Semiconductor substrate boat and methods of using the same

US12308266B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12308266-B2
Application numberUS-202017039356-A
CountryUS
Kind codeB2
Filing dateSep 30, 2020
Priority dateSep 30, 2020
Publication dateMay 20, 2025
Grant dateMay 20, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers have a plurality of different shapes and a substrate surface no contact region.

First claim

Opening claim text (preview).

The invention claimed is: 1. A substrate boat, comprising: a top plate; a bottom plate; and a plurality of boat rods extending between the top plate and the bottom plate, each of the plurality of boat rods including at least one finger, the at least one finger including: a first portion that includes a first end adjacent the respective boat rod, the first portion extends inward toward a center of the substrate boat from the respective boat rod, the first portion including a second end opposite the first end, and the first portion of the finger comprising a no-contact top surface which, in operation, does not contact a backside of a substrate; a plurality of second portions that each extends inward toward the center of the substrate boat from the second end of the first portion, the plurality of second portions comprising respective planar substrate contact surfaces, which, in operation, contact the backside of the substrate; and one or more substrate no-contact regions, each of the one or more substrate no-contact regions comprising a void space located laterally between adjacent ones of the second portions, in operation, the one or more substrate no-contact regions are overlapped by the substrate. 2. The substrate boat of claim 1 , wherein the finger further an underside surface that, in operation, does not contact the substrate. 3. The substrate boat of claim 1 , wherein the finger of each of the plurality of boat rods lie in a common horizontal plane. 4. The substrate boat of claim 3 , wherein each of the plurality of boat rods includes a plurality of fingers. 5. The substrate boat of claim 1 , wherein the finger includes three or more second portions. 6. The substrate boat of claim 5 , wherein each of the three or more second portions have a rectangular shape. 7. The substrate boat of claim 1 , wherein the finger includes two second portions, each of the two second portions occupying a common horizontal plane and including a longitudinal axis separated from each other by an angle between 30 degrees and 90 degrees. 8. The substrate boat of claim 1 , wherein a surface area of the plurality of substrate contact surfaces is less than the sum of an area of the one or more substrate no-contact regions and the surface area of the plurality of substrate contact surfaces. 9. The substrate boat of claim 1 , wherein the finger includes one or more perforation passing from an underside surface to the substrate contact surface. 10. A substrate boat, comprising: a top plate; a bottom plate; and a plurality of boat rods extending between the top plate and the bottom plate, each of the plurality of boat rods including a finger, the finger including: a first portion that includes a first end adjacent the respective boat rod, the first portion extends inward toward a center of the substrate boat from the respective boat rod, the first portion including a second end opposite the first end, and the first portion of the finger comprising a no-contact top surface which, in operation, does not contact a backside of a substrate; a plurality of second portions that each extends inward toward the center of the substrate boat from the second end of the first portion, the plurality of second portions comprising respective substrate contact surfaces, which, in operation, contact the backside of the substrate; and a substrate no-contact region comprising a void space located laterally between adjacent ones of the plurality of second portions, in operation, the substrate no-contact region is overlapped by the substrate. 11. The substrate boat of claim 10 , wherein the finger includes two second portions, each of the two second portions lying in a common horizontal plane and including a longitudinal axis separated from each other by an angle between 30 degrees and 90 degrees. 12. The substrate boat of claim 10 , wherein the plurality of substrate contact surfaces are triangular in shape. 13. The substrate boat of claim 10 , wherein the finger includes one or more perforations extending between the backside and the plurality of substrate contact surfaces. 14. The substrate boat of claim 10 , wherein the plurality of substrate contact surfaces are rectangular in shape. 15. The substrate boat of claim 10 , wherein the finger further comprises an underside surface that, in operation, does not contact the substrate. 16. The substrate boat of claim 10 , wherein each of the plurality of boat rods includes a plurality of fingers. 17. The substrate boat of claim 10 , wherein the finger includes three or more second portions. 18. The substrate boat of claim 10 , wherein a surface area of the plurality of substrate contact surfaces is less than the sum of an area of the substrate no-contact region and the surface area of the plurality of substrate contact surfaces. 19. A substrate boat, comprising: a plurality of boat rods extending between a top plate and a bottom plate, each of the plurality of boat rods including a finger, the finger including: a first portion that includes a first end adjacent the respective boat rod, the first portion extends inward toward a center of the substrate boat from the respective boat rod, the first portion including a second end opposite the first end, and the first portion of the finger comprising a no-contact top surface which, in operation, does not contact a backside of a substrate; a plurality of second portions that each extends inward toward the center of the substrate boat from the second end of the first portion, the plurality of second portions comprising respective substrate contact surfaces, which, in operation, contact the backside of the substrate; one or more substrate no-contact regions, each of the one or more substrate no-contact regions comprising a void space located laterally between adjacent ones of the plurality of substrate contact surfaces; and one or more perforations passing from an underside surface to the substrate contact surfaces, wherein a surface area of the plurality of substrate contact surfaces is less than the sum of an area of the one or more substrate no-contact regions and the surface area of the plurality of substrate contact surfaces. 20. The substrate boat of claim 19 , wherein the plurality of substrate contact surfaces have a rectangular shape.

Assignees

Inventors

Classifications

  • Thermal treatments, e.g. annealing or sintering · CPC title

  • characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

  • Apparatus for thermal treatment · CPC title

  • H10P72/127Primary

    characterised by the substrate support · CPC title

  • H10P72/145Primary

    characterised by a material, a roughness, a coating or the like · CPC title

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What does patent US12308266B2 cover?
A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/127. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).