Substrate module and power module for transformer

Patent metadata

Field	Value
Publication number	US-12289835-B2
Application number	US-202117790564-A
Country	US
Kind code	B2
Filing date	Jan 5, 2021
Priority date	Jan 9, 2020
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A substrate module according to an embodiment of the present invention comprises: a first substrate which includes transformer connection part to be connected to terminals of a transformer, at least one second substrate on which a switch module to be connected to the transformer is formed; and a conductive connector which connects the first substrate and the second substrate to each other, wherein the first substrate and the second substrate are arranged by the conductive connector such that a predetermined angle is formed therebetween.

First claim

The invention claimed is:

1. A substrate module comprising:
a first substrate comprising a transformer connection part connected to terminals of a transformer;
at least one second substrate including a switch module connected to the transformer; and
a conductive connection plate for connecting the first substrate and the at least one second substrate to each other, the conductive connection plate having a bend,
wherein the first substrate and the at least one second substrate are connected to each other by the conductive connection plate at a predetermined angle formed therebetween, the predetermined angle corresponding to an angle of the bend,
wherein the first substrate is located on an upper surface of the transformer,
wherein the at least one second substrate comprises a first-second substrate and a second-second substrate spaced apart from the first-second substrate, and
wherein the-first-second substrate and the second-second substrate are each connected at a first end forming the predetermined angle on opposite sides of the first substrate, and a second end of each is connected to a main substrate located on a lower surface of the transformer.

2. The substrate module according to claim 1 , wherein the transformer connection part is connected to terminals of a secondary coil of the transformer.

3. The substrate module according to claim 1 , wherein the first substrate comprises an inductor connection part connected to terminals of a secondary-side inductor disposed on one side of the transformer.

4. The substrate module according to claim 3 , wherein the transformer connection part is formed of a plurality of holes connected to a plurality of terminals of the transformer, and the inductor connection part is formed of a plurality of holes connected to the terminals of the secondary-side inductor.

5. The substrate module according to claim 4 , wherein the first substrate comprises a busbar for connecting the transformer connection part and the conductive connection plate, and the inductor connection part and the conductive connection plate.

6. The substrate module according to claim 5 , wherein the busbar comprises a first busbar connected to terminals of a first coil of the transformer and a second busbar connected to terminals of a secondary coil of the transformer.

7. The substrate module according to claim 6 , wherein the first busbar is spaced apart from the second busbar.

8. The substrate module according to claim 1 , wherein the switch module comprises a plurality of FET modules disposed on a first surface of the at least one second substrate and a control module disposed on a second surface of the at least one second substrate to control the plurality of FET modules.

9. The substrate module according to claim 8 , wherein a heat dissipation part for dissipating heat generated at the switch module to outside is disposed on the second surface of the at least one second substrate.

10. The substrate module according to claim 1 , comprising:
a third substrate on which a switch module connected to a primary coil of the transformer is formed,
wherein the third substrate is connected to the at least one second substrate.

11. The substrate module according to claim 1 , wherein the first substrate comprises an inductor connection part connected to terminals of a secondary-side inductor disposed on one side of the transformer.

12. A power module comprising:
a transformer; and
a substrate module comprising a switch module connected to a primary coil or a secondary coil of the transformer to input or to receive voltage or current, and to control input and output of the voltage or the current,
wherein the substrate module comprises:
a first substrate on which a transformer connection part connected to terminals of the transformer is formed; and
at least one second substrate on which the switch module for controlling the transformer is formed, and

wherein the first substrate and the at least one second substrate are connected by a conductive connection plate having a bend at a predetermined angle,
wherein the first substrate is located on an upper surface of the transformer,
wherein the at least one second substrate comprises a first-second substrate and a second-second substrate spaced apart from the first-second substrate, and
wherein the first-second substrate and the second-second substrate are each connected at a first end forming the predetermined angle on opposite sides of the first substrate, and a second end of each is connected to a main substrate located on a lower surface of the transformer.

13. The power module according to claim 12 , wherein the first substrate comprises an inductor connection part connected to terminals of a secondary-side inductor disposed on one side of the transformer.

14. The power module according to claim 13 , wherein the first substrate comprises a busbar for connecting the transformer connection part and the conductive connection plate, and the inductor connection part and the conductive connection plate.

15. The power module according to claim 12 , wherein the switch module comprises a plurality of FET modules disposed on a first surface of the at least one second substrate and a control module disposed on a second surface of the at least one second substrate to control the plurality of FET modules.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Soo San
• Park Sung June
• Cho Yong Seok

Classifications

• H10W90/00

  Package configurations · CPC title

• H05K2201/10901

  Lead partly inserted in hole or via · CPC title

• H05K2201/10545

  Related components mounted on both sides of the PCB · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• H05K2201/10166

  Transistor · CPC title