Module

US12262519B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12262519-B2
Application numberUS-202318166661-A
CountryUS
Kind codeB2
Filing dateFeb 9, 2023
Priority dateAug 13, 2020
Publication dateMar 25, 2025
Grant dateMar 25, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

First claim

Opening claim text (preview).

The invention claimed is: 1. A module comprising: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the metal member, the first electronic component, and the second electronic component, wherein when viewed in the front-back direction, a line connecting a lower end of the plate-shaped portion in a left-right direction is defined as a lower side, the plate-shaped portion is provided with one or more lower notches extending upward from the lower side, the metal member further includes a plurality of foot portions, and all of the plurality of foot portions extend forward from the lower side, or all of the plurality of foot portions extend backward from the lower side. 2. The module according to claim 1 , wherein outer edges of the plurality of foot portions is connected to outer edges of the one or more lower notches when viewed in the front-back direction. 3. The module according to claim 2 , wherein the one or more lower notches include a plurality of lower notches, and the plurality of foot portions include a first foot portion located between the plurality of lower notches in the left-right direction when viewed in the front-back direction. 4. The module according to claim 1 , wherein the plurality of foot portions include a second foot portion disposed at a left end portion or a right end portion of the lower side when viewed in the front-back direction. 5. The module according to claim 1 , wherein the plurality of foot portions are arranged at equal intervals in the left-right direction when viewed in the front-back direction. 6. The module according to claim 1 , wherein the one or more lower notches include a plurality of lower notches, and the plurality of lower notches are arranged at equal intervals in the left-right direction when viewed in the front-back direction. 7. The module according to claim 1 , wherein the one or more lower notches include a first lower notch disposed at a left end portion or a right end portion of the lower side when viewed in the front-back direction. 8. The module according to claim 1 , wherein the one or more lower notches include two lower notches, and the plurality of foot portions are not disposed between the two lower notches in the left-right direction when viewed in the front-back direction. 9. The module according to claim 1 , wherein the plurality of foot portions are two foot portions, the two foot portions are disposed at a left end portion and a right end portion of the lower side when viewed in the front-back direction, the one or more lower notches include one lower notch, and the one lower notch is disposed between the two foot portions in the left-right direction when viewed in the front-back direction. 10. The module according to claim 1 , wherein a left end of the plate-shaped portion is located on a left surface of the sealing resin layer, a right end of the plate-shaped portion is located on a right surface of the sealing resin layer, and an upper end of the plate-shaped portion is located on an upper surface of the sealing resin layer. 11. The module according to claim 1 , further comprising: a shield electrically connected to the metal member and covering an upper surface of the sealing resin layer. 12. A module comprising: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the metal member, the first electronic component, and the second electronic component, wherein when viewed in the front-back direction, a line connecting a lower end of the plate-shaped portion in a left-right direction is defined as a lower side, the plate-shaped portion is provided with one or more lower notches extending upward from the lower side, the metal member further includes a plurality of foot portions provided under the lower side, and the plurality of foot portions include structure (A) foot portions or structure (B) foot portions: (A) each of the structure (A) foot portions includes a first portion extending downward and forward from the lower side of the plate-shaped portion and a second portion extending backward from a lower end of the first portion, and a back end of the second portion is located below the back main surface of the plate-shaped portion or behind the plate-shaped portion; (B) each of the structure (B) foot portions includes a first portion extending downward and backward from the lower side of the plate-shaped portion and a second portion extending forward from the lower end of the first portion, and a front end of the second portion is located below the front main surface of the plate-shaped portion or in front of the plate-shaped portion. 13. The module according to claim 12 , wherein the metal member includes both the structure (A) foot portions having the structure (A) and the structure (B) foot portions having the structure (B), and the structure (A) foot portions having the structure (A) and the structure (B) foot portions having the structure (B) are alternately arranged in the left-right direction. 14. The module according to claim 12 , wherein all of the plurality of foot portions are the structure (A) foot portions having the structure (A), or all of the plurality of foot portions are the structure (B) foot portions having the structure (B). 15. The module according to claim 12 , wherein the substrate includes a mounting electrode and a conductive member, the mounting electrode and the conductive member being a part of the upper main surface of the substrate, and the conductive member fixes the mounting electrode and the foot portion, and the conductive member is in contact with the second portion. 16. The module according to claim 15 , wherein in a case where any of the plurality of foot portions are the structure (A) foot portions, the conductive member has a structure (C), and in a case where any of the plurality of foot portions are the structure (B) foot portions, the conductive member has a structure (D): (C) at least a part of a portion in contact with the conductive member in the second portion is located in front of the plate-shaped portion, and a front end of the portion in contact with the conductive member on an upper surface of the mounting electrode is located in front of a front end of the portion in contact with the conductive member in the second portion; (D) at least a part of a

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • Manufacture or treatment · CPC title

  • H10W42/20Primary

    protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

  • the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

  • the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

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Frequently asked questions

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What does patent US12262519B2 cover?
A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted …
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).