Shielding case, circuit board assembly, and electronic device

Patent metadata

Field	Value
Publication number	US-12256526-B2
Application number	US-202217909300-A
Country	US
Kind code	B2
Filing date	Apr 26, 2022
Priority date	Aug 12, 2021
Publication date	Mar 18, 2025
Grant date	Mar 18, 2025

Abstract

A shielding case includes a case body. The case body and the circuit board enclose a shielded region, and at least part of elements on the circuit board are capped inside the shielding case. The elements located inside the case body include a first component, where the first component has a step surface facing the case body. A reinforcing part is provided in a region on the case body corresponding to the step surface of the first component, where at least partial structure of the reinforcing part is located in a region on the case body facing to the step surface.

First claim

What is claimed is:

1. A circuit board assembly, comprising: a circuit board with a plurality of elements provided on a side surface of the circuit board; and a shielding case installed on the side surface of the circuit board and capping at least part of the plurality of elements; wherein the shielding case comprises a case body provided on the circuit board; wherein the case body and the circuit board enclose a shielded region, one or more of the plurality of elements are located in the shielded region, the one or more elements in the shielded region comprise at least one first component, and the at least one first component comprises a step surface facing the case body; and wherein a reinforcing part is provided on the case body, the reinforcing part is at least partly located in a region on the case body facing to the step surface, and wherein the reinforcing part extends in a length direction of the step surface and covers at least an edge of the at least one first component.

2. The circuit board assembly of claim 1 , wherein the case body comprises a support bracket and a cover plate; and wherein the support bracket provides support on the circuit board and the cover plate caps the support bracket.

3. The circuit board assembly of claim 2 , wherein the support bracket comprises a frame body and at least one support plate; and wherein the frame body is provided around an edge of the shielded region, the at least one support plate fits inside the frame body, and the at least one support plate forms the reinforcing part.

4. The circuit board assembly of claim 2 , wherein the cover plate is provided with a recession; and wherein the recession is recessed from another surface of the cover plate towards the step surface and forms the reinforcing part.

5. The circuit board assembly of claim 1 , wherein in an extension direction of a board surface of the circuit board, a gap is present between the reinforcing part and a surface of the at least one first component closest to the case body.

6. The circuit board assembly of claim 1 , wherein a projection of the reinforcing part on the circuit board is partly located in a region covered by the step surface.

7. The circuit board assembly of claim 6 , wherein in a width direction of the step surface, thickness of an element provided adjacent to the at least one first component is less than thickness of the at least one first component; and wherein the projection of the reinforcing part on the circuit board is partly located in a region covered by the element adjacent to the at least one first component.

8. An electronic device, comprising at least one circuit board assembly; wherein the at least one circuit board assembly comprises: a circuit board with a plurality of elements provided on a side surface of the circuit board; and a shielding case installed on the side surface of the circuit board and capping at least part of the plurality of elements; wherein the shielding case comprises a case body provided on the circuit board; wherein the case body and the circuit board enclose a shielded region, one or more of the plurality of elements are located in the shielded region, the one or more elements in the shielded region comprise at least one first component, and the at least one first component comprises a step surface facing the case body; and wherein a reinforcing part is provided on the case body, the reinforcing part is at least partly located in a region on the case body facing to the step surface, and wherein the reinforcing part extends in a length direction of the step surface and covers at least an edge of the at least one first component.

9. The electronic device of claim 8 , wherein the case body comprises a support bracket and a cover plate, and wherein the support bracket provides support on the circuit board and the cover plate caps the support bracket.

10. The electronic device of claim 9 , wherein the support bracket comprises a frame body and at least one support plate, and wherein the frame body is provided around an edge of the shielded region, the at least one support plate fits inside the frame body, and the at least one support plate forms the reinforcing part.

11. The electronic device of claim 8 , wherein in an extension direction of a board surface of the circuit board, a gap is present between the reinforcing part and a surface of the at least one first component closest to the case body.

12. The electronic device of claim 8 , wherein a projection of the reinforcing part on the circuit board is partly located in a region covered by the step surface.

13. The electronic device of claim 12 , wherein in a width direction of the step surface, a thickness of an element that is adjacent to the at least one first component is less than a thickness of the at least one first component, and wherein the projection of the reinforcing part on the circuit board is partly located in a region covered by the element that is adjacent to the at least one first component.

14. The electronic device of claim 10 , wherein the frame body comprises a side wall, a fastening edge, and a lapping edge, the side wall provides support on the circuit board, the fastening edge and the lapping edge are located on two ends of the side wall respectively, the fastening edge is attached onto the circuit board, and the lapping edge is attached onto the cover plate.

15. The electronic device of claim 14 , wherein the fastening edge is located outside a region enclosed by the side wall, the lapping edge is located inside the region enclosed by the side wall, and the support plate is connected to the lapping edge.

16. The electronic device of claim 8 , wherein the side surface of the circuit board on which the elements are provided is an element surface of the circuit board, and the step surface is facing away from the element surface of the circuit board.

17. The circuit board assembly of claim 1 , wherein the at least one first component is a stacked chipset comprising a first chip stacked on a second chip, and the first chip and the second chip define the step surface.

18. The electronic device of claim 8 , wherein the at least one first component is a stacked chipset comprising a first chip stacked on a second chip, and the first chip and the second chip define the step surface.

Assignees

• Honor Device Co Ltd

Inventors

• Gao Jiuliang
• Zhang Yihe

Classifications

• H05K2201/10515

  Stacked components · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K2201/10159

  Memory · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K9/0035

  with retainers mounted beforehand on the PCB, e.g. clips · CPC title