Multilayer ceramic capacitor

Patent metadata

Field	Value
Publication number	US-12237111-B2
Application number	US-202318509396-A
Country	US
Kind code	B2
Filing date	Nov 15, 2023
Priority date	May 18, 2021
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers, and two interposers on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction, the interposers including bonding surfaces bondable to the one surface of the capacitor main body and including inner edge portions which are opposite to each other and each having a length longer than a length in a width direction of the multilayer body.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers laminated therein, two main surfaces opposed to each other in a lamination direction, two side surfaces opposed to each other in a width direction intersecting the lamination direction, and two end surfaces opposed to each other in a length direction intersecting the lamination direction and the width direction, the external electrodes being each provided on a corresponding one of the two end surfaces and connected to the internal electrode layers; and
a pair of interposers provided on one surface among the two main surfaces and the two side surfaces of the capacitor main body, and spaced apart from and opposed to each other in the length direction; wherein
the pair of interposers each include a bonding surface to be bonded to the capacitor main body; and
the bonding surface included in each of surfaces of the pair of interposers which are opposed to each other includes an inner edge portion having a length longer than a length of the multilayer body in the width direction.

2. The multilayer ceramic capacitor according to claim 1 , wherein the inner edge portion of the bonding surface includes a curved portion.

3. The multilayer ceramic capacitor according to claim 1 , wherein the inner edge portion of each of the pair of interposers has a line symmetrical shape with respect to a straight line passing through a center in the length direction and extending in the width direction, as seen from a plane extending in the width direction and the length direction.

4. The multilayer ceramic capacitor according to claim 1 claim 2 , wherein the inner edge portion of each of the pair of interposers has a line symmetrical shape with respect to a straight line passing through a center in the length direction and extending in the width direction, as seen from a plane extending in the width direction and the length direction.

5. The multilayer ceramic capacitor according to claim 1 , wherein when defining a length of the multilayer body as L, and defining a difference between a longest portion and a shortest portion in the length direction of the bonding surface as L 1 , L×0.05≤L 1 ≤L×0.40 is satisfied.

6. The multilayer ceramic capacitor according to claim 1 , wherein a relationship between a length L 2 of a shortest portion and a length L 3 of a longest portion in the length direction of the bonding surface is L 2 ×1.10≤L 3 ≤L 2 ×1.40.

7. The multilayer ceramic capacitor according to claim 1 , wherein when defining a width in the width direction of the multilayer body as W, the length of the inner edge portion is about 1.1 W or more and about 2 W or less.

Assignees

• Murata Manufacturing Co

Inventors

• Kimura Masato

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title