Apparatus and method for self-assembling semiconductor light emitting diodes

Patent metadata

Field	Value
Publication number	US-12315754-B2
Application number	US-202018024371-A
Country	US
Kind code	B2
Filing date	Sep 29, 2020
Priority date	Sep 29, 2020
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

A semiconductor light emitting diode self-assembling device according to the present invention comprises: an assembly chamber in which fluid and semiconductor light emitting diodes are received; a magnetic chuck disposed above the assembly chamber and applying, while moving in a horizontal direction, a magnetic force thereto so as to induce movement of the semiconductor light emitting diodes in the assembly chamber; a substrate chuck for placing an assembly substrate, on which the semiconductor light emitting diodes in the assembly chamber are seated, between the assembly chamber and the magnetic chuck and supporting the assembly substrate; and a control part for controlling the driving of the magnetic chuck and the substrate chuck, wherein the magnetic chuck includes: a magnetic force forming part including a plurality of magnets; and a vacuum forming part for correcting a bending phenomenon of the assembly substrate by using vacuum pressure between the plurality of magnets so as to maintain a predetermined interval between one side of the magnetic chuck and the assembly substrate.

First claim

The invention claimed is:

1. A device for self-assembling semiconductor light-emitting diodes, the device comprising:
an assembly chamber in which a fluid and the semiconductor light emitting diodes are accommodated;
a magnetic chuck disposed above the assembly chamber and configured to apply magnetic force, while moving in a horizontal direction, to induce movement of the semiconductor light emitting diodes within the assembly chamber;
a substrate chuck configured to dispose an assembly substrate, on which the semiconductor light emitting diodes inside the assembly chamber are to be seated, between the assembly chamber and the magnetic chuck and to support the assembly substrate; and
a control part configured to control operations of the magnetic chuck and the substrate chuck,
wherein the magnetic chuck comprises:
a magnetic force forming part including a plurality of magnets; and
a vacuum forming part configured to correct a bending phenomenon of the assembly substrate by using vacuum pressure between the plurality of magnets so that a predetermined distance is maintained between one side of the magnetic chuck and the assembly substrate.

2. The device of claim 1 , wherein the magnetic force forming part comprises:
magnet accommodating portions arranged in a plurality of rows and columns and having spaces for accommodating some of the plurality of magnets;
assembly magnets disposed in the magnet accommodating portions; and
first cushion magnets disposed outside the magnet accommodating portions to be spaced apart from the assembly magnets, respectively.

3. The device of claim 2 , wherein the magnet accommodating portion includes an opening at one side thereof adjacent to the assembly substrate, and
wherein a portion of the assembly magnet is exposed through the opening.

4. The device of claim 3 , wherein the magnetic force forming part further comprises second cushion magnets each disposed between the first cushion magnet and the assembly magnet, and
wherein each of the second cushion magnets is fixedly disposed on one surface inside the magnet accommodating portion.

5. The device of claim 4 , wherein a repulsive force acts between the first cushion magnet and the second cushion magnet, and an attractive force acts between the second cushion magnet and the assembly magnet.

6. The device of claim 1 , wherein the vacuum forming part comprises vacuum holes disposed between the plurality of magnets, and each having one side connected to a vacuum pump to apply vacuum pressure to the assembly substrate.

7. The device of claim 1 , wherein the substrate chuck comprises a power supply part for applying power to the assembly substrate so that an electric field is formed on one surface of the assembly substrate.

8. The device of claim 2 , wherein the magnetic chuck is disposed so that one side of the magnetic chuck and the assembly substrate have a gap of 2 mm or less, and
wherein the one side of the magnetic chuck is one surface of the assembly magnet adjacent to the assembly substrate.

9. The device of claim 1 , further comprising a sensor unit disposed below the assembly chamber to monitor the inside of the assembly chamber.

10. A method for self-assembling semiconductor light-emitting diodes, the method comprising:
supplying the semiconductor light-emitting diodes into an assembly chamber containing a fluid;
disposing an assembly substrate on a top of the assembly chamber, the assembly substrate including assembly electrodes and cells on which the semiconductor light emitting diodes are seated;
disposing a magnetic chuck above the assembly substrate, the magnetic chuck including a magnetic force forming part including a plurality of magnets and a vacuum forming part; and
seating the semiconductor light-emitting diodes on the assembly substrate using a magnetic field and an electric field,
wherein vacuum pressure is continuously applied to the assembly substrate by the vacuum forming part while the step of seating the semiconductor light emitting diodes on the assembly substrate is in progress.

11. The method of claim 10 , wherein the magnetic force forming part comprises:
magnet accommodating portions arranged in a plurality of rows and columns and having spaces for accommodating some of the plurality of magnets;
assembly magnets disposed in the magnet accommodating portions; and
first cushion magnets disposed outside the magnet accommodating portions to be spaced apart from the assembly magnets, respectively.

12. The method of claim 11 , wherein the magnetic force forming part further comprises second cushion magnets each disposed between the first cushion magnet and the assembly magnet, and
wherein each of the second cushion magnets is fixedly disposed on one surface inside the magnet accommodating portion.

13. The method of claim 11 , wherein the arranging the magnetic chuck is configured such that the assembly substrate and one surface of the assembly magnet adjacent to the assembly substrate have a gap of 2 mm or less.

14. The method of claim 11 , wherein the seating the semiconductor light emitting diodes on the assembly substrate is configured such that an electric field is formed as power is applied to the assembly electrodes.

15. The method of claim 14 , wherein the seating the semiconductor light emitting diodes on the assembly substrate comprises:
moving the magnetic chuck in a horizontal direction; and
applying power to at least some of the assembly electrodes overlapping the assembly magnets.

16. The method of claim 15 , wherein at least some of the assembly magnets are further moved in a vertical direction during a process of moving the magnetic chuck in the horizontal direction.

Assignees

• Lg Electronics Inc

Inventors

• Kim Kisu
• Lee Jinhyung
• Shin Yongil

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title