Wafer support member and method of manufacturing a wafer support member

Patent metadata

Field	Value
Publication number	US-12261068-B2
Application number	US-202217974576-A
Country	US
Kind code	B2
Filing date	Oct 27, 2022
Priority date	Oct 27, 2022
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf 130 . The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

First claim

The invention claimed is:

1. A wafer support member comprising:
a support column; and
a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column,
wherein each wafer-engagement-shelf defines a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf, wherein the plurality of through-holes serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports,
wherein the support column further defines a plurality of drain holes extending between the first side and an opposite second side of the support column for a fluid on the wafer-engagement-shelves to drain away therefrom via the plurality of drain holes.

2. The wafer support member of claim 1 further comprising:
at least one fillet element between a base surface of each wafer-engagement-shelf and the first side of the support column from which the wafer-engagement-shelf extends.

3. The wafer support member of claim 2 ,
wherein a fillet radius of curvature of each of the at least one fillet element is within a range of between approximately 1 mm to approximately 6 mm.

4. The wafer support member of claim 1 ,
wherein the plurality of through-holes extending between the base surface and the opposite wafer-engagement surface of each wafer-engagement-shelf comprise a plurality of hexagonal-shaped through-holes arranged in a honeycomb pattern or a plurality of triangular-shaped through-holes arranged in an isometric pattern, across the wafer-engagement-shelf.

5. The wafer support member of claim 1 ,
wherein the support column further comprises:
a first channel for receiving a first reinforcing rod, wherein the first channel is disposed at a first longitudinal end segment of the support column and is parallel with an axial axis of the support column extending between a base and a roof of the support column; and
a second channel for receiving a second reinforcing rod, wherein the second channel is disposed at a second longitudinal end segment of the support column, opposite the first longitudinal end segment, and is parallel with the axial axis of the support column.

6. The wafer support member of claim 5 , wherein the support column further comprises a pair of rod-securing members configured to respectively secure the first reinforcing rod and the second reinforcing rod within the first channel and the second channel.

7. The wafer support member of claim 6 , wherein the pair of rod-securing-members comprises a pair of cantilever arms configured to respectively urge the first reinforcing rod and the second reinforcing rod against a side edge of the first channel and a side edge of the second channel.

8. The wafer support member of claim 1 , wherein the plurality of drain holes comprise a plurality of triangular-shaped through-holes arranged in an isometric pattern.

9. The wafer support member of claim 8 , wherein the plurality of drain holes further comprise:
a first plurality of square-shaped through-holes arranged in an ortho-grid pattern at a first longitudinal end segment of the support column; and
a second plurality of square-shaped through-holes arranged in the ortho-grid pattern at an opposite second longitudinal end segment of the support column,
wherein the plurality of triangular-shaped through-holes serving as drain holes are at an intermediate segment of the support column, between the first longitudinal end segment and the opposite second longitudinal end segment of the support column.

10. The wafer support member of claim 5
wherein the support column further comprises a reinforcing arrangement at the second longitudinal end segment of the support column,
wherein the reinforcing arrangement comprises a plurality of ellipse-shaped reinforcing ribs which are extending substantially perpendicularly to a hole axis of the second channel and which are arranged end-to-end, along a first flank of the second channel, along a direction substantially parallel with the hole axis of the second channel.

11. The wafer support member of claim 10 , wherein the reinforcing arrangement further comprises:
a first arrangement of at least one linear reinforcing rib extending between a pair of opposite ends of each ellipse-shaped reinforcing rib along the direction substantially parallel with the hole axis of the second channel, and
a second arrangement of at least one linear reinforcing rib extending between another pair of opposite ends of each ellipse-shaped reinforcing rib, such that the second arrangement of at least one linear reinforcing rib and the first arrangement of at least one linear reinforcing rib intersect each other in a substantially perpendicular manner to form a plurality of cross-shaped reinforcing sub-arrangements respectively encircled within the plurality of ellipse-shaped reinforcing ribs.

12. The wafer support member of claim 11 , wherein the reinforcing arrangement further comprises:
a third arrangement of at least one linear reinforcing rib, aligned substantially parallel with the first arrangement of at least one reinforcing rib, along an opposite second flank of the second channel,
wherein each linear reinforcing rib of the third arrangement of at least one linear reinforcing rib serves as a wafer-stopper for preventing a wafer disk on a respective wafer-engagement-shelf from moving past the wafer-stopper.

13. The wafer support member of claim 1 ,
wherein the support column and the plurality of wafer-engagement-shelves are integrally molded or integrally printed with one another.

14. The wafer support member of claim 1 , further comprising:
a securing element for inter-engaging with a corresponding securing element of a wafer container to detachably secure the wafer support member within the wafer container.

15. A wafer support assembly comprising:
a pair of wafer support members, wherein each wafer support member comprises:
a support column; and
a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column,

wherein each wafer-engagement-shelf defines a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf, wherein the plurality of through-holes serves as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports,
wherein the pair of wafer support members are disposed relative to each other in a manner such that the plurality of wafer-engagement-shelves of a first of the pair of wafer support members are opposing and aligned with the plurality of wafer-engagement-shelves of a second of the pair of wafer support members, so as to be capable of evenly supporting a weight of a wafer disk on each pair of opposing and aligned wafer-engagement-shelves.

16. The wafer support assembly of claim 15 , further comprising:
a wafer container,
wherein the pair of wafer support members are disposed within an inner space of the wafer container.

17. A wafer support member comprising:
a support column; and
a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column,
wherein each wafer-engagement-shelf defines a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf, wherein the plurality of th

Assignees

• Intel Corp

Inventors

• Davison Peter
• Gwin Paul

Classifications

• H10P72/14 Primary

  Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title

• H01L21/6732 Primary

  Electricity · mapped topic