Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate

Patent metadata

Field	Value
Publication number	US-12261090-B2
Application number	US-202418428088-A
Country	US
Kind code	B2
Filing date	Jan 31, 2024
Priority date	Sep 30, 2020
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and directly bonding an insulating layer to the upper surface of the flat layer.

First claim

What is claimed is:

1. A method of producing a composite substrate, the method comprising:
providing a layered body, which comprises steps of:
providing a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and
forming a metal layer on the first surface of the base layer and polishing a surface of the metal layer, thereby forming a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and

directly bonding an insulating layer to the upper surface of the flat layer.

2. The method according to claim 1 , wherein:
the step of providing the layered body comprises:
producing the composite material from a mixed powder containing a plurality of diamond particles and a plurality of metal powder particles by first pulsed electric current sintering to form the base layer, and
bonding a metal powder or a metal plate to the first surface of the base layer by second pulsed electric current sintering to form the metal layer.

3. The method according to claim 2 , wherein:
the step of providing the layered body comprise, after the step of forming the base layer by the first pulsed electric current sintering, performing a treatment to reduce a thickness of the first surface of the base layer, and bonding the metal powder or the metal plate to the first surface of the base layer subjected to the treatment to reduce thickness, by the second pulsed electric current sintering, to obtain the metal layer.

4. The method according to claim 3 , wherein:
in the step of polishing to form the flat layer, the flat layer is formed such that the surface roughness Ra of the upper surface of the flat layer is smaller than that of the first surface in the step of providing the layered body.

5. The method according to claim 2 , wherein:
in the step of providing the layered body, a first pressure and a second pressure higher than the first pressure are repeatedly applied to the mixed powder in the first pulsed electric current sintering and/or the second pulsed electric current sintering.

6. The method according to claim 3 , wherein:
in the step of providing the layered body, a first pressure and a second pressure higher than the first pressure are repeatedly applied to the mixed powder in the first pulsed electric current sintering and/or the second pulsed electric current sintering.

7. The method according to claim 4 , wherein:
in the step of providing the layered body, a first pressure and a second pressure higher than the first pressure are repeatedly applied to the mixed powder in the first pulsed electric current sintering and/or the second pulsed electric current sintering.

8. The method according to claim 2 , wherein:
the step of forming the base layer comprises preparing, as the plurality of diamond particles to be contained in the mixed powder, diamond particles having an L* of 53 or more in the CIE 1976 L*a*b* color system.

9. The method according to claim 6 , wherein:
the step of preparing the diamond particles comprises removing diamond particles containing ferromagnetic impurities by magnetic force.

10. The method according to claim 1 , wherein:
the flat layer contains one or more of Cu, Ag, Au, Al, CuW, CuMo, AlN, SiN, or SiO 2 .

11. The method according to claim 5 , wherein:
the flat layer contains one or more of Cu, Ag, Au, Al, CuW, CuMo, AlN, SiN, or SiO 2 .

12. The method according to claim 1 , wherein:
the flat layer is formed of a material having a coefficient of thermal expansion that is at least two times a coefficient of thermal expansion of the composite material.

13. The method according to claim 5 , wherein:
the flat layer is formed of a material having a coefficient of thermal expansion that is at least two times a coefficient of thermal expansion of the composite material.

14. The method according to claim 1 , wherein:
the flat layer has a thickness of 1000 μm or less.

15. The method according to claim 5 , wherein:
the flat layer has a thickness of 1000 μm or less.

16. The method according to claim 4 , wherein:
the insulating layer has a thickness of 200 μm or less.

17. The method according to claim 5 , wherein:
the insulating layer has a thickness of 200 μm or less.

Assignees

• Nichia Corp

Inventors

• Ichikawa Masatsugu
• Yamada Shoichi
• Kihara Takeshi
• Matsusaka Yutaka

Classifications

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/254 Primary

  Diamond · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title