Method for shielding a printed circuit board from electromagnetic interference and noise during testing

Patent metadata

Field	Value
Publication number	US-12289822-B2
Application number	US-202318359805-A
Country	US
Kind code	B2
Filing date	Jul 26, 2023
Priority date	Apr 12, 2019
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

First claim

What is claimed is:

1. A method for shielding a printed circuit board from electromagnetic interference and noise during noise figure testing, comprising:
unsealing a cover from a housing to expose a printed circuit board in a cavity defined by a peripheral wall, the printed circuit board having at least one radiofrequency component mounted thereon;
removing soldering between electrical contacts on the printed circuit board and one or more pins of one or more radiofrequency connectors attached to the peripheral wall;
detaching the one or more radiofrequency connectors from the peripheral wall; and
removing the printed circuit board and inserting into the cavity a replacement printed circuit board having a radiofrequency component mounted thereon.

2. The method of claim 1 further comprising:
reattaching the one or more radiofrequency connectors to the peripheral wall so that the one or more pins of the one or more radiofrequency connectors substantially align with electrical contacts of the replacement printed circuit board;
soldering the one or more pins of the one or more radiofrequency connectors to the electrical contacts of the replacement printed circuit board; and
mounting the cover to the housing over the cavity to at least partially seal the cavity.

3. The method of claim 2 wherein reattaching the one or more radiofrequency connectors comprises mounting one or more flange mount radiofrequency connectors to the housing so that a flange of the one or more flange mount radiofrequency connectors couples to an outer surface of the peripheral wall and so that a pin of the one or more flange mount radiofrequency connectors extends through an opening in the peripheral wall that generally aligns with the electrical contact of the replacement printed circuit board.

4. The method of claim 1 wherein the peripheral wall is defined by a first pair of spaced a part walls that are generally perpendicular to a second pair of spaced apart walls.

5. The method of claim 1 wherein inserting the replacement printed circuit board into the cavity includes inserting printed circuit board so that it is disposed over an inner lower shoulder of the housing.

6. The method of claim 5 further comprising at least partially inserting a gasket into a groove defined in the inner lower shoulder prior to inserting the replacement printed circuit board into the cavity.

7. The method of claim 6 wherein the gasket comprises an electromagnetic isolator elastomer.

8. The method of claim 1 further comprising at least partially inserting a gasket into a groove on a rim of the peripheral wall prior to mounting the cover to the housing.

9. The method of claim 8 wherein the gasket comprises an electromagnetic isolator elastomer.

10. The method of claim 1 further comprising reattaching the cover to the housing to seal the replacement printed circuit board and radiofrequency component in the cavity.

11. A method for shielding a printed circuit board from electromagnetic interference and noise during noise figure testing, comprising:
unsealing a cover from a housing to expose a printed circuit board in a cavity defined by a peripheral wall, the printed circuit board having at least one radiofrequency component mounted thereon;
removing soldering between electrical contacts on the printed circuit board and one or more pins of one or more radiofrequency connectors attached to the peripheral wall;
detaching the one or more radiofrequency connectors from the peripheral wall;
removing the printed circuit board;
removing a gasket from a groove defined in an inner lower shoulder of the housing; and
inserting into the cavity a replacement printed circuit board having a radiofrequency component mounted thereon.

12. The method of claim 11 further comprising:
reattaching the one or more radiofrequency connectors to the peripheral wall so that the one or more pins of the one or more radiofrequency connectors substantially align with electrical contacts of the replacement printed circuit board;
soldering the one or more pins of the one or more radiofrequency connectors to the electrical contacts of the replacement printed circuit board; and
mounting the cover to the housing over the cavity to at least partially seal the cavity.

13. The method of claim 12 wherein reattaching the one or more radiofrequency connectors comprises mounting one or more flange mount radiofrequency connectors to the housing so that a flange of the one or more flange mount radiofrequency connectors couples to an outer surface of the peripheral wall and so that a pin of the one or more flange mount radiofrequency connectors extends through an opening in the peripheral wall that generally aligns with the electrical contact of the replacement printed circuit board.

14. The method of claim 11 wherein the peripheral wall is defined by a first pair of spaced a part walls that are generally perpendicular to a second pair of spaced apart walls.

15. The method of claim 11 wherein inserting the replacement printed circuit board into the cavity includes inserting printed circuit board so that it is disposed over the inner lower shoulder of the housing.

16. The method of claim 15 further comprising at least partially inserting a replacement gasket into the groove defined in the inner lower shoulder prior to inserting the replacement printed circuit board into the cavity.

17. The method of claim 16 wherein the gasket comprises an electromagnetic isolator elastomer.

18. The method of claim 11 further comprising at least partially inserting a gasket into a groove on a rim of the peripheral wall prior to mounting the cover to the housing.

19. The method of claim 18 wherein the gasket comprises an electromagnetic isolator elastomer.

20. The method of claim 11 further comprising reattaching the cover to the housing to seal the replacement printed circuit board and radiofrequency component in the cavity.

Assignees

• Skyworks Solutions Inc

Inventors

• Verdugo Muñoz Cesar
• Pineda Jorge Luis
• Martinez Edgar Antonio
• Murillo Daniel
• Flores Baca Adrian

Classifications

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• Y10T29/49002

  Electrical device making · CPC title

• H05K3/34

  by soldering · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• G01R1/18

  Screening arrangements against electric or magnetic fields, e.g. against earth's field · CPC title