Grinding apparatus

Patent metadata

Field	Value
Publication number	US-12255071-B2
Application number	US-202117645334-A
Country	US
Kind code	B2
Filing date	Dec 21, 2021
Priority date	Dec 23, 2020
Publication date	Mar 18, 2025
Grant date	Mar 18, 2025

Abstract

A grinding apparatus includes a holding table that holds a wafer, a grinding unit that grinds an exposed surface of the wafer held by the holding table, a detecting unit that detects a physical quantity used for determination of the state of exposure of a separation surface of the wafer, and a control unit having an exposure determining unit that determines the state of exposure of the separation surface on the basis of the physical quantity detected by the detecting unit.

First claim

What is claimed is:

1. A grinding apparatus that grinds a separation surface having recesses and projections in a wafer generated by being separated from an ingot, the grinding apparatus comprising:
a holding table that holds the wafer;
a grinding unit that grinds a separation surface of the wafer held by the holding table;
a detecting unit that detects a physical quantity used for determination of a state of exposure of the separation surface, wherein the separation surface is exposed when it faces the grinding unit and not exposed when it faces the holding table; and
a control unit having an exposure determining unit that determines, prior to a grinding operation by the grinding unit, the state of exposure of the separation surface on a basis of the physical quantity detected by the detecting unit.

2. The grinding apparatus according to claim 1 , wherein
the detecting unit has an upper surface height detector that measures an upper surface height of the wafer held by the holding table, and
the exposure determining unit determines that the state of exposure is an abnormal state when the separation surface is not exposed, when a difference in the upper surface height among a plurality of places obtained by measurement of the plurality of places by the upper surface height detector is less than a threshold difference in height.

3. The grinding apparatus according to claim 1 , wherein
the detecting unit has a pressure gauge that measures negative pressure of a suction path when the wafer is sucked by a holding surface of the holding table, and
the exposure determining unit determines that the state of exposure is an abnormal state when the separation surface is not exposed, when the negative pressure measured by the pressure gauge when the wafer is sucked is less than a threshold amount of pressure.

4. The grinding apparatus according to claim 2 , wherein,
when it is determined that the state of exposure is the abnormal state by the exposure determining unit, the control unit informs an operator of the determination of the abnormal state.

5. The grinding apparatus according to claim 3 , wherein,
when it is determined that the state of exposure is the abnormal state by the exposure determining unit, the control unit informs an operator of the determination of the abnormal state.

6. The grinding apparatus according to claim 1 , further comprising:
a position adjustment unit on which the wafer is to be temporarily placed, wherein the detecting unit has
a light projecting part that irradiates either one of surfaces of the wafer temporarily placed on the position adjustment unit with light, and
a light receiving part that receives reflected light reflected by the wafer, and,

when an amount of light received by the light receiving part is less than a threshold amount of light, the exposure determining unit determines that the surface irradiated with the light by the light projecting part is the separation surface and, on a basis of a result of the determination, determines whether or not the separation surface is exposed when the wafer is held by the holding table.

7. The grinding apparatus according to claim 1 , further comprising:
a cassette setting pedestal on which a cassette capable of housing a plurality of the wafers is set; and
a conveying unit including at least one conveying arm that conveys the wafer from the cassette to the holding table, wherein the detecting unit has
a light projecting part that is set on the conveying unit and irradiates either one of surfaces of the wafer with light, and
a light receiving part that is set on the conveying unit and receives reflected light reflected by the wafer, and,

when an amount of light received by the light receiving part is less than a threshold amount of light, the exposure determining unit determines that the surface irradiated with the light by the light projecting part is the separation surface and, on a basis of a result of the determination, determines whether or not the separation surface is exposed when the wafer is held by the holding table.

8. The grinding apparatus according to claim 7 , wherein the conveying arm has
a holding surface that holds the wafer,
an arm part connected to the holding surface, and
a drive part that is set in the arm part and is capable of inverting an orientation of the holding surface, and
the control unit inverts the orientation of the holding surface before placing the wafer on the holding table, when the exposure determining unit determines that the separation surface is not exposed.

9. The grinding apparatus according to claim 7 , wherein the light projecting part and the light receiving part are both on the at least one conveying arm of the conveying unit.

Assignees

• Disco Corp

Inventors

• Fujimura Satoru
• Ichiishi Kyohei
• Sudo Yujiro

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B7/228 Primary

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B49/04

  involving measurement of the workpiece at the place of grinding during grinding operation · CPC title