Substrate treating apparatus and substrate treating method

Patent metadata

Field	Value
Publication number	US-12230516-B2
Application number	US-202117515737-A
Country	US
Kind code	B2
Filing date	Nov 1, 2021
Priority date	Nov 2, 2020
Publication date	Feb 18, 2025
Grant date	Feb 18, 2025

Abstract

The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a process chamber having a first body and a second body which are combined with each other to have a treatment space therein;
a support unit located inside the treatment space and supporting a substrate;
a heating unit configured to heat the substrate placed on the support unit;
a driver configured to move any one of the first body and the second body to move the first body and the second body between a process location and an open location;
an interval state detection unit configured to detect an interval state between a side wall of the first body and a side wall of the second body when the first body and the second body are placed in the process location; and
a controller configured to control the driver and the interval state detection unit,
wherein the interval state detection unit includes:
a pressure provision line configured to provide a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body; and
a pressure measurement member configured to measure a change in a pressure of the pressure provision line, and
wherein the controller determines whether or not the interval state is defective on the basis of the pressure measured by the pressure measurement member.

2. The substrate treating apparatus of claim 1 , wherein when it is determined that the interval state is defective, the controller controls the driver and the interval state detection unit so that the first body or the second body is moved.

3. The substrate treating apparatus of claim 1 , wherein the pressure provision line includes:
a main line connected to a pressure supply source; and
a branch line branched off from the main line and connecting the main line and a fluid hole provided in the side wall of the first body.

4. The substrate treating apparatus of claim 3 , wherein pressures of fluids flowing in the branch lines are the same.

5. The substrate treating apparatus of claim 3 , wherein the pressure supply source supplies a fluid to the main line.

6. The substrate treating apparatus of claim 5 , wherein the interval state detection unit sprays the fluid in a vertical direction toward a surface on which the side walls of the first body and the second body face each other.

7. The substrate treating apparatus of claim 3 , wherein the pressure supply source is a pressure reduction member.

8. The substrate treating apparatus of claim 3 , wherein the interval state detection unit further includes an interval detection plate installed on a surface, facing the side wall of the second body, of the side wall of the first body,
wherein the pressure provision line provides the positive pressure or the negative pressure between the side wall of the first body and the side wall of the second body through a fluid hole formed in the interval detection plate.

9. The substrate treating apparatus of claim 8 , wherein a thickness of the interval detection plate is the same as an interval between the side wall of the first body and the side wall of the second body facing each other in the process location.

10. The substrate treating apparatus of claim 8 , wherein a plurality of interval detection plates are provided along the side wall of the first body.

11. The substrate treating apparatus of claim 1 , wherein the pressure measurement member includes a differential pressure gauge configured to measure a pressure difference between the pressure provision line and external air.

12. The substrate treating apparatus of claim 1 , wherein the controller controls the driver so that, while the substrate is treated inside the treatment space, an interval between the side wall of the first body and the side wall of the second body is maintained in a preset interval.

13. The substrate treating apparatus of claim 12 , further comprising:
a gas supply unit configured to form a gas curtain by spraying gas to the first body or the second body toward facing side surfaces of the first body and the second body,
wherein the gas supply unit includes:
a plurality of gas supply holes formed in a side surface of the first body or the second body; and
a gas supply line connected to a gas supply source and configured to supply the gas to the gas supply holes.

14. The substrate treating apparatus of claim 12 , wherein the treating of the substrate is bake treatment.

15. A substrate treating apparatus comprising:
a process chamber having an upper body and a lower body which are combined with each other to have a treatment space therein in which bake treatment is performed on a substrate;
a support unit located inside the treatment space and supporting the substrate;
a heating unit configured to heat the substrate placed on the support unit;
a driver configured to move any one of the upper body and the lower body to move the upper body and the lower body between a process location and an open location;
an interval state detection unit configured to detect an interval state between a side wall of the upper body and a side wall of the lower body when the upper body and the lower body are placed on the process location; and
a controller configured to control the driver and the interval state detection unit,
wherein the interval state detection unit includes:
a pressure provision line configured to provide a fluid in a vertical direction toward a surface on which the side wall of the upper body and the side wall of the lower body face each other; and
a pressure measurement member configured to measure a change in a pressure of the pressure provision line,
wherein the pressure provision line includes:
a main line connected to a pressure supply source; and
a branch line branched off from the main line and connecting the main line and a fluid hole formed in the side wall of the upper body,
wherein the pressure measurement member measures a change in a pressure of the branch line,
wherein the interval state detection unit further includes:
an interval detection plate installed on a surface, facing the side wall of the lower body, of the side wall of the upper body,
wherein the pressure provision line provides the fluid between the side wall of the upper body and the side wall of the lower body through a fluid hole formed in the interval detection plate,
wherein a thickness of the interval detection plate is provided to be the same as an interval between the side wall of the upper body and the side wall of the lower body facing each other in the process location,
wherein the controller controls the driver and the interval state detection unit so that, while the substrate is treated inside the treatment space, an interval between the upper body and the lower body is maintained in a preset interval, and so that an interval state is determined on the basis of the pressure measured by the pressure measurement member, and when it is determined that the interval state is defective, the upper body or the lower body is moved.

Assignees

• Semes Co Ltd

Inventors

• Bang Jae Oh
• An Young Seo
• Lee Seung Han
• Lee Seung Hwan
• Kim Hyun Min

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title