Method for mass transfer of mini light-emitting diodes (mini-LEDs) using sliding-on-membrane pin ejection

Patent metadata

Field	Value
Publication number	US-12289932-B2
Application number	US-202418769413-A
Country	US
Kind code	B2
Filing date	Jul 11, 2024
Priority date	Aug 8, 2023
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

An ejector pin sliding on membrane-based device and method for mass transfer of mini light-emitting diodes (Mini-LEDs) are provided. The device includes a gantry transverse beam. The gantry transverse beam is provided with an ejector pin base, and the ejector pin base is configured to move along the gantry transverse beam. The ejector pin base is fixedly provided with a vision camera and an ejector pin. A blue membrane is horizontally provided at a side of the gantry transverse beam close to the ejector pin, and is spaced from the gantry beam. A surface of a side of the blue membrane away from the gantry transverse beam is adhesively provided with a plurality of Mini-LED chips arranged evenly. A transfer substrate is horizontally provided at a side of the blue membrane close to the plurality of Mini-LED chips, and is spaced from the blue membrane.

First claim

What is claimed is:

1. A method for mass transfer of a mini light-emitting diode (Mini-LED), comprising:
(S1) placing horizontally and fixing a blue membrane to which a plurality of Mini-LED chips are bonded; and placing horizontally and fixing a transfer substrate on a side of the blue membrane close to the plurality of Mini-LED chips;
(S2) detecting and adjusting, by a vision camera fixed on an ejector pin base, a height of the transfer substrate and a height of the blue membrane; wherein the vision camera is configured to identify positions of the plurality of Mini-LED chips through the blue membrane; and controlling a gantry transverse beam to move in a Y-axis direction, and controlling the ejector pin base to move in an X-axis direction, so as to drive the vision camera to position the plurality of Mini-LED chips;
(S3) after completing the positioning of the plurality of Mini-LED chips by the vision camera, performing a sliding-on-membrane pin ejection for Mini-LED chips among the plurality of Mini-LED chips in a first row along the X-axis direction; wherein an ejector pin is driven by the ejector pin base to perform a uniform movement in a positive X-axis direction along the gantry transverse beam; when the ejector pin arrives at a position which is away from a first Mini-LED chip in the first row at a preset distance, the ejector pin is controlled by the ejector pin base to move along a negative X-axis direction at a certain velocity to reduce a velocity of the ejector pin such that the ejector pin is stopped at the first Mini-LED chip in the first row to perform the sliding-on-membrane pin ejection, and at the same time, the ejector pin is controlled by the ejector pin base to move along a negative Z-axis direction to drive the blue membrane and the first Mini-LED chip in the first row to fall; during a falling process, the blue membrane is deformed, and an adhesive layer between the blue membrane and the first Mini-LED chip in the first row is torn from an edge of the first Mini-LED chip in the first row; and upon being in contact with the transfer substrate, the first Mini-LED chip in the first row is peeled off from the blue membrane under an action of an adhesion of the transfer substrate to realize the sliding-on-membrane pin ejection; and
after the sliding-on-membrane pin ejection on the first Mini-LED chip in the first row is completed, stopping controlling the ejector pin to move along the negative X-axis direction, and then performing the sliding-on-membrane pin ejection on a second Mini-LED chip in the first row, and so on, until the sliding-on-membrane pin ejection of the Mini-LED chips in the first row is completed; wherein the velocity of the ejector pin along the negative X-axis direction is less than a movement velocity of the ejector pin base along the positive X-axis direction; and
(S4) after completing the sliding-on-membrane pin ejection of the Mini-LED chips in the first row, controlling the gantry transverse beam to move in the Y-axis direction to allow the ejector pin to be aligned with a first Mini-LED chip in a second row among the plurality of Mini-LED chips based on identification of the vision camera; repeating step (S3) to perform the sliding-on-membrane pin ejection and transfer until the sliding-on-membrane pin ejection of the plurality of Mini-LED chips is completed.

Assignees

• Univ Guangdong Technology

Inventors

• Chen Yun
• Chen Yanhui
• Ma Li
• Zhang Hao
• Chen Jintao
• Hou Maoxiang
• Chen Xin

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title