Package for an integrated circuit and manufacturing method

Patent metadata

Field	Value
Publication number	US-12249549-B2
Application number	US-202418630676-A
Country	US
Kind code	B2
Filing date	Apr 9, 2024
Priority date	Nov 16, 2020
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.

First claim

The invention claimed is:

1. A package, comprising:
a support substrate having a mounting face including a first electrical zone and a second electrical zone;
an electronic chip mounted to the mounting face;
an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
a spot of conductive glue covering each of the first and second electrical zones;
a first electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the first electrical zone and a second leg in contact with the first end of the electrically conductive path at the bottom edge of the encapsulation hood; and
a second electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the second electrical zone and a second leg in contact with the second end of the electrically conductive path at the bottom edge of the encapsulation hood.

2. The package according to claim 1 , wherein each of the first and second electrically conductive springs is compressed by attachment of the mounting hood to the support substrate.

3. The package according to claim 2 , further comprises an electrically insulating glue positioned between the bottom edge of the mounting hood and the support substrate to provide said attachment.

4. The package according to claim 1 , wherein the electronic chip includes a source of optical radiation, and wherein the encapsulation hood includes an optical device optically coupled to said source.

5. A package, comprising:
a support substrate having a mounting face including a first electrical zone and a second electrical zone;
an electronic chip mounted to the mounting face;
an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
a spot of conductive glue covering each of the first and second ends;
a first electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the first end of the electrically conductive path at the bottom edge of the encapsulation hood and a second leg in contact with the first electrical zone of the support substrate; and
a second electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the second end of the electrically conductive path at the bottom edge of the encapsulation hood and a second leg in contact with the second electrical zone of the support substrate.

6. The package according to claim 5 , wherein each of the first and second electrically conductive springs is compressed by attachment of the mounting hood to the support substrate.

7. The package according to claim 6 , further comprises an electrically insulating glue positioned between the bottom edge of the mounting hood and the support substrate to provide said attachment.

8. The package according to claim 5 , wherein the electronic chip includes a source of optical radiation, and wherein the encapsulation hood includes an optical device optically coupled to said source.

9. A package, comprising:
a support substrate having a mounting face including a first electrical zone and a second electrical zone;
an electronic chip mounted to the mounting face;
an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
a first electrically conductive spring having a first spring end in contact with the first electrical zone and a second spring end in contact with the first connection of the electrically conductive path at the bottom edge of the encapsulation hood;
a second electrically conductive spring having a first spring end in contact with the second electrical zone and a second spring end in contact with the second connection of the electrically conductive path; and
a spot of conductive glue at one of the first or second spring ends of each of the first and second electrically conductive springs.

10. The package according to claim 9 , wherein each of the first and second electrically conductive springs is compressed by attachment of the mounting hood to the support substrate.

11. The package according to claim 10 , further comprises an electrically insulating glue positioned between the bottom edge of the mounting hood and the support substrate to provide said attachment.

12. The package according to claim 9 , wherein the electronic chip includes a source of optical radiation, and wherein the encapsulation hood includes an optical device optically coupled to said source.

Assignees

• St Microelectronics Grenoble 2

Inventors

• Lopez Jerome

Classifications

• H10W76/60

  Seals · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W74/129 Primary

  forming a chip-scale package [CSP] · CPC title