Organic semiconductor element and cmis semiconductor device including the same
US-2015084013-A1 · Mar 26, 2015 · US
US12237141B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12237141-B2 |
| Application number | US-202218694081-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 20, 2022 |
| Priority date | Sep 22, 2021 |
| Publication date | Feb 25, 2025 |
| Grant date | Feb 25, 2025 |
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The purpose of the present invention, relating to lanthanide boride, which is known as a low work function material, is to provide a novel low work function material with low chemical reactivity, in particular a low work function material of which the material surface, after being exposed to atmospheric gases, can be cleaned at a heating temperature lower than in the prior art. The present invention is a laminate containing a lanthanide boride film formed on a substrate, the surface of said film being covered by a thin film, wherein the thin film is a monatomic layer of a hexagonal boron nitride thin film.
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The invention claimed is: 1. A laminate comprising a lanthanoid boride film formed on a substrate, wherein a surface of the lanthanoid boride film is coated with a thin film, and wherein the thin film is a monoatomic layer hexagonal boron nitride thin film. 2. The laminate according to claim 1 , wherein the lanthanoid boride film is a lanthanum hexaboride film. 3. The laminate according to claim 1 , wherein the lanthanoid boride film has a thickness of 1 nm or more and 100 nm or less. 4. The laminate according to claim 1 , wherein a work function of the laminate after being exposed to an ambient gas and then performing vacuum heating at 500° C. or higher and 600° C. or less is approximately the same as a work function of the laminate before being exposed to the ambient gas. 5. An electron source comprising the laminate according to claim 1 . 6. An electronic device comprising the laminate according to claim 1 . 7. A method for producing the laminate according to claim 1 , the method comprising: forming a lanthanoid boride film containing nitrogen on a substrate; and diffusing the nitrogen in the lanthanoid boride film by heating the lanthanoid boride film in a temperature range of higher than 750° C. and lower than 1200° C. in vacuum, reacting the nitrogen with boron atoms contained in the lanthanoid boride film on a surface of the lanthanoid boride film to precipitate a monoatomic layer hexagonal boron nitride thin film on the surface of the lanthanoid boride film, and coating the surface of the lanthanoid boride film with the precipitated monoatomic layer hexagonal boron nitride thin film. 8. The method according to claim 7 , wherein the lanthanoid boride film containing the nitrogen is formed by: using a lanthanoid boride sintered body containing nitrogen as a target; and sputtering the target in an inert gas ambient. 9. The method according to claim 7 , wherein the substrate is a lanthanoid boride single crystal substrate or a SiO 2 substrate including a polycrystalline lanthanoid boride film, and the lanthanoid boride film is formed by irradiating the surface of the substrate with nitrogen radicals. 10. The method according to claim 7 , wherein coating the surface of the lanthanoid boride film with the precipitated monoatomic layer hexagonal boron nitride thin film is performed by heating in vacuum in the range of 1×10 −9 Pa or higher and 1×10 −5 Pa or less for 5 minutes or more and 3 hours or less to diffuse the nitrogen. 11. A method for cleaning a laminate, comprising: exposing the laminate in which a surface of a lanthanoid boride film formed on a substrate is coated with a thin film made of monoatomic layer hexagonal boron nitride to an ambient gas, and then subjecting the laminate contaminated with the ambient gas to vacuum heating at a low temperature of 500° C. or higher and 600° C. or less to clean the laminate. 12. The method for cleaning the laminate according to claim 11 , wherein the lanthanoid boride film is a lanthanum hexaboride film.
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