Priority date	Feb 16, 2022
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

A composition, process, and device are disclosed. The composition includes a polymer formed by reacting an epoxy compound with an amine curing agent. The epoxy compound comprises a Diels-Alder dimer and an ester moiety. The process includes providing a polymer formed by reacting the epoxy compound with the amine curing agent. The device includes a material that includes the polymer.

First claim

What is claimed is:

1. A process, comprising:
providing a polymer comprising thermally reversible repeat units, wherein:
the polymer is formed by curing a Diels-Alder dimer with an amine curing agent; and
the Diels-Alder dimer comprises an epoxy moiety and an ester moiety;

providing a chip connected to a first location on a laminate by solder balls and by an underfill comprising the polymer; and
removing the chip from the laminate by, while applying heat, treating the underfill with a depolymerization mixture comprising an amine catalyst and a protic solvent.

2. The process of claim 1 , further comprising providing a composite material containing the polymer and about 40-60 wt. % filler particles.

3. The process of claim 2 , wherein the composite material is selected from the group consisting of a capillary underfilling and a thermal interface material.

4. The process of claim 1 , wherein the polymer is removable from a substrate by treatment with the depolymerization mixture.

5. The process of claim 1 , further comprising:
providing an electronic package that includes an underfill comprising the polymer; and
healing a defect in the underfill, wherein the healing comprises heating the underfill to about 120° C.

6. The process of claim 1 , wherein the polymer is rehealable at temperatures of approximately 30° C. or higher.

7. The process of claim 1 , further comprising mixing the polymer with a radical inhibitor.

8. The process of claim 1 , further comprising:
cleaning residue from the first location on the laminate, wherein the cleaning comprises using the depolymerization mixture to remove the residue; and
connecting a new chip to the laminate at the cleaned first location.

9. The process of claim 1 , wherein the amine catalyst is selected from the group consisting of triethylamine (TEA) and 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU).

10. The process of claim 1 , wherein the polymer has the following structure:

wherein R is an organic moiety.

11. The process of claim 1 , wherein the Diels-Alder dimer is Thiele's acid diglycidyl ester.

12. The process of claim 1 , wherein the Diels-Alder dimer comprises a cyclopentadiene moiety.

13. The process of claim 1 , wherein the amine curing agent is 4,7,10-trioxatridecane-1,13-diamine.

14. The process of claim 1 , wherein the amine curing agent is 4,4-methylenebis (2-ethylaniline).

15. The process of claim 1 , wherein the thermally reversible repeat units are able to undergo reverse dimerization at temperatures below 130° C.

16. The process of claim 1 , wherein the amine catalyst is triethylamine (TEA) and the protic solvent is methanol.

17. The process of claim 16 , wherein the applying heat comprises heating the depolymerization mixture to about 50-60° C.

18. The process of claim 16 , wherein the depolymerization mixture further comprises N-methylpyrrolidone.

19. The process of claim 1 , wherein the amine catalyst is 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU) and the protic solvent is glycerol.

20. The process of claim 19 , wherein the applying heat comprises heating the depolymerization mixture to about 175° C.

Assignees

• IBM

Inventors

• Wojtecki Rudy J
• Breyta Gregory
• Sikka Kamal K
• Magbitang Teddie P

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title