Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure containing the same

US11746170B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11746170-B2
Application numberUS-202217700964-A
CountryUS
Kind codeB2
Filing dateMar 22, 2022
Priority dateJun 16, 2021
Publication dateSep 5, 2023
Grant dateSep 5, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to an ethylene-vinyl alcohol copolymer (EVOH) resin composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The core void volume (Vvc) of the surface of the EVOH resin composition is more than 0.010 μm 3 /μm 2 and less than 50 μm 3 /μm 2 ; or its surface pole height (Sxp) is more than 0.010 μm and less than 9.0 μm. The invention can reduce the torque output during processing, reduce the adsorption of fine powder on the surface caused by static electricity generated on the surface of the EVOH, and provide good film thickness uniformity.

First claim

Opening claim text (preview).

What is claimed is: 1. An ethylene-vinyl alcohol copolymer resin composition in a form of pellet, comprising an ethylene-vinyl alcohol copolymer resin, wherein the ethylene-vinyl alcohol copolymer resin composition has a surface with a core void volume (Vvc) greater than 0.010 μm 3 /μm 2 and less than 50 μm 3 /μm 2 , or a surface pole height (Sxp) more than 0.010 μm and less than 9.0 μm, wherein the ethylene-vinyl alcohol copolymer resin has a saponification degree greater than 99.5 mole %. 2. The ethylene-vinyl alcohol copolymer resin composition of claim 1 having a moisture content of less than 1 wt %. 3. The ethylene-vinyl alcohol copolymer resin composition of claim 1 , wherein the ethylene-vinyl alcohol copolymer resin has an ethylene content of 20-48 mole %. 4. The ethylene-vinyl alcohol copolymer resin composition of claim 2 , wherein the ethylene-vinyl alcohol copolymer resin has an ethylene content of 20-48 mole %. 5. The ethylene-vinyl alcohol copolymer resin composition of claim 1 having a surface with a maximum line height (Rz) between 0.01 and 9.9 μm. 6. The ethylene-vinyl alcohol copolymer resin composition of claim 2 having a surface with a maximum line height (Rz) between 0.01 and 9.9 μm. 7. The ethylene-vinyl alcohol copolymer resin composition of claim 1 having a surface electrostatic voltage of less than 6 kV. 8. The ethylene-vinyl alcohol copolymer resin composition of claim 2 having a surface electrostatic voltage of less than 6 kV. 9. The ethylene-vinyl alcohol copolymer resin composition of claim 1 comprising two or more ethylene-vinyl alcohol copolymers with different ethylene contents. 10. The ethylene-vinyl alcohol copolymer resin composition of claim 2 comprising two or more ethylene-vinyl alcohol copolymers with different ethylene contents.

Assignees

Inventors

Classifications

  • C08F216/06Primary

    Polyvinyl alcohol {; Vinyl alcohol} · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • of synthetic resin · CPC title

  • comprising vinyl acetate or vinyl alcohol (co)polymers · CPC title

  • comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

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What does patent US11746170B2 cover?
The present invention relates to an ethylene-vinyl alcohol copolymer (EVOH) resin composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The core void volume (Vvc) of the surface of the EVOH resin composition is more than 0.010 μm 3 /μm 2 and less than 50 μm 3 /μm 2 ; or its surface pole height (Sxp) is more than 0.010 μm and less than 9.0 μm. The invention…
Who is the assignee on this patent?
Chang Chun Petrochemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08F216/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).