Method for producing SiC single crystal and method for suppressing dislocations in SiC single crystal

Patent metadata

Field	Value
Publication number	US-12247318-B2
Application number	US-202217939152-A
Country	US
Kind code	B2
Filing date	Sep 7, 2022
Priority date	Sep 9, 2021
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

A SiC single crystal is produced by impregnating a molten alloy of silicon and a metallic element M that increases carbon solubility into a SiC sintered body to form a SiC crucible, placing silicon and M in the crucible and heating the crucible to melt the silicon and M and form a Si—C solution, dissolving silicon and carbon in the solution from surfaces of the crucible in contact with the solution, contacting a SiC seed crystal with the top of the solution to grow a first SiC single crystal on the SiC seed crystal by a solution process, and bulk growing a second SiC single crystal on a face of the solution-grown first SiC single crystal by a sublimation or gas process. This method enables a low-dislocation, high-quality SiC single crystal to be produced by a vapor phase process.

First claim

The invention claimed is:

1. A method for producing a SiC single crystal, comprising the steps of, in order:
forming a SiC crucible by rendering an alloy into a melt, wherein the alloy includes silicon and a constituent metallic part M referred to as a metallic element M that increases carbon solubility, and impregnating the melt into a SiC sintered body having a relative density of from 50 to 90%,
wherein the metallic element M comprises:
(1) at least one first metallic element M1 selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Y and Lu; and
(2) (i) at least one second metallic element M2 selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni and Cu, (ii) at least one third metallic element M3 selected from the group consisting of Ga, Ge, Sn, Pb and Zn, or (iii) at least one second metallic element M2 and at least one third metallic element M3,
placing silicon and the metallic element M in the SiC crucible and heating the crucible to melt the silicon and metallic element M within the crucible and form a Si—C solution,
dissolving in the Si—C solution, from surfaces of the SiC crucible in contact with the Si—C solution, silicon and carbon making up the SiC crucible,
contacting a SiC seed crystal with a top portion of the Si—C solution to grow a first SiC single crystal on the SiC seed crystal by a solution process, and
bulk growing a second SiC single crystal on a face of the solution-grown first SiC single crystal by a sublimation process or a gas process.

2. The production method of claim 1 , wherein the total content of the metallic element M in the Si—C solution is from 1 to 80 at % of the combined amount of silicon and the metallic element M.

3. The production of claim 1 , wherein the content of the first metallic element M1 in the Si—C solution is at least 1 at % of the combined amount of silicon and the metallic element M, and the contents of the second metallic element M2 and the third metallic element M3 in the Si—C solution are each at least 1 at % of the combined amount of silicon and the metallic element M.

4. The production method of claim 1 , wherein the SiC sintered body has an oxygen content of 100 ppm or less.

5. The production method of claim 1 , wherein growth of the first SiC single crystal by a solution process is carried out at a Si—C solution temperature of between 1,300 and 2,300° C.

6. The production method of claim 1 , wherein production is carried out with the SiC crucible held within a second crucible made of a heat-resistant carbon material.

7. The production method of claim 1 , wherein the first SiC single crystal grown by a solution process has a thickness of from 10 to 1,000 μm.

8. The production method of claim 1 , wherein the SiC crucible and the Si—C solution are used repeatedly.

9. The production method of claim 1 , wherein the growth rate of the first SiC single crystal grown by a solution process is 100 μm/hr or more.

10. A method for suppressing dislocations in a SiC single crystal, comprising the steps of, in order:
forming a SiC crucible by rendering an alloy into a melt, wherein the alloy includes silicon and a constituent metallic part M referred to as a metallic element M that increases carbon solubility, and impregnating the melt into a SiC sintered body having a relative density of from 50 to 90%,
wherein the metallic element M comprises:
(1) at least one first metallic element M1 selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Y and Lu; and
(2) (i) at least one second metallic element M2 selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni and Cu, (ii) at least one third metallic element M3 selected from the group consisting of Ga, Ge, Sn, Pb and Zn, or (iii) at least one second metallic element M2 and at least one third metallic element M3,
placing silicon and the metallic element M in the SiC crucible and heating the SiC crucible to melt the silicon and metallic element M within the crucible and form a Si—C solution,
dissolving in the Si—C solution, from surfaces of the SiC crucible in contact with the Si—C solution, silicon and carbon making up the SiC crucible, and
contacting a SiC seed crystal with a top portion of the Si—C solution to grow a first SiC single crystal on the SiC seed crystal by a solution process.

11. The method of claim 10 , further comprising the step of bulk growing a second SiC single crystal on a face of the solution-grown first SiC single crystal by a sublimation process or a gas process.

12. The method of claim 11 , further comprising the steps of:
furnishing a SiC single-crystal wafer obtained from the second SiC single crystal bulk-grown by the sublimation process or the gas process for use as a SiC seed crystal, and
growing a third SiC single crystal by a solution process on the SiC seed crystal.

13. The method of claim 12 , further comprising the step of bulk growing a fourth SiC single crystal on a face of the solution-grown third SiC single crystal by the sublimation process or the gas process.

14. The production method of claim 10 , wherein the growth rate of the first SiC single crystal grown by a solution process is 100 μm/hr or more.

Assignees

• Shinetsu Chemical Co

Inventors

• Yamagata Norio
• Shinya Naofumi
• Hamaguchi Yu
• Tsumori Toshihiro
• Minowa Takehisa

Classifications

• C30B35/002

  Crucibles or containers · CPC title

• C30B25/10

  Heating of the reaction chamber or the substrate · CPC title

• C30B23/066

  Heating of the material to be evaporated · CPC title

• C30B25/20

  the substrate being of the same materials as the epitaxial layer · CPC title

• C30B23/025

  characterised by the substrate · CPC title