Optical sensor, and method for manufacturing optical sensor

Patent metadata

Field	Value
Publication number	US-12230618-B2
Application number	US-202017636258-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Aug 23, 2019
Publication date	Feb 18, 2025
Grant date	Feb 18, 2025

Abstract

An optical sensor includes a substrate including a substrate main surface intersecting a thickness-wise direction, a light emitting element disposed on the substrate main surface, a light receiving element disposed on the substrate main surface, a transparent first cover disposed on the substrate main surface to cover the light emitting element, and a transparent second cover disposed on the substrate main surface to cover the light receiving element. The first cover and the second cover are spaced apart by a gap.

First claim

The invention claimed is:

1. An optical sensor, comprising:
a substrate including a substrate main surface intersecting a thickness-wise direction;
a light emitting element disposed on the substrate main surface;
a light receiving element disposed on the substrate main surface;
a transparent first cover disposed on the substrate main surface to cover the light emitting element; and
a transparent second cover disposed on the substrate main surface to cover the light receiving element; wherein
the first cover and the second cover are spaced apart by a gap,
the first cover includes a first upper surface intersecting the thickness-wise direction and first side surfaces intersecting the first upper surface,
the second cover includes a second upper surface intersecting the thickness-wise direction and second side surfaces intersecting the second upper surface,
the first side surfaces include a first inner side surface that faces the gap and a first outer side surface that does not face the gap,
the second side surfaces include a second inner side surface that faces the gap and a second outer side surface that does not face the gap, and
the first inner side surface has a greater roughness than the first upper surface.

2. The optical sensor according to claim 1 , wherein
the first cover includes a corner at which the first upper surface and the first inner side surface are joined, and
the corner of the first cover includes a first inclined surface intersecting the first upper surface and the first inner side surface.

3. The optical sensor according to claim 1 , wherein
the second cover includes a corner at which the second upper surface and the second inner side surface are joined, and
the corner of the second cover includes a second inclined surface intersecting the second upper surface and the second inner side surface.

4. The optical sensor according to claim 1 , wherein
the substrate includes a substrate side surface, and
the first outer side surface and the second outer side surface are flush with the substrate side surface in the thickness-wise direction.

5. The optical sensor according to claim 1 , wherein the second outer side surface has a greater roughness than the second upper surface.

6. The optical sensor according to claim 1 , further comprising a light-blocking ink filling the gap.

7. The optical sensor according to claim 1 , wherein the gap is filled with air.

8. The optical sensor according to claim 1 , wherein an upper surface of the light emitting element and an upper surface of the light receiving element are located at different positions in the thickness-wise direction.

9. The optical sensor according to claim 8 , wherein in the thickness-wise direction, a length from the substrate main surface to the upper surface of the light emitting element is less than a length from the substrate main surface to the upper surface of the light receiving element.

10. The optical sensor according to claim 1 , wherein the first upper surface and the second upper surface are coplanar with each other.

11. The optical sensor according to claim 1 , further comprising a first Fresnel lens disposed on the first upper surface.

12. The optical sensor according to claim 1 , further comprising a second Fresnel lens disposed on the second upper surface.

13. The optical sensor according to claim 1 , wherein
the first cover and the second cover oppose each other at opposite sides of the gap,
in plan view in the thickness-wise direction, the gap extends in a direction orthogonal to an opposing direction of the first cover and the second cover, and
in plan view in the thickness-wise direction, the light emitting element and the light receiving element are located at different positions in a direction in which the gap extends.

14. The optical sensor according to claim 1 , wherein the substrate main surface includes a portion that faces the gap and a groove that is recessed from the portion in the thickness-wise direction.

15. The optical sensor according to claim 14 , wherein
the substrate main surface includes a first region and a second region separated by the groove,
the light emitting element is disposed in the first region,
the light receiving element is disposed in the second region,
the first cover is disposed in the first region to cover the light emitting element, the second cover is disposed in the second region to cover the light receiving element, and
in plan view in the thickness-wise direction, the light receiving element is greater in size than the light emitting element, and the second region is greater in size than the first region.

16. An optical sensor, comprising:
a substrate including a substrate main surface intersecting a thickness-wise direction;
a light emitting element disposed on the substrate main surface;
a light receiving element disposed on the substrate main surface;
a transparent first cover disposed on the substrate main surface to cover the light emitting element; and
a transparent second cover disposed on the substrate main surface to cover the light receiving element; wherein
the first cover and the second cover are spaced apart by a gap,
the first cover includes a first upper surface intersecting the thickness-wise direction and first side surfaces intersecting the first upper surface,
the second cover includes a second upper surface intersecting the thickness-wise direction and second side surfaces intersecting the second upper surface,
the first side surfaces include a first inner side surface that faces the gap and a first outer side surface that does not face the gap,
the second side surfaces include a second inner side surface that faces the gap and a second outer side surface that does not face the gap, and
the second inner side surface has a greater roughness than the second upper surface.

17. An optical sensor, comprising:
a substrate including a substrate main surface intersecting a thickness-wise direction;
a light emitting element disposed on the substrate main surface;
a light receiving element disposed on the substrate main surface;
a transparent first cover disposed on the substrate main surface to cover the light emitting element; and
a transparent second cover disposed on the substrate main surface to cover the light receiving element; wherein
the first cover and the second cover are spaced apart by a gap,
the first cover includes a first upper surface intersecting the thickness-wise direction and first side surfaces intersecting the first upper surface,
the second cover includes a second upper surface intersecting the thickness-wise direction and second side surfaces intersecting the second upper surface,
the first side surfaces include a first inner side surface that faces the gap and a first outer side surface that does not face the gap,
the second side surfaces include a second inner side surface that faces the gap and a second outer side surface that does not face the gap, and
the first outer side surface has a greater roughness than the first upper surface.

Assignees

• Rohm Co Ltd

Inventors

• Hasegawa Yuya
• Masaki Takaaki

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/851

  Dispositions of multiple connectors or interconnections · CPC title