Component carrier with a magnetic element and a manufacturing method

Patent metadata

Field	Value
Publication number	US-12279372-B2
Application number	US-202217663418-A
Country	US
Kind code	B2
Filing date	May 13, 2022
Priority date	May 18, 2021
Publication date	Apr 15, 2025
Grant date	Apr 15, 2025

Abstract

A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.

First claim

The invention claimed is:

1. A component carrier, comprising:
a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure;
a magnetic element assembled to the stack, the magnetic element including an embedded inductive element; and
a dielectric layer structure on the stack, the dielectric layer structure at least partially surrounding the magnetic element,
wherein a first main surface of the magnetic element is flush with a respective first main surface of the dielectric layer structure,
wherein an opposed main surface of the magnetic element contacts a respective opposed main surface of the stack,
wherein the magnetic element includes a plurality of gaps,
wherein the embedded inductive element is in the gaps,
wherein the magnetic element comprises:
a magnetic matrix, and
wherein the embedded inductive element is an electrically conductive structure that is at least partially embedded in the magnetic matrix,
wherein the dielectric layer structure comprises a shift pattern at an interface between a first dielectric layer structure and a second dielectric layer structure,
wherein the shift pattern comprises at least one of the group which consists of an alignment shift, a smearing, a tapering of a dielectric layer structure sidewall being in contact with a sidewall of the magnetic element,
wherein the magnetic element comprises a first magnetic element and a second magnetic element,
wherein the second magnetic element is placed directly on the first magnetic element,
wherein the first dielectric layer structure at least partially surrounds the first magnetic element, and the second dielectric layer structure at least partially surrounds the second magnetic element.

2. The component carrier according to claim 1 ,
wherein the electrically conductive structure is formed as a winding, and
wherein the directions of main extension of the winding are essentially parallel to the directions of main direction of the component carrier.

3. The component carrier according to claim 1 ,
wherein the shift pattern is established along a plane being essentially flush to an upper main surface of the electrically conductive structure and parallel to the directions of main extension of the component carrier.

4. The component carrier according to claim 1 ,
wherein the dielectric layer structure comprises a cavity, and wherein the magnetic element is at least partially embedded in the cavity.

5. The component carrier according to claim 1 ,
wherein the dielectric layer structure is a photo-imageable dielectric.

6. The component carrier according to claim 1 , comprising at least one of the following features:
wherein a lower main surface of the magnetic element is flush with an upper main surface of the stack;
wherein the component carrier further comprises:
a further layer structure and/or a further stack arranged on the dielectric layer structure and/or on the magnetic element.

7. The component carrier according to claim 1 , wherein the magnetic matrix comprises at least one of the following features:
wherein the magnetic matrix continuously fills a volume around the electrically conductive structure and between windings of the electrically conductive structure;
wherein the magnetic matrix comprises at least one of the group consisting of a rigid solid, and a paste;
wherein the magnetic matrix comprises one of the group which consists of:
electrically conductive, electrically insulating, partially electrically conductive and partially electrically insulating;
wherein the relative magnetic permeability μ r of the magnetic matrix is in a range from 2 to 10 6 ;
wherein the magnetic matrix comprises at least one material of the group consisting of a ferromagnetic material, a ferrimagnetic material, a permanent magnetic material, a soft magnetic material, a ferrite, a metal oxide, a dielectric matrix, a prepreg, with magnetic particles therein, and an alloy or alloyed silicon.

8. A method, comprising:
using photolithography to provide cavities in a dielectric layer structure of a component carrier, the component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure;
embedding a magnetic element in the component carrier, and
arranging an electrically conductive structure that is at least partially embedded in the magnetic matrix,
wherein an upper main surface of the magnetic element is flush with an upper main surface of the dielectric layer structure,
wherein the dielectric layer structure at least partially surrounds the magnetic element;
wherein the magnetic element comprises a plurality of gaps within the magnetic element,
wherein the electrically conductive structure is in the gaps,
wherein a lower main surface of the magnetic element contacts an upper main surface of the stack,
wherein the dielectric layer structure comprises a shift pattern at an interface between a first dielectric layer structure and a second dielectric layer structure,
wherein the shift pattern comprises at least one of the group which consists of an alignment shift, a smearing, a tapering of a dielectric layer structure sidewall being in contact with a sidewall of the magnetic element,
wherein the magnetic element comprises a first magnetic element and a second magnetic element,
wherein the second magnetic element is placed directly on the first magnetic element,
wherein the first dielectric layer structure at least partially surrounds the first magnetic element, and the second dielectric layer structure at least partially surrounds the second magnetic element,
wherein a seed layer is provided to cover the respective bottoms of the plurality of gaps and an inductive element is provided by the electrically conductive structure which is formed in the gaps by electroplating.

Assignees

• At & S Austria Tech & Systemtechnik Ag
• At&S Austria Tech &Systemtechnik Aktiengesellschaft

Inventors

• Salkovic Ivan
• López Blanco Vanesa

Classifications

• H05K2203/308

  Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs · CPC title

• H05K2201/0376

  Flush conductors, i.e. flush with the surface of the printed circuit · CPC title

• H05K2201/0358

  Resin coated copper [RCC] · CPC title

• H05K3/1216

  by screen printing or stencil printing · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title