Multilayer ceramic capacitor

Patent metadata

Field	Value
Publication number	US-11848155-B2
Application number	US-202217739550-A
Country	US
Kind code	B2
Filing date	May 9, 2022
Priority date	May 18, 2021
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers, and two interposers on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction, the interposers including bonding surfaces bondable to the one surface of the capacitor main body and including inner edge portions which are opposite to each other and each having a length longer than a length in a width direction of the multilayer body.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers; and
two interposers provided on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction;
the two interposers including bonding surfaces to be bonded to the one surface of the capacitor main body, the bonding surfaces including inner edge portions which are opposite to each other, the inner edge portions each having a length longer than a length in a width direction of the multilayer body.

2. The multilayer ceramic capacitor according to claim 1 , wherein the inner edge portion of each of the bonding surfaces is curved in a recessed shape.

3. The multilayer ceramic capacitor according to claim 1 , wherein the inner edge portion of each of the bonding surfaces is curved convexly.

4. The multilayer ceramic capacitor according to claim 1 , wherein
the inner edge portion of each of the bonding surfaces includes at least one convex portion and at least one recessed portion; and
at least one of the convex portion or the recessed portion is provided in a plurality.

5. The multilayer ceramic capacitor according to claim 1 , wherein the bonding surfaces of the two interposers have a line symmetrical shape with respect to a straight line passing through a center in the length direction and extending in the width direction, as seen from a plane extending in the width direction and the length direction.

6. The multilayer ceramic capacitor according to claim 1 , wherein the bonding surfaces of the two interposers have a line symmetrical shape with respect to a straight line passing through a center in the width direction and extending in the length direction, as seen from a plane extending in the width direction and the length direction.

7. The multilayer ceramic capacitor according to claim 1 , wherein when defining a length of the multilayer body as L, and defining a difference between a longest portion and a shortest portion in the length direction of the bonding surface as L 1 , L×0.05≤L 1 ≤L×0.40 is satisfied.

8. The multilayer ceramic capacitor according to claim 1 , wherein a relationship between a length L 2 of the shortest portion and a length L 3 of the longest portion in the length direction of the bonding surface is L 2 ×1.10≤L 3 ≤L 2 ×1.40.

9. The multilayer ceramic capacitor according to claim 1 , wherein when defining a width in the width direction of the multilayer body as W, the length of the inner edge portion is about 1.1W or more and about 2W or less.

10. The multilayer ceramic capacitor according to claim 1 , wherein the multilayer ceramic capacitor has a substantially rectangular parallelepiped shape.

11. The multilayer ceramic capacitor according to claim 1 , wherein the multilayer body has a dimension of about 0.2 mm or more and about 10 mm or less in the length direction, a dimension of about 0.1 mm or more and about 10 mm or less in the width direction, and a dimension of about 0.1 mm or more and about 5 mm or less in the stacking direction.

12. The multilayer ceramic capacitor according to claim 1 , wherein the multilayer body includes side gap portions on both sides thereof.

13. The multilayer ceramic capacitor according to claim 1 , wherein the two interposers have a same shape.

14. The multilayer ceramic capacitor according to claim 1 , wherein at least one of the two interposers includes an intermetallic compound and a single Sn metal.

15. The multilayer ceramic capacitor according to claim 1 , wherein at least one of the two interposers has a constant or substantially constant cross-sectional shape.

16. The multilayer ceramic capacitor according to claim 1 , wherein one of the external electrodes is exposed from one of the inner edge portions of one of the bonding surfaces.

17. The multilayer ceramic capacitor according to claim 1 , wherein a length of the inner edge portion of one of the interposers is longer than a width of the multilayer body.

18. The multilayer ceramic capacitor according to claim 3 , wherein a length of a central portion in the width direction in the inner edge portion is longest and a length of side regions in the width direction in the inner edge portion is shortest.

19. The multilayer ceramic capacitor according to claim 2 , wherein a length of a central portion in the width direction in the inner edge portion is shortest and a length of side regions in the width direction in the inner edge portion is longest.

20. The multilayer ceramic capacitor according to claim 1 , wherein the inner edge portion of at least one of the two interposers includes recessed portions and convex portions.

Assignees

• Murata Manufacturing Co

Inventors

• Kimura Masato

Classifications

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/06

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title