Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device

Patent metadata

Field	Value
Publication number	US-12255080-B2
Application number	US-202017636650-A
Country	US
Kind code	B2
Filing date	Sep 29, 2020
Priority date	Oct 7, 2019
Publication date	Mar 18, 2025
Grant date	Mar 18, 2025

Abstract

A mold die includes a resin injection gate through which fluid resin serving as mold resin is injected toward a cavity, a resin reservoir to store the fluid resin flowing through the cavity, and a resin reservoir gate. The resin reservoir is provided on the side opposite to the side on which the resin injection gate is arranged with the cavity interposed. The resin reservoir gate communicatively connects the cavity and the resin reservoir. The opening cross-sectional area of the resin reservoir gate is smaller than the opening cross-sectional area of the resin injection gate.

First claim

The invention claimed is:

1. A semiconductor manufacturing apparatus, in which a cavity extending in a first direction is formed with a mold die including a lower die and an upper die, a lead frame provided with a semiconductor element and having a large die pad and a small die pad is arranged in the cavity, and a sealing material is injected into the cavity to seal the lead frame together with the semiconductor element, the semiconductor manufacturing apparatus comprising:
a sealing material injection gate through which the sealing material is injected into the cavity in the first direction;
at least one sealing material reservoir arranged on an other side at a distance in the first direction from one side on which the sealing material injection gate is arranged with the cavity interposed, the sealing material reservoir storing the sealing material flowing through the cavity; and
a sealing material reservoir gate communicatively connecting the cavity and the sealing material reservoir, wherein
the sealing material injection gate has a first opening cross-sectional area,
the sealing material reservoir gate has a second opening cross-sectional area,
the second opening cross-sectional area is smaller than the first opening cross-sectional area, and
the sealing material injection gate is located at a position closer to the large die pad than to the small die pad.

2. The semiconductor manufacturing apparatus according to claim 1 , wherein the sealing material reservoir gate and the sealing material reservoir are provided in at least one of the lower die and the upper die.

3. The semiconductor manufacturing apparatus according to claim 1 , wherein
the sealing material reservoir gate has
a first part located on a side closer to the cavity and having the second opening cross-sectional area, and
a second part located on a side closer to the sealing material reservoir than the first part and having a third opening cross-sectional area larger than the second opening cross-sectional area.

4. The semiconductor manufacturing apparatus according to claim 3 , further comprising an inclined portion inclined from the first part toward the second part.

5. The semiconductor manufacturing apparatus according to claim 1 , wherein the sealing material reservoir gate is arranged at a position closest to the sealing material injection gate.

6. The semiconductor manufacturing apparatus according to claim 1 , wherein the sealing material reservoir gate is arranged at a position away in a second direction intersecting the first direction from a position closest to the sealing material injection gate.

7. The semiconductor manufacturing apparatus according to claim 1 , wherein
the sealing material reservoir includes
a first sealing material reservoir and
a second sealing material reservoir, and

the sealing material reservoir gate has
a first sealing material reservoir gate communicatively connecting the cavity and the first sealing material reservoir and
a second sealing material reservoir gate communicatively connecting the cavity and the second sealing material reservoir.

8. The semiconductor manufacturing apparatus according to claim 1 , wherein the sealing material reservoir gate communicatively connects the cavity and the sealing material reservoir in a direction intersecting the first direction.

9. The semiconductor manufacturing apparatus according to claim 1 , wherein
the sealing material reservoir at least includes one sealing material reservoir and another sealing material reservoir,
the sealing material reservoir gate communicatively connects the cavity and the one sealing material reservoir, and
the one sealing material reservoir and the other sealing material reservoir are communicatively connected by an inter-sealing material reservoir gate.

10. A method of manufacturing a semiconductor device, comprising the steps of:
preparing a lead frame having a large die pad and a small die pad;
mounting a semiconductor element on the lead frame;
preparing a mold die including a lower die and an upper die and having a cavity extending in a direction formed with the lower die and the upper die;
arranging the lead frame provided with the semiconductor element in the mold die;
injecting a sealing material into the cavity; and
detaching the mold die; wherein
the step of preparing a mold die includes the step of preparing the mold die including
a sealing material injection gate located at a position closer to the large die pad than to the small die pad, having a first opening cross-sectional area and passing the sealing material to inject the sealing material toward the cavity in the direction of the cavity,
at least one sealing material reservoir provided on a second side opposite to a first side on which the sealing material injection gate is arranged with the cavity interposed, the sealing material reservoir storing the sealing material flowing through the cavity, and
a sealing material reservoir gate having a second opening cross-sectional area smaller than the first opening cross-sectional area, and communicatively connecting the cavity and the sealing material reservoir, and

the step of injecting the sealing material into the cavity includes the step of injecting the sealing material until the sealing material filling the cavity flows into the sealing material reservoir.

11. The method of manufacturing a semiconductor device according to claim 10 , wherein
the step of detaching a mold die includes the steps of:
removing a portion of the sealing material flowing into the sealing material reservoir from the sealing material filling the cavity; and
removing a portion of the sealing material located at the sealing material injection gate from the sealing material filling the cavity.

12. The method of manufacturing a semiconductor device according to claim 10 , wherein
the step of preparing the lead frame includes the step of preparing a portion serving as a lead terminal, and a height position of one or more of the large die pad and the small die pad being different from a height position of the portion serving as a lead terminal,
the step of mounting the semiconductor element on the lead frame includes the step of mounting at least one semiconductor element on the large die pad and at least one semiconductor element on the small die pad,
the step of arranging the lead frame in the mold die includes the step of arranging the lead frame such that a first filling space having a first distance in a height direction is formed between the die pad and a portion of the lower die forming the cavity and that a second filling space having a second distance longer than the first distance in the height direction is formed between the die pad and a portion of the upper die forming the cavity, and
the step of injecting a sealing material includes the step of filling the first filling space and the second filling space with the sealing material.

13. The method of manufacturing a semiconductor device according to claim 10 , wherein the step of preparing a lead frame includes the step of preparing the lead frame having a notch not covering a region where the sealing material reservoir is located in a state in which the lead frame is arranged in the mold die.

14. A semiconductor device comprising:
a large die pad on which one semiconductor element is mounted;
a small die pad on which another semiconductor element different from the one semiconductor element is mounted; and
a sealing material sealing the large die pad, the small die pad, the one semiconductor element, and the other semiconductor element, wherein
the sealing

Assignees

• Mitsubishi Electric Corp

Inventors

• Iwai Takamasa
• Suzuki Yuichiro
• Shirao Akitoshi
• Kosugi Akira
• Fujino Junji

Classifications

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title