Inertial sensor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-12269733-B2
Application number	US-202217703418-A
Country	US
Kind code	B2
Filing date	Mar 24, 2022
Priority date	Mar 30, 2021
Publication date	Apr 8, 2025
Grant date	Apr 8, 2025

Abstract

A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.

First claim

What is claimed is:

1. An inertial sensor comprising:
a micro vibration body that is a thin-walled member having a front surface, which is a surface on a side having a large outer diameter, and a back surface, which is an opposite surface to the front surface and having a smaller diameter than the front surface, the micro vibration body including a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion toward the back surface;
a mounting substrate that includes a lower substrate and an upper substrate, which are joined to each other, the upper substrate including an inner frame portion, which has a frame-shape, and a plurality of electrode portions, which are separated from each other and surround an inner frame portion; and
a joining member that is provided in an inner region of the mounting substrate, which is surrounded by the inner frame portion, wherein
the recessed portion of the micro vibration body has a bottom surface defining a mounted surface on a side of the back surface,
the mounted surface is located in the inner region and is joined to the mounting substrate via the joining member,
the curved surface portion has a rim that is in a hollow state,
the rim is a part of the curved surface portion and includes an end portion of the curved surface portion on an opposite side to the recessed portion,
the rim has a rim lower surface, which is a surface connecting the front surface with the back surface, and
the rim lower surface is located on a same plane as the mounted surface or a tip end portion of the mounted surface.

2. The inertial sensor according to claim 1 , wherein
the mounted surface of the micro vibration body has a mounted surface recess recessed from the back surface toward the front surface,
the mounting substrate has a positioning groove that corresponds to a protruding portion of the micro vibration body,
the protruding portion protrudes from the mounted surface recess toward the mounted surface, and
the protruding portion is inserted in the positioning groove.

3. The inertial sensor according to claim 1 , wherein
the micro vibration body has a side through hole provided in a side surface of the recessed portion in the front surface,
the side through hole is provided near the bottom surface and is configured to connect the front surface with the back surface, and
the joining member at least partially enters the side through hole.

4. The inertial sensor according to claim 1 , wherein
the micro vibration body has a bottom through hole provided in the mounted surface, and
the joining member at least partially enters the bottom through hole.

5. The inertial sensor according to claim 2 , wherein
the micro vibration body has a bottom through hole provided in a bottom surface of the mounted surface recess, and
the joining member at least partially enters the bottom through hole.

6. The inertial sensor according to claim 4 , wherein
the mounting substrate has a column portion in a region surrounded by the inner frame portion, and
the column portion is inserted in the bottom through hole.

Assignees

• Denso Corp
• Toyota Motor Co Ltd
• MIRISE Technologies Corporation

Inventors

• Ito Keitaro
• Harada Shota
• Goto Katsuaki
• Inagaki Yuuki
• Akashi Teruhisa
• Funabashi Hirofumi
• Yoshida Takahiko
• Kawai Yusuke

Classifications

• B81B2201/0242

  Gyroscopes · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81C2203/0172

  Seals · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B81B2201/0228

  Inertial sensors · CPC title