Thermal module for a sample processing assembly

Patent metadata

Field	Value
Publication number	US-10876936-B2
Application number	US-201314648544-A
Country	US
Kind code	B2
Filing date	Dec 3, 2013
Priority date	Dec 3, 2012
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A thermal system for controllably altering a temperature within a reaction chamber in a sample processing assembly is described. The reaction chamber is bounded by a substrate and cover member in the sample processing assembly. The thermal system includes at least one thermal generator for generating temperature changes, one or more transfer layers for transferring temperature changes between the thermal generator and the sample on the substrate and a fluid isolator for isolating the thermal generator from fluid dispensed into the reaction chamber.

First claim

The claims defining the invention are as follows:

1. A thermal system for controllably altering a temperature within a reaction chamber in a sample processing assembly, wherein the reaction chamber is bounded by a substrate and cover member in the sample processing assembly, the thermal system including:
at least one thermal generator for generating temperature changes;
one or more transfer layers for transferring temperature changes between the thermal generator and the sample on the substrate, the one or more transfer layers being disposed between the thermal generator and the reaction chamber and including a fluid isolator for isolating the thermal generator from excess fluid dispensed into the reaction chamber, the fluid isolator having a plurality of grooves therein in which the excess fluid is received,
wherein the plurality of grooves are between the thermal generator and the substrate.

2. A thermal system according to claim 1 , wherein the at least one thermal generator is selected from a group including but not limited to:
a Peltier;
a ceramic heater;
a heatable rod
a heatable cartridge; and
a heatable resistive film.

3. A thermal system according to claim 1 , wherein the fluid isolator includes a sealing member between the transfer layer and the thermal generator, the sealing member being configured to substantially preclude fluid ingress into the thermal generator.

4. A thermal system according to claim 1 , wherein the fluid isolator includes a fluid impermeable sealing member disposed around a periphery of the transfer layer while permitting contact between the transfer layer and the thermal generator.

5. A thermal system according to claim 4 , wherein at least a periphery of the transfer layer has an edge profile shaped to form at least one passage between the grooves and configured to direct fluid away from the thermal generator.

6. A thermal system according to claim 5 , wherein a sealing member is disposed around and cooperates with the edge profile of the periphery of the transfer layer.

7. A thermal system according to claim 1 , further comprising a fluid impermeable encapsulation layer disposed around the thermal generator.

8. A thermal system according to claim 1 , further including a thermal exchanger, where in the thermal exchanger is selected from a group including one or more of:
a heat sink;
a fluid-flow cooling system;
a refrigerated cooling system; and
a fan.

9. A thermal system according to claim 1 , further including one or more sensors for determining a temperature within the reaction chamber.

10. A thermal system according to claim 9 , wherein at least one sensor is adapted to be disposed on or in the reaction chamber.

11. A thermal system according to claim 9 , wherein at least one sensor is adapted to be disposed on or in the transfer layer.

12. A thermal system according to claim 11 , wherein at least one sensor is disposed in one or more locations selected from a group including the following and such that fluid contact with the sensor is substantially precluded:
within the transfer layer;
within the thermal generator;
between the transfer layer and the thermal generator; and
within a thermal exchanger included in the system.

13. A thermal system according to claim 9 , wherein the sensor is used to determine the temperature indirectly, using one or more parameters selected from a group including resistance and current trace.

14. A thermal system according to claim 9 , wherein the thermal generator includes a heatable resistive film, and the sensor is incorporated into the heatable resistive film.

15. A thermal system according to claim 1 , wherein the at least one thermal generator includes a Peltier which includes an array of semiconductor couples, wherein during heating the Peltier is adapted to generate higher temperatures towards its outer edges.

16. A thermal system according to claim 15 , wherein the Peltier is configured with larger semiconductor couples towards its outer edges.

17. A thermal system according to claim 1 wherein the at least one thermal generator includes a Peltier which includes an array of semiconductor couples sandwiched between a pair of ceramic plates, wherein at least one of the ceramic plates includes an array of stress-relieving features.

18. A thermal system according to claim 17 wherein the stress relieving features are cross-hatchings provided in a surface of a ceramic plate facing away from the semiconductor couples.

19. A thermal system according to claim 18 wherein the cross-hatchings are cuts formed through an entire thickness of the ceramic plate facing away from the semiconductor couples.

20. A thermal system according to claim 1 , including a control interface adapted to communicatively couple the thermal generator with a controller adapted to control temperature changes generated by the thermal generator.

21. A thermal system according to claim 1 , wherein the transfer layer includes one or more recesses adapted to be arranged substantially co-linearly with at least part of an interior wall of a cover member when retained by the sample processing assembly in a closed configuration, the one or more recesses facilitating cleaning of reagent from at least part of the cover member interior wall.

22. A thermal system according to claim 1 , wherein the transfer layer includes one or more expansion structures causing one or more edge portions of the transfer layer to heat faster than a centre portion thereof.

23. A thermal system according to claim 22 , wherein the one or more expansion structures are selected from a group including a void, channel, rut or opening.

24. A thermal system according to claim 1 wherein the at least one thermal generator includes a self-regulating resistive heater, wherein changes in resistivity are indicative of a sample temperature and directly control power delivered to the heater to achieve a required temperature set point.

25. A thermal system according to claim 1 , wherein the transfer layer includes an opening couplable with a fluid flow path facilitating fluid transfer between the opening and a fluid source.

26. A thermal system according to claim 1 , including one or more first guide means disposed on the transfer layer and configured to limit movement of a substrate in at least a first direction during placement of a substrate on the transfer layer.

27. A thermal system according to claim 26 , including one or more second guide means on disposed on the transfer layer and configured to limit movement of a substrate in at least a second direction, different to the first direction, during placement of a substrate on the transfer layer.

28. A thermal system according to claim 1 , wherein at least the thermal generator and the transfer layer are incorporated into a thermal module, and wherein each of a plurality of thermal modules is adapted for use with individual ones of a plurality of sample processing assemblies provided in a sample processing instrument which is controllable to process samples disposed on individual substrates located in individual ones of said sample processing assemblies.

29. A thermal system according to claim 28 , wherein operation of each thermal module is individually controllable by a controller controlling operation of the instrument.

30. A thermal system according to

Assignees

• Leica Biosystems Melbourne Pty

Inventors

• Toogood Peter
• Ng Kenneth Heng-Chong
• Favaloro Anthony
• Bagnato Stephen John
• Boyes Gregory William

Classifications

• G01N1/44

  Sample treatment involving radiation, e.g. heat · CPC title

• B01L7/52

  with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples · CPC title

• B01L2300/1827

  using resistive heater · CPC title

• B01L2300/1822

  using Peltier elements · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title