Power semiconductor device and manufacturing method of power semiconductor device

Patent metadata

Field	Value
Publication number	US-12283536-B2
Application number	US-202017772943-A
Country	US
Kind code	B2
Filing date	Sep 29, 2020
Priority date	Oct 30, 2019
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

A problem is that close contact with a heat dissipation surface of a power semiconductor device is not sufficient, and thus heat dissipation performance is low. A thermally conductive layer 5 abuts on a heat dissipation surface 4 a of a circuit body 100 , and a heat dissipation member 7 abuts on the outside of the thermally conductive layer 5 , which is a side of the heat dissipation surface 4 a of the circuit body 100 . A fixing member 8 abuts on a side of the circuit body 100 opposite to the heat dissipation surface 4 a . A connection member 9 is penetrated at the respective end portions of the heat dissipation member 7 and the fixing member 8 . FIG. 3 illustrates a state before a bolt and a nut of the connection member 9 are tightened. The heat dissipation member 7 holds a curved shape such that the central portion of the heat dissipation member 7 protrudes toward the circuit body 100 . The bolt and the nut of the connection member 9 are fastened and fixed at both ends of the heat dissipation member 7 and the fixing member 8 so as to sandwich the circuit body 100 . The heat dissipation member 7 is elastically deformed to bring the heat dissipation member 7 into close contact with the heat dissipation surface 4 a of the circuit body 100 via the thermally conductive layer 5 , and surface pressure is applied from the heat dissipation member 7 to the heat dissipation surface 4 a.

First claim

The invention claimed is:

1. A power semiconductor device comprising:
a circuit body in which a power semiconductor element is mounted;
a first heat dissipation member that is disposed on a first heat dissipation surface side of the circuit body and dissipates heat of the circuit body; and
a fixing member that is disposed on a side of the circuit body opposite to the first heat dissipation surface,
wherein, when the first heat dissipation member and the fixing member are connected and fixed, the first heat dissipation member curved to protrude toward a central portion on the first heat dissipation surface side is elastically deformed to come into close contact with the first heat dissipation surface side, and
wherein bending rigidity of the first heat dissipation member at a portion at which the first heat dissipation member and the fixing member are connected and fixed is higher than bending rigidity of a central portion of the first heat dissipation member.

2. The power semiconductor device according to claim 1 , wherein
the fixing member is a second heat dissipation member disposed on a second heat dissipation surface side opposite to the first heat dissipation surface side, and
when the first heat dissipation member and the second heat dissipation member are connected and fixed, the first heat dissipation member curved to protrude toward the central portion on the first heat dissipation surface side and the second heat dissipation member curved to protrude toward a central portion on the second heat dissipation surface side are elastically deformed to come into close contact with the first heat dissipation surface side and the second heat dissipation surface side with the circuit body sandwiched between the first heat dissipation member and the second heat dissipation member.

3. The power semiconductor device according to claim 2 , wherein the bending rigidity of the first heat dissipation member and bending rigidity of the second heat dissipation member at the portion at which the first heat dissipation member and the second heat dissipation member are connected and fixed is higher than the bending rigidity of the central portion of the first heat dissipation member and a central portion of the second heat dissipation member.

4. The power semiconductor device according to claim 1 , wherein
a plate thickness of the first heat dissipation member at the portion at which the first heat dissipation member and the fixing member are connected and fixed is greater than a plate thickness of the central portion of the first heat dissipation member.

5. The power semiconductor device according to claim 3 , wherein plate thicknesses of the first heat dissipation member and the second heat dissipation member at the portion at which the first heat dissipation member and the second heat dissipation member are connected and fixed are greater than plate thicknesses of the central portions of the first heat dissipation member and the second heat dissipation member, respectively.

6. The power semiconductor device according to claim 1 , wherein the first heat dissipation member in an elastically deformed state has a shape protruding toward the circuit body or a flat shape.

7. The power semiconductor device according to claim 2 , wherein the first heat dissipation member and the second heat dissipation member in an elastically deformed state have a shape protruding toward the circuit body or a flat shape.

8. The power semiconductor device according to claim 1 , wherein the first heat dissipation member includes a plurality of cooling water channel pipes formed by extrusion molding.

9. The power semiconductor device according to claim 2 , wherein the first heat dissipation member and the second heat dissipation member include a plurality of cooling water channel pipes formed by extrusion molding.

10. The power semiconductor device according to claim 8 , wherein a side wall in at least one of the plurality of cooling water channel pipes forms a tapered portion toward the circuit body.

11. The power semiconductor device according to claim 9 , wherein an arrangement density of the plurality of cooling water channel pipes is densely arranged in central portions of the first heat dissipation member and the second heat dissipation member.

12. The power semiconductor device according to claim 2 , wherein the first heat dissipation member and the second heat dissipation member include heat dissipation fins.

Assignees

• Hitachi Astemo Ltd

Inventors

• Shimazu Hiromi
• Kaneko Yujiro
• Ide Eiichi
• Takagi Yusuke
• Tanie Hisashi

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/347

  Dispositions of multiple die-attach connectors · CPC title