Diene/dienophile couples and thermosetting resin compositions having reworkability

Patent metadata

Field	Value
Publication number	US-10472548-B2
Application number	US-201715795501-A
Country	US
Kind code	B2
Filing date	Oct 27, 2017
Priority date	Mar 22, 2013
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

First claim

What is claimed is:

1. A curable composition, reaction products of which are controllably degradable upon exposure to a temperature condition greater than a temperature condition used to cure the composition, comprising:
(a) a curable resin component;
(b) a curative and
(c) a diene/dienophile couple functionalized with at least two groups reactive with the curable resin component, wherein the diene/dienophile couple is selected from

wherein X is CH 2 , O, S, or NR, wherein R is H, alkyl, aryl or aralkyl; Y is O, S or NR, wherein R is H, alkyl, aryl or aralkyl; A is alkylene; Z is H, (meth)acryloyl, glycidyl or a group containing polymerizable functionality; n is 0 or 1; and m is 2-4, and isomers thereof, and combinations thereof; or

wherein X 1 and X 2 are the same or different, and are each independently selected from CH 2 , O, S, or NR, wherein R is H, alkyl, aryl or aralkyl; Y 1 and Y 2 are the same or different, and are each independently selected from O, S or NR, wherein R is H, alkyl, aryl or aralkyl; A 1 and A 2 are the same or different and are each independently alkylene; Z 1 and Z 2 are the same or different, and are each independently selected from H, (meth)acryloyl, glycidyl or one or more of groups containing polymerizable functionalities; and n 1 and n 2 are the same or different, and are each independently 0 or 1, wherein the curative is selected from one or more of imidazoles, dicyandimide, carboxylic acids, anhydrides, phenolic hardeners, amines, thiols, alcohols, and alkalines.

2. The composition of claim 1 , wherein the curable resin component is a member selected from the group consisting of epoxy, episulfide, oxetane, thioxetane, oxazine, maleimide, itaconamide, nadimide, (meth)acrylate, (meth)acrylamide, and combinations thereof.

3. The composition of claim 1 , wherein the two reactive groups are the same.

4. The composition of claim 1 , wherein the two reactive groups are different.

5. The composition of claim 1 , wherein the diene of the diene/dienophile couple is cyclopentadiene.

6. The composition of claim 1 , wherein the dienophile of the diene/dienophile couple is cyclopentadiene.

7. The composition of claim 1 , wherein the greater temperature condition is about 170° C. or greater.

8. The composition of claim 1 , wherein the cure temperature condition is about 100° C. to about 150° C.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Champagne Timothy M
• Sridhar Laxmisha M
• Israel Jonathan B
• Klemarczyk Philip T
• Zhang Xianman
• Jordan Benny E

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title