Composite magnetic particle including metal magnetic particle
US-11942249-B2 · Mar 26, 2024 · US
Multilayer coil device and method of manufacturing the same
US12300409B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12300409-B2 |
| Application number | US-202217571640-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2022 |
| Priority date | Jan 22, 2021 |
| Publication date | May 13, 2025 |
| Grant date | May 13, 2025 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.
First claim
Opening claim text (preview).
What is claimed is: 1. A multilayer coil device comprising an element formed by laminating a coil conductor and a magnetic element body, wherein the magnetic element body comprises soft magnetic particles and an epoxy resin, the soft magnetic particles include soft magnetic metal particles, the epoxy resin has an epoxy value of 150 or less, the epoxy resin is filled in gap spaces between the soft magnetic particles, a mass ratio of the epoxy resin to a total mass of the coil conductor and the magnetic element body is 1.6 mass % or more and 4.1 mass % or less, and the epoxy resin comprises an epoxy resin of a formula (1): 2. The multilayer coil device according to claim 1 , wherein the soft magnetic particles comprise oxide films covering the soft magnetic metal particles. 3. The multilayer coil device according to claim 2 , wherein the oxide films have an average thickness of 5 nm or more and 60 nm or less. 4. The multilayer coil device according to claim 1 , wherein the soft magnetic metal particles have a Fe content of 92.5 mass % or more and 97.0 mass % or less and a Si content of 3.0 mass % or more and 7.5 mass % or less, and the soft magnetic metal particles do not substantially include Cr. 5. A method of manufacturing a multilayer coil device comprising an element formed by laminating a coil conductor and a magnetic element body, the method comprising a step of impregnating the element with an epoxy resin having an epoxy value of 150 or less, wherein a mass ratio of the epoxy resin to a total mass of the coil conductor and the magnetic element body is 1.6 mass % or more and 4.1 mass % or less, and the epoxy resin comprises an epoxy resins of a formula (1):
Assignees
Inventors
Classifications
- C22C38/02Primary
containing silicon · CPC title
Magnetic · CPC title
Ingredients treated with inorganic substances · CPC title
together with di-epoxy compounds · CPC title
Magnetic additives · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12300409B2 cover?
- A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification C22C38/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 13 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).