Ethylene-vinyl alcohol copolymer resin particle composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure

US12286527B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12286527-B2
Application numberUS-202218571191-A
CountryUS
Kind codeB2
Filing dateJun 16, 2022
Priority dateJun 16, 2021
Publication dateApr 29, 2025
Grant dateApr 29, 2025

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An ethylene-vinyl alcohol copolymer (EVOH) resin particle composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The EVOH resin particle composition includes: a first EVOH resin particle having a surface valley void volume (Vvv) of 0.00003˜2 μm 3 /μm 2 ; and a second EVOH resin particle having a surface valley void volume (Vvv) of 0.00005˜10 μm 3 /μm 2 . This can improve thickness uniformity, oxygen transmission rate and stretchability of the film made by the EVOH resin particle compositions.

First claim

Opening claim text (preview).

What is claimed is: 1. An ethylene-vinyl alcohol copolymer (EVOH) resin particle composition, comprising: a first EVOH resin particle having a surface valley void volume (Vvv) of 0.00003˜2 μm 3 /μm 2 ; and a second EVOH resin particle having a surface valley void volume (Vvv) of 0.00005˜10 μm 3 /μm 2 , wherein the first EVOH resin particle has an ethylene content of 36˜50 mole % and the second EVOH resin particle has an ethylene content of 20˜35 mole %, wherein the surface valley void volume (Vvv) of the second EVOH resin particle is greater than the surface valley void volume (Vvv) of the first EVOH resin particle. 2. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has a melting point of 135˜179° C., and the second EVOH resin particle has a melting point of 180˜198° C. 3. The EVOH resin particle composition of claim 1 , wherein the EVOH resin particle is cylindrical, elliptic cylindrical, prismoidal, spherical, ellipsoidal or biconvex-disk-shaped and has a major axis or height of 1˜5 mm and a minor axis of 1˜5 mm. 4. The EVOH resin particle composition of claim 1 , which has a ratio of the first EVOH resin particle to the second EVOH resin particle by weight percentage ranges from 5:95 to 75:25. 5. The EVOH resin particle composition of claim 1 , further comprising a boron content of 5˜550 ppm. 6. The EVOH resin particle composition of claim 1 , further comprising an alkali metal content of 10˜550 ppm. 7. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has a maximum trough depth (Sv) of 0.0005˜25 μm, and the second EVOH resin particle has a maximum trough depth (Sv) of 0.001˜75 μm. 8. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has a root-mean-square slope (Sdq) surface parameter of 0.0001˜15, and the second EVOH resin particle has a root-mean-square slope (Sdq) surface parameter of 0.0002˜50. 9. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has an interface expansion area ratio (Sdr) surface parameter of 0.001˜60%, and the second EVOH resin particle has an interface expansion area ratio (Sdr) surface parameter of 0.02˜150%. 10. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has an arithmetic mean height (Sa) surface parameter of 0.0003˜25 μm, and the second EVOH resin particle has an arithmetic mean height (Sa) surface parameter of 0.0005˜55 μm. 11. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has a linear arithmetic mean height (Ra) surface parameter of 0.001˜0.990 μm, and the second EVOH resin particle has a linear arithmetic mean height (Ra) surface parameter of 0.001˜0.990 μm. 12. The EVOH resin particle composition of claim 1 , wherein the first EVOH resin particle has a linear maximum height (Rz) surface parameter of 0.001˜9.900 μm, and the second EVOH resin particle has a linear maximum height (Rz) surface parameter of 0.001˜9.900 μm. 13. An ethylene-vinyl alcohol copolymer film formed from the EVOH resin particle composition of claim 1 . 14. A multilayer structure, comprising: (a) at least one layer of the ethylene-vinyl alcohol copolymer film formed from the EVOH resin particle composition of claim 1 ; (b) at least one layer of a polymer layer; and (c) at least one layer of a binding layer. 15. The multilayer structure of claim 14 , wherein the polymer layer is one selected from the group consisting of a low-density polyethylene layer, polyethylene grafted maleic anhydride layer, polypropylene layer and nylon layer, and the binding layer is a tie layer. 16. The multilayer structure of claim 14 , wherein the multilayer structure is a polymer layer/binding layer/ethylene-vinyl alcohol copolymer film/binding layer/polymer layer.

Assignees

Inventors

Classifications

  • used for films · CPC title

  • with unsaturated hydrocarbons containing atoms other than carbon or hydrogen · CPC title

  • containing polymeric additives characterised by shape · CPC title

  • Thermoformability · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

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What does patent US12286527B2 cover?
An ethylene-vinyl alcohol copolymer (EVOH) resin particle composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The EVOH resin particle composition includes: a first EVOH resin particle having a surface valley void volume (Vvv) of 0.00003˜2 μm 3 /μm 2 ; and a second EVOH resin particle having a surface valley void volume (Vvv) of 0.00005˜10 μm 3 /μm 2 . Thi…
Who is the assignee on this patent?
Chang Chun Petrochemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08L29/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 29 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).