Thermal module for a sample processing assembly

Patent metadata

Field	Value
Publication number	US-12241817-B2
Application number	US-202017094462-A
Country	US
Kind code	B2
Filing date	Nov 10, 2020
Priority date	Dec 3, 2012
Publication date	Mar 4, 2025
Grant date	Mar 4, 2025

Abstract

A thermal system for controllably altering a temperature within a reaction chamber in a sample processing assembly is described. The reaction chamber is bounded by a substrate and cover member in the sample processing assembly. The thermal system includes at least one thermal generator for generating temperature changes, one or more transfer layers for transferring temperature changes between the thermal generator and the sample on the substrate and a fluid isolator for isolating the thermal generator from fluid dispensed into the reaction chamber.

First claim

The invention claimed is:

1. A sample processing assembly comprising:
a thermal generator for generating temperature changes;
a transfer layer configured to transfer temperature changes away from the thermal generator and towards a closure body; and
the closure body which is attached to the transfer layer and is configured to pivot around the transfer layer and to form a reaction chamber by inner portions of the closure body fitting portions of the transfer layer facing away from the thermal generator,
wherein at least a periphery of the transfer layer has an edge profile having a tortuous path formed of at least one passage configured to direct fluid away from the thermal generator.

2. The sample processing assembly according to claim 1 , wherein the thermal generator is at least one of:
a Peltier;
a ceramic heater
a heatable rod
a heatable cartridge; and
a heatable resistive film.

3. The sample processing assembly according to claim 1 , further comprising a fluid isolator including a sealing member between the transfer layer and the thermal generator, the sealing member being configured to substantially preclude fluid ingress into the thermal generator.

4. The sample processing assembly according to claim 3 , wherein the fluid isolator includes the sealing member disposed around a periphery of the transfer layer while permitting contact between the transfer layer and the thermal generator.

5. The sample processing assembly according to claim 1 , wherein a sealing member is disposed around and cooperates with the edge profile of the periphery of the transfer layer.

6. The sample processing assembly according to claim 1 , further comprising a fluid impermeable encapsulation layer disposed around the thermal generator.

7. The sample processing assembly according to claim 1 , further including a thermal exchanger, where in the thermal exchanger comprises any of:
a heat sink;
a fluid-flow cooling system;
a refrigerated cooling system;
and a fan.

8. The sample processing assembly according to claim 1 , further including one or more sensors for determining a temperature within the reaction chamber.

9. The sample processing assembly according to claim 8 , wherein at least one sensor is adapted to be disposed on or in the reaction chamber.

10. The sample processing assembly according to claim 8 , wherein at least one sensor is adapted to be disposed on or in the transfer layer.

11. The sample processing assembly according to claim 10 , wherein at least one sensor is disposed in one or more locations selected from a group including the following and such that fluid contact with the sensor is substantially precluded:
within the transfer layer; within the thermal generator;
between the transfer layer and the thermal generator;
and within a thermal exchanger included in the system.

12. The sample processing assembly according to claim 8 , wherein the sensor is used to determine the temperature indirectly, using one or more parameters selected from a group including resistance and current trace.

13. The sample processing assembly according to claim 8 , wherein the thermal generator includes a heatable resistive film, and the sensor is incorporated into the heatable resistive film.

14. The sample processing assembly according to claim 1 , wherein the thermal generator includes a Peltier which includes an array of semiconductor couples, wherein during heating the Peltier is adapted to generate higher temperatures towards its outer edges.

15. The sample processing assembly according to claim 14 , wherein the Peltier is configured with larger semiconductor couples towards its outer edges.

16. The sample processing assembly according to claim 1 wherein the at least one thermal generator includes a Peltier which includes an array of semiconductor couples sandwiched between a pair of ceramic plates, wherein at least one of the ceramic plates includes an array of stress-relieving features.

17. The sample processing assembly according to claim 16 wherein the stress relieving features are cross-hatchings provided in a surface of a ceramic plate facing away from the semiconductor couples.

18. The sample processing assembly according to claim 17 wherein the cross-hatchings are cuts formed through an entire thickness of the ceramic plate facing away from the semiconductor couples.

19. The sample processing assembly according to claim 1 , including a control interface adapted to communicatively couple the thermal generator with a controller adapted to control temperature changes generated by the thermal generator.

20. The sample processing assembly according to claim 1 , wherein the transfer layer includes one or more expansion structures causing one or more edge portions of the transfer layer to heat faster than a centre portion thereof.

21. The sample processing assembly according to claim 20 , wherein the one or more expansion structures are selected from a group including a void, channel, rut or opening.

22. The sample processing assembly according to claim 1 wherein the at least one thermal generator includes a self-regulating resistive heater, wherein changes in resistivity are indicative of a sample temperature and directly control power delivered to the heater to achieve a required temperature set point.

23. The sample processing assembly according to claim 1 , wherein the transfer layer includes an opening couplable with a fluid flow path facilitating fluid transfer between the opening and a fluid source.

24. The sample processing assembly according to claim 1 , including one or more first guide means disposed on the transfer layer and configured to limit movement of a substrate in at least a first direction during placement of a substrate on the transfer layer.

25. The sample processing assembly according to claim 24 , including one or more second guide means on disposed on the transfer layer and configured to limit movement of a substrate in at least a second direction, different to the first direction, during placement of a substrate on the transfer layer.

26. The sample processing assembly according to claim 1 , wherein at least the thermal generator and the transfer layer are incorporated into a thermal module, wherein the thermal module is one of a plurality of thermal modules, and wherein each of the plurality of thermal modules is adapted for use with individual ones of a plurality of sample processing assemblies, including the sample processing assembly, provided in a sample processing instrument which is controllable to process samples disposed on individual substrates located in individual ones of said sample processing assemblies.

27. The sample processing assembly according to claim 26 , wherein operation of each thermal module is individually controllable by a controller controlling operation of the instrument.

28. The sample processing assembly according to claim 26 , wherein a thermal module adapted for use with an individual one of said sample processing assemblies is interchangeable independently of other thermal modules provided in the instrument.

29. The sample processing assembly according to claim 1 , wherein a plurality of components in the thermal system are disposed in a layered construction which is readily dis-assemblable and re-assemblable to interchange parts thereof.

30. The sample proc

Assignees

• Leica Biosystems Melbourne Pty

Inventors

• Toogood Peter
• Ng Kenneth Heng-Chong
• Favaloro Anthony
• Bagnato Stephen John
• Boyes Gregory William

Classifications

• G01N1/30

  Staining; Impregnating {; Fixation; Dehydration; Multistep processes for preparing samples of tissue, cell or nucleic acid material and the like for analysis} · CPC title

• B01L2300/18

  Means for temperature control · CPC title

• B01L7/00

  Heating or cooling apparatus (autoclaves B01J3/04); Heat insulating devices · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title