High density coil design and process

Patent metadata

Field	Value
Publication number	US-12308157-B2
Application number	US-202217985715-A
Country	US
Kind code	B2
Filing date	Nov 11, 2022
Priority date	Nov 18, 2016
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

First claim

What is claimed is:

1. A coil structure comprising:
a substrate including at least a first solder joint and a second solder joint; and
a plurality of surface mount circuits including a first surface mount circuit, a second surface mount circuit, and a third surface mount circuit, wherein the first solder joint is formed to provide a first electrical contact between the first surface mount circuit and the second surface mount circuit, and the second solder joint is formed to provide a second electrical contact between the second surface mount circuit and the third surface mount circuit,
wherein each of the surface mount circuits are disposed on separate portions of the substrate and electrically coupled to each other through at least the first solder joint and the second solder joint, and wherein each of the first solder joint and the second solder joint include a substrate solder pad and a surface mount circuit solder pad, wherein the substrate solder pad is formed by creating a void created in the substrate to expose a portion of a conductive layer disposed adjacent to the substrate, and wherein solder is disposed over the substrate solder pad and the circuit solder pad.

2. The coil structure of claim 1 , wherein the substrate is a flexible printed circuit (FPC).

3. The coil structure of claim 1 , wherein the substrate is a circuit.

4. The coil structure of claim 1 , wherein at least one of the plurality of surface mount circuits is a surface mount coil.

5. The coil structure of claim 1 , wherein the substrate includes a center portion coupled to an outer portion by one or more connecting portions, at least one of the plurality of surface mount circuits disposed on the center portion.

6. The coil structure of claim 5 , wherein one or more terminal pads are disposed on the outer portion and the one or more terminal pads are coupled with at least one of the plurality of surface mount circuits disposed on the center portion by one or more traces disposed in part on at least one of the one or more connecting portions.

7. The coil structure of claim 1 , wherein the substrate includes at least one out-of-plane portion such that the substrate is non-planar.

8. The coil structure of claim 7 , wherein at least one of the plurality of surface mount circuits is disposed on the out-of-plane portion.

Assignees

• Hutchinson Technology

Inventors

• Schumann John L
• German Nole D
• Johnson Trent A
• Jelkin Duane M
• Lang Matthew S
• Ruzicka Ryan N
• Cravens Forrest A
• Peter Todd A
• Pokornowski Zachary A

Classifications

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• H05K2201/10363

  Jumpers, i.e. non-printed cross-over connections · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• G11B5/484

  Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit · CPC title