Grinding wheel

Patent metadata

Field	Value
Publication number	US-12304029-B2
Application number	US-202218053541-A
Country	US
Kind code	B2
Filing date	Nov 8, 2022
Priority date	Nov 25, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A grinding wheel is mounted on a tip end of a spindle and the grinding wheel grinds a workpiece according to rotation of the spindle. The grinding wheel includes an annular base, and a plurality of grindstone sets disposed in an annular manner on one surface side of the base along a circumferential direction of the base. Each of the plurality of grindstone sets has a first grindstone and a second grindstone having a self-sharpening capability lower than that of the first grindstone, such that the first grindstone and the second grindstone are adjacent to each other in a predetermined orientation in the circumferential direction of the base, and a predetermined interval larger than an interval between the first grindstone and the second grindstone in the circumferential direction of the base is provided between adjacent ones of the grindstone sets.

First claim

What is claimed is:

1. A grinding method of grinding a workpiece having a single crystal substrate formed with a non-single crystal layer on a front surface of the substrate, with use of a grinding wheel,
the grinding wheel including
an annular base, and
a plurality of grindstone sets disposed in an annular manner on one surface side of the base along a circumferential direction of the base,
in which each of the plurality of grindstone sets has a first grindstone and a second grindstone having a self-sharpening capability lower than that of the first grindstone, such that the first grindstone and the second grindstone are adjacent to each other in a predetermined orientation in the circumferential direction of the base, and
a predetermined interval larger than an interval between the first grindstone and the second grindstone in the circumferential direction of the base is provided between adjacent ones of the grindstone sets,

the grinding method comprising:
a holding step of holding under suction, on a chuck table, a back surface of the substrate that is positioned opposite to the front surface of the substrate;
a first grinding step of rotating a spindle in a predetermined direction such that the second grindstone is set in front of the first grindstone in each of the grindstone sets, to grind the front surface of the substrate, thereby removing the non-single crystal layer, after the holding step is carried out; and
a second grinding step of rotating the spindle in a direction opposite to the predetermined direction such that the first grindstone is set in front of the second grindstone in each of the grindstone sets, to grind the substrate, after the first grinding step is carried out.

2. A grinding method of grinding a workpiece having a substrate formed with a film on a front surface of the substrate, with use of a grinding wheel,
the grinding wheel including
an annular base, and
a plurality of grindstone sets disposed in an annular manner on one surface side of the base along a circumferential direction of the base,
in which each of the plurality of grindstone sets has a first grindstone and a second grindstone having a self-sharpening capability lower than that of the first grindstone, such that the first grindstone and the second grindstone are adjacent to each other in a predetermined orientation in the circumferential direction of the base, and
a predetermined interval larger than an interval between the first grindstone and the second grindstone in the circumferential direction of the base is provided between adjacent ones of the grindstone sets,

the grinding method comprising:
a holding step of holding under suction, on a chuck table, a back surface of the substrate that is positioned opposite to the front surface of the substrate;
a first grinding step of rotating a spindle in a predetermined direction such that the first grindstone is set in front of the second grindstone in each of the grindstone sets, to grind the film, thereby removing the film, after the holding step is carried out; and
a second grinding step of rotating the spindle in a direction opposite to the predetermined direction such that the second grindstone is set in front of the first grindstone in each of the grindstone sets, to grind the substrate, after the first grinding step is carried out.

Assignees

• Disco Corp

Inventors

• Nagami Masaru

Classifications

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B7/228 Primary

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24D7/06

  with inserted abrasive blocks, e.g. segmental · CPC title