Power module and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-12288940-B2
Application number	US-202117925293-A
Country	US
Kind code	B2
Filing date	May 11, 2021
Priority date	May 15, 2020
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.

First claim

The invention claimed is:

1. A power module comprising:
a ceramic substrate comprising a ceramic base and electrode patterns formed at an upper surface and a lower surface of the ceramic base;
a PCB substrate disposed over the ceramic substrate and comprising an electrode pattern;
a plurality of through holes formed in at least one of the ceramic substrate and the PCB substrate; and
a connection pin coupled to the through hole and connecting the electrode patterns of the ceramic substrate and the electrode pattern of the PCB substrate,
wherein the connection pin is a bundle type connection pin in which a plurality of connection pins is interconnected at regular intervals,
wherein the bundle type connection pin comprises:
a plurality of connection pins each having a cylindrical shape and having a circular wing part formed on an outer circumference thereof; and
a plastic structure matched with the plurality of connection pins in shape or subjected to insert injection with the plurality of connection pins so that the plurality of connection pins is spaced apart from each other in a way to correspond to an interval between the through holes.

2. The power module of claim 1 , wherein:
the bundle type connection pin has the plastic structure matched with the wing part in shape or has the plastic structure subjected to insert injection with the wing part, and
a part of the wing part protrudes from a lower surface of the plastic structure.

3. The power module of claim 1 , wherein the connection pin is a bundle type connection pin having a 2×2 pin or 2×1 pin or 4×1 pin structure or a bundle type connection pin having a structure in which the plurality of connection pins is aligned in a row.

4. The power module of claim 1 , wherein the connection pin is fit and coupled to the through hole and is soldered and bonded to an edge of the through hole.

5. The power module of claim 1 , wherein the connection pin is formed of copper or a copper alloy.

6. The power module of claim 1 , wherein the connection pin is fit and coupled to the through hole and is bonded to a metal layer forming the electrode pattern of the ceramic substrate by laser welding.

7. The power module of claim 6 , further comprising a solder layer disposed and bonded between the metal layer at the edge of the through hole and the connection pin.

8. The power module of claim 6 , wherein the connection pin and the metal layer are formed of copper or a copper alloy.

9. A power module comprising:
a ceramic substrate comprising a ceramic base and electrode patterns formed at an upper surface and a lower surface of the ceramic base;
a PCB substrate disposed over the ceramic substrate and comprising an electrode pattern;
a plurality of through holes formed in at least one of the ceramic substrate and the PCB substrate; and
a connection pin coupled to the through hole and connecting the electrode patterns of the ceramic substrate and the electrode pattern of the PCB substrate,
wherein the connection pin comprises:
a pin body formed in a quadrangle column shape; and
wings formed on both sides of the pin body in a way to protrude and each having a quadrangle shape,
wherein the connection pin is formed by blanking a metal plate,
wherein a top of the connection pin is formed in a quadrangle pyramid shape, and
the metal plate has a shape comprising pressurization parts formed at an upper surface and a lower surface thereof by pressurizing the metal plate in a way to correspond to the quadrangle pyramid shape.

10. The power module of claim 9 , wherein a length of a diagonal line of a cross section of the pin body of the connection pin corresponds to an inner diameter of the through hole.

11. The power module of claim 9 , wherein the through hole has a shape corresponding to a shape of a cross section of the connection pin.

12. The power module of claim 9 , wherein:
the pin body of the connection pin is fit and coupled to the through hole, and
the wings of the connection pin are soldered and bonded to an edge of the through hole.

Assignees

• Amosense Co Ltd

Inventors

• Kim Jonguk
• Bin Jinhyuck
• Cho Taeho
• Park Seunggon
• Yeo Intae

Classifications

• H10W70/658

  for devices provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title