Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

Patent metadata

Field	Value
Publication number	US-12249599-B2
Application number	US-202318194236-A
Country	US
Kind code	B2
Filing date	Mar 31, 2023
Priority date	Mar 31, 2020
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

First claim

What is claimed is:

1. A module comprising:
a module substrate;
a first component on a top side of the module substrate;
a second component on the top side of the module substrate, the second component including peripheral lateral edges;
a stiffener structure mounted on the top side of the module substrate; and
a lid mounted on the stiffener structure and covering the first component and the second component;
wherein the lid includes a roof, a bottom surface of the roof, a trench in the bottom surface, and a component recess in the bottom surface, and wherein the component recess mates with the peripheral lateral edges of the second component, the component recess is separate from the trench, and the stiffener structure is joined to the lid within the trench; and
a thermal interface material that secures a top side of the second component to the bottom surface of the roof, wherein the thermal interface material is additionally located within the component recess in the bottom surface of the roof that mates with the peripheral lateral edges of the second component.

2. The module of claim 1 , wherein the stiffener structure includes an outer periphery support and an inner support.

3. The module of claim 2 , wherein the inner support is joined to the lid within the trench formed in the roof of the lid.

4. The module of claim 2 , wherein the outer periphery support is joined to the lid within a second trench formed in a roof of the lid.

5. The module of claim 2 , wherein the stiffener structure is formed of a material with a lower CTE than the lid and/or wherein the outer periphery support and the inner support of the stiffener structure comprise different materials with a different CTE.

6. The module of claim 2 , wherein the lid comprises physically separate pieces.

7. The module of claim 6 , wherein the second component comprises a first die and a second die encapsulated within a molding compound and the molding compound fills a space laterally between the first die and the second die.

8. The module of claim 7 , wherein the lid includes a first lid piece spanning over the first die and a second lid piece spanning over the second die.

9. The module of claim 8 , wherein the first lid piece has a different chemical composition than the second lid piece.

10. The module of claim 8 , further comprising a gap between the first lid piece and the second lid piece, wherein the gap is directly above the space laterally between the first die and the second die, and preferably wherein the gap is filled.

11. The module of claim 1 , wherein the thermal interface material is located at least partially along the peripheral lateral edges of the second component.

12. The module of claim 11 , wherein:
the stiffener structure includes an outer periphery support and an inner support;
the outer periphery support is joined to the lid within a trench formed in a roof of the lid;
the inner support is joined to the lid within a second trench formed in the roof of the lid.

13. A module comprising:
a module substrate;
a first component on a top side of the module substrate;
a second component on the top side of the module substrate;
a stiffener structure mounted on the top side of the module substrate, wherein the stiffener structure includes an outer periphery support and an inner support; and
a lid mounted on the stiffener structure and covering the first component and the second component;
wherein the lid includes a component recess that mates with peripheral edges of the second component.

14. The module of claim 13 , wherein the outer periphery support is joined to the lid within a trench formed in a roof of the lid.

15. The module of claim 14 , wherein the inner support is joined to the lid within a second trench formed in a roof of the lid.

16. The module of claim 13 , further comprising a thermal interface material securing the second component to the lid, wherein the thermal interface material is located within the component recess in the lid and at least partially along the peripheral edges of the second component.

Assignees

• Apple Inc

Inventors

• Chen Wei
• Zhao Jie-Hua
• Zhai Jun
• Chang Po-Hao
• Lin Hsien-Che
• Ke Ying-Chieh
• Hu Kunzhong

Classifications

• H10W76/47

  Solid or gel fillings · CPC title

• H10W76/67

  characterised by their materials · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title