Methods to produce organotin compositions with convenient ligand providing reactants
US-2022064192-A1 · Mar 3, 2022 · US
US12298666B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12298666-B2 |
| Application number | US-202418654160-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 3, 2024 |
| Priority date | Jun 15, 2021 |
| Publication date | May 13, 2025 |
| Grant date | May 13, 2025 |
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As described herein, photosensitive composition comprises RSnL 3 , where R is a hydrocarbyl ligand with 1-20 carbon atoms and one or more silicon and/or germanium heteroatoms and L is an acetylide ligand (—C≡CA, where A is a silyl group with 0 to 6 carbon atoms or an organo group with 1 to 10 carbon atoms). Methods are described wherein photosensitive compositions are synthesized by reacting RX, where X is a halide, and MSnL 3 , where M is an alkali metal, alkali earth metal or a pseudo-alkali earth metal, L is an acetylide or a dialkylamide. The radiation sensitive compositions are effective for radiation based patterning, such as with EUV light.
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What we claim is: 1. A method for patterning an organometallic compound comprising: forming a coating on a substrate, wherein forming the coating comprises depositing RSnL 3 , wherein R is a hydrocarbyl group with 1-20 carbon atoms and one or more silicon or germanium heteroatoms, and L is a hydrolysable ligand; irradiating the coating with radiation to form a latent image; and developing the image to form a patterned coating with nanoscale features according to the latent image. 2. The method of claim 1 wherein the hydrolysable ligand comprises an alkoxide, a dialkylamide, or an alkyl/silyl acetylide. 3. The method of claim 1 wherein the substrate comprises silicon. 4. The method of claim 1 wherein the depositing comprises vapor deposition, spin coating, spray coating, or dip coating. 5. The method of claim 1 wherein the coating has an average thickness from 0.5 nm to 100 nm. 6. The method of claim 1 wherein the coating has a root-mean square surface roughness of less than 0.5 nm as measured by atomic force microscopy. 7. The method of claim 1 further comprising heating the coating to a temperature between about 30° C. and 300° C. for a period of time of about 10 seconds to about 10 minutes prior to irradiating the coating. 8. The method of claim 1 wherein the heating is performed under controlled partial pressures of gases, wherein the gases comprise H 2 O, CO 2 , CO, H 2 , N 2 , H 2 S, HCl, an inert gas, or a combination thereof. 9. The method of claim 1 wherein the irradiating comprises UV radiation or EUV radiation at a dose of about 1 mJ/cm 2 about 200 mJ/cm 2 or an electron beam at a dose equivalent to or not exceeding about 2 mC/cm 2 at 30 kV. 10. The method of claim 1 further comprising heating the coating to a temperature of 45° C. to about 300° C. for a period of time of at least about 0.1 minute to about 30 minutes after irradiating the coating the coating. 11. The method of claim 1 wherein the developing comprises an organic solvent or wherein the developing comprises a solvent-free process.
with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists (G03F7/075 takes precedence) · CPC title
having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title
Finishing the coated layer, e.g. drying, baking, soaking · CPC title
Compounds having one or more tin-oxygen linkages · CPC title
Compounds having tin linked only to carbon, hydrogen and/or halogen · CPC title
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