On-board cleaning of tooling parts in hybrid bonding tool

Patent metadata

Field	Value
Publication number	US-12237186-B2
Application number	US-202217945910-A
Country	US
Kind code	B2
Filing date	Sep 15, 2022
Priority date	Sep 15, 2022
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

First claim

The invention claimed is:

1. A method of cleaning one or more dirty tools in a multi-chamber processing tool, comprising:
providing one or more dirty tools comprising a nozzle head with a shaft coupled to the nozzle head, the nozzle head having one or more vacuum openings to retain a die against the nozzle head;
providing a holder in a bonding chamber of the multi-chamber processing tool, the holder comprising one or more pins to retain the one or more dirty tools;
placing the one or more dirty tools on the holder in the bonding chamber, wherein the bonding chamber further comprises a first substrate having a plurality of dies and a second substrate, and wherein the bonding chamber is used to bond one or more dies of the plurality of dies to the second substrate;
transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool via a transfer robot disposed in the multi-chamber processing tool;
cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools;
inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and
transferring the one or more cleaned tools from the inspection chamber to the bonding chamber via the transfer robot.

2. The method of claim 1 , wherein the holder is transferred from the bonding chamber to the cleaning chamber via a transfer chamber of the multi-chamber processing tool, wherein the transfer chamber is coupled to the bonding chamber, the cleaning chamber, and the inspection chamber.

3. The method of claim 1 , further comprising drying the one or more cleaned tools in the multi-chamber processing tool, wherein the drying is performed in a drying chamber separate from the cleaning chamber or wherein the drying is performed via spin drying, blow drying, baking, or vacuum evacuation.

4. The method of claim 1 , wherein the cleaning is performed via a wet clean process, a plasma process, or a mechanical scrubbing process.

5. The method of claim 1 , wherein the one or more dirty tools comprise a plurality of dirty tools.

6. The method of claim 1 , wherein inspecting the one or more cleaned tools includes failing inspection and further comprising:
re-cleaning the one or more cleaned tools to produce a re-cleaned tool.

7. The method of claim 1 , wherein inspecting the one or more cleaned tools is performed via optical or infrared imaging.

8. The method of claim 1 , further comprising performing a post-bonding inspection of the one or more dirty tools prior to placing the one or more dirty tools on the holder.

9. The method of claim 1 , wherein the bonding chamber comprises a spare holder.

10. The method of claim 9 , further comprising placing the one or more cleaned tools on the spare holder after transferring from the inspection chamber.

11. A non-transitory computer readable medium comprising one or more processors, that when executed, perform a method of cleaning a dirty tool in a multi-chamber processing tool, comprising:
providing one or more dirty tools comprising a nozzle head with a shaft coupled to the nozzle head, the nozzle head having one or more vacuum openings to retain a die against the nozzle head;
providing a holder in a bonding chamber of the multi-chamber processing tool, the holder comprising one or more pins to retain the one or more dirty tools;
placing the one or more dirty tools on the holder in the bonding chamber, wherein the bonding chamber further comprises a first substrate having a plurality of dies and a second substrate, and wherein the bonding chamber is used to bond one or more dies of the plurality of dies to the second substrate;
transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool via a transfer robot disposed in the multi-chamber processing tool;
cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools;
inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and
transferring the one or more cleaned tools from the inspection chamber to the bonding chamber via a transfer robot.

12. The non-transitory computer readable medium of claim 11 , further comprising drying the one or more cleaned tools in the multi-chamber processing tool.

13. The non-transitory computer readable medium of claim 11 , wherein the cleaning is performed via a wet clean process, a plasma process, or a mechanical scrubbing process.

14. The non-transitory computer readable medium of claim 12 , wherein drying is performed via spin drying, blow drying, baking, or vacuum evacuation.

Assignees

• Applied Materials Inc

Inventors

• Wang Ruiping
• Wang Ying
• See Guan Huei
• Jupudi Ananthkrishna
• Choragudi Praveen Kumar

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0468 Primary

  comprising a chamber adapted to a particular process · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0456

  in-line arrangement · CPC title